Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
AGL125V2-FGG144	Microchip Technology	FPGA	Other	Ball	144	LBGA	Square		Plastic/Epoxy	3072	Yes	1.575 V		CMOS		97	125000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	85 °C (185 °F)		125000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AGL600V2-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
AGL600V5-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
AGLN020V2-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square				Yes	1.575 V	520	CMOS			20000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	85 °C (185 °F)		520 CLBS, 20000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
AGLN060V2-CSG81I	Microchip Technology	FPGA	Industrial	Ball	81	VFBGA	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	.8 mm	5 mm	No		e1		30 s		260 °C (500 °F)	5 mm
AGLN060V2-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
AGLN125V2-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
APA600-BG456	Microchip Technology	FPGA	Commercial	Ball	456	BGA	Square		Plastic/Epoxy	21504	Yes	2.7 V		CMOS		356	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA456,26X26,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B456	3	2.54 mm	35 mm	No			180 MHz		356		35 mm
APA600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	21504	Yes	2.7 V		CMOS		370	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e1	180 MHz	30 s	370	250 °C (482 °F)	25 mm
AX250-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	250000 system gates avaiable	e0	763 MHz		248		29.21 mm
AX250-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	LBGA	Square		Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	250000 system gates avaiable	e1	649 MHz	30 s	248	250 °C (482 °F)	17 mm
AX500-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	500000 system gates avaiable	e0	763 MHz		336		29.21 mm
EX64-TQ64	Microchip Technology	FPGA		Gull Wing	64	LFQFP	Square		Plastic/Epoxy		Yes	2.7 V	128	CMOS		41	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	70 °C (158 °F)	1 ns	128 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G64		1.6 mm	10 mm		2000 typical gates available		250 MHz		41		10 mm
M1A3P400-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1A3P400-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square		Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M1A3P400-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
M1A3P600-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M1A3P600-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
M1A3PE3000-2FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B324	3	1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
M1A3PE3000-FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B324	3	1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
M1A3PE3000L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
M1AGL1000V2-FGG144	Microchip Technology	FPGA	Other	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V		CMOS		97	1000000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	85 °C (185 °F)		1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
M1AGL600V2-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
M2GL005S-1VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square		Plastic/Epoxy	6060	Yes	1.26 V		CMOS		171		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.51 mm	17 mm	No				20 s	171	240 °C (464 °F)	17 mm
M2GL025-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL025TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm	No				20 s	180	240 °C (464 °F)	11 mm
M2GL050T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL060T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0					23 mm
M2GL060T-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060TS-1VFG400T2	Microchip Technology	FPGA	Automotive									1.26 V						1.2	Tray					1.14 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)						17 mm								17 mm
M2S005-1VFG256	Microchip Technology	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	6060	Yes	1.26 V				161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.56 mm	14 mm					40 s	161	250 °C (482 °F)	14 mm
M2S005-VFG256	Microchip Technology	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	6060	Yes	1.26 V				161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.56 mm	14 mm					40 s	161	250 °C (482 °F)	14 mm
M2S010T-1FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	12084	Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	233	250 °C (482 °F)	23 mm
M2S010TS-1FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	12084	Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	233	240 °C (464 °F)	23 mm
M2S090T-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF100TL-FCVG484I	Microchip Technology	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy		Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF100TS-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square		Plastic/Epoxy		Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF200T-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	192000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF200T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square		Plastic/Epoxy	192000	Yes	1.03 V		CMOS		364		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				364		29 mm
MPF300T-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
RTAX2000SL-1CQ352E	Microchip Technology	FPGA	Military	Flat	352	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS		684	2000000	1.5		1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTSX32SUCQ84B	Microchip Technology	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5		2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
A2F500M3G-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	LBGA	Square		Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS		66	500000	1.5		1.5,1.8,2.5,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		11520 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1	80 MHz	30 s	66	250 °C (482 °F)	17 mm
A3P030-QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square				Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
A3P030-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	768	CMOS			30000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz				14 mm
A3P1000-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	17 mm
A3P1000-FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		300	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0			300		23 mm
A3P1000L-1FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		177	1000000	1.2		1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s	177	250 °C (482 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.