Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
AX250-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	2816 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	250000 system gates avaiable	e0	649 MHz		248		27 mm
EX128-TQG64I	Microchip Technology	FPGA	Industrial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	256	CMOS		46	6000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	85 °C (185 °F)		256 CLBS, 6000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.6 mm	10 mm		4000 typical gates available	e3		30 s	46	260 °C (500 °F)	10 mm
EX64-PTQ100	Microchip Technology	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	128	CMOS		56	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20		2.3 V	.5 mm	70 °C (158 °F)	0.7 ns	128 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G100		1.6 mm	14 mm		2000 typical gates available		357 MHz		56		14 mm
M1A3P1000-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz				23 mm
M1A3PE1500-FG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		444	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	350 MHz		444		27 mm
M1A3PE1500-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		444	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	350 MHz	30 s	444	250 °C (482 °F)	27 mm
M1A3PE1500-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
M2GL010T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL010T-1FG484MX399	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0		20 s		240 °C (464 °F)	23 mm
M2GL025S-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3		23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2S005-1VF256	Microchip Technology	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6060	Yes	1.26 V				161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.56 mm	14 mm					30 s	161	240 °C (464 °F)	14 mm
M2S010-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	233	250 °C (482 °F)	23 mm
M7A3P1000-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
MPF100T-1FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100TL-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF100TL-FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
MPF100TLS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF100TS-FCVG484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF200TS-1FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		300		1			Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
MPF200TS-FCS325M	Microchip Technology	FPGA	Military	Ball	325	LFBGA	Rectangular	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	R-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		14.5 mm
MPF300TL-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
MPF300TL-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
RT3PE3000L-CG484B	Microchip Technology	FPGA	Military		484	CGA	Square	Ceramic, Metal-Sealed Cofired	75264	No	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	CGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X484		6.19 mm	23 mm	No			250 MHz		341		23 mm
RT3PE3000L-CG484PROTO	Microchip Technology	FPGA			484	CGA	Square	Ceramic, Metal-Sealed Cofired		No	1.575 V	75264	CMOS			3000000	1.2			Grid Array			1.14 V	1 mm			75264 CLBS, 3000000 Gates			Perpendicular	S-CPGA-X484		6.19 mm	23 mm								23 mm
RT4G150-1CG1657PROTO	Microchip Technology	FPGA
A3P1000-2FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
AGL400V5-CSG196	Microchip Technology	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS		143	400000	1.5			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	85 °C (185 °F)		400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No				30 s	143	260 °C (500 °F)	8 mm
AGLN010V2-UCG36I	Microchip Technology	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS			10000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No							3 mm
M1A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M2S060-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M7A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
APA450-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS		100	450000	2.5		2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
APA300-FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	8192	Yes	2.7 V		CMOS		100	300000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	125 °C (257 °F)		300000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	180 MHz	20 s	100	235 °C (455 °F)	13 mm
APA150-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	70 °C (158 °F)		150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
APA075-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS		100	75000	2.5		2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No			180 MHz	30 s	100	260 °C (500 °F)	13 mm
AX2000-FG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS		684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	21504 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz	20 s	684	225 °C (437 °F)	31 mm
A3P1000-1FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
APA300-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8192	Yes	2.7 V		CMOS		158	300000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		300000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
M2S090T-1FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF500TL-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS		388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
A42MX16-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS			24000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	94 MHz				29.3116 mm
A54SX32A-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS		203	48000	2.5		2.5,3.3/5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.25 V	1 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.97 mm	17 mm	No	32000 typical gates available	e0	238 MHz	20 s	203	225 °C (437 °F)	17 mm
M2GL050-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2GL060TS-1FGG484T2	Microchip Technology	FPGA	Automotive								1.26 V						1.2	Tray					1.14 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)						23 mm								23 mm
M2S010-VFG400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	195	250 °C (482 °F)	17 mm
M2S060-FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
A3P1000-1FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.