Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A3P125-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P125-VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3P600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	280	250 °C (482 °F)	23 mm
A3PE3000-1PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
A3PE3000-2FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324		1.78 mm	19 mm	No		e0					19 mm
A3PE3000-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A3PE3000-FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324		1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
A3PE3000L-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
A42MX09-VQG100M	Microchip Technology	FPGA	Military	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tray		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz				14 mm
A54SX32A-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.1 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	278 MHz		174		29.21 mm
AGL125V5-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		97	125000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AGL125V5-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		71	125000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	85 °C (185 °F)		125000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s	71	260 °C (500 °F)	14 mm
AGL125V5-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		71	125000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3			71		14 mm
AGL250V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0		20 s	97	235 °C (455 °F)	13 mm
AGLN020V5-QNG68	Microchip Technology	FPGA	Other	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS			20000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	70 °C (158 °F)		520 CLBS, 20000 Gates	-20 °C (-4 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
AGLN060V2-VQ100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
AGLN125V2-CSG81Y	Microchip Technology	FPGA	Commercial	Ball	81	VFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V	3072	CMOS		60	125000	1.2		1.2/1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		3072 CLBS, 125000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No			160 MHz	30 s	60	260 °C (500 °F)	5 mm
AGLN250V5-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5			Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
AGLP060V5-CSG201I	Microchip Technology	FPGA	Industrial	Ball	201	VFBGA	Square	Plastic/Epoxy	1584	Yes	1.575 V	1584	CMOS		157	60000	1.5	Tray	1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA201,15X15,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		1584 CLBS, 60000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B201	3	.99 mm	8 mm	No			250 MHz	30 s	157	260 °C (500 °F)	8 mm
APA075-TQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS		66	75000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	180 MHz	30 s	66	260 °C (500 °F)	14 mm
APA150-TQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		66	150000	2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	180 MHz	20 s	66	225 °C (437 °F)	14 mm
APA450-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS		158	450000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA600-FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		454	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	180 MHz		454		27 mm
AX2000-1CGS624M	Microchip Technology	FPGA	Military		624	CGA	Square	Ceramic, Metal-Sealed Cofired	32526	Yes	1.575 V	21504	CMOS		418	2000000	1.5	Box		Grid Array			1.425 V		125 °C (257 °F)		21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X624					1060000 typical gates avaialable				418
AX250-2FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.74 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	250000 system gates avaiable	e0	870 MHz		248		27 mm
AX500-FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.99 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	500000 system gates avaiable	e0	649 MHz		336		27 mm
M1A3P1000-1FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
M1A3P1000-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M1A3P250-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1A3PE3000L-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
M1AGL1000V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		97	1000000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M1AGL250V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M2GL005-VF256IX417	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V				161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.56 mm	14 mm						161		14 mm
M2GL010T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL010T-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL025-1VFG256	Microchip Technology	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm								14 mm
M2GL025T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL025T-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2GL025TS-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2GL025TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL060-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm					20 s		240 °C (464 °F)	11 mm
M2GL060-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0					23 mm
M2GL060T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL060TS-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2GL090-FCSG325I	Microchip Technology	FPGA	Industrial		325			Plastic	86316	Yes			CMOS		180		1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			100 °C (212 °F)			-40 °C (-40 °F)				3			No					180
M2GL090T-1FG676	Microchip Technology	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS		425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No					425		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.