Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S500E-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3SD1800A-4CSG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD1800A-4FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
XC3SD3400A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	5968 CLBS, 3400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
XC4VFX20-11FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VFX20-11FFG672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes			CMOS		320			1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1181 MHz	30 s	320	250 °C (482 °F)
XC5VFX70T-2FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	5600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC5VLX110T-1FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC5VSX50T-1FF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	4080 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e0		30 s	360	225 °C (437 °F)	27 mm
XC5VSX95T-2FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes	1.05 V	7360	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	7360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC5VSX95T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes	1.05 V	7360	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	7360 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC6SLX100-3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX150-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		498		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	862 MHz	30 s	498	225 °C (437 °F)	27 mm
XC6SLX16-3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		160		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX75T-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		348		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	348	250 °C (482 °F)	27 mm
XC6SLX9-L1CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS		100		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	100	260 °C (500 °F)	8 mm
XC6VLX240T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX240T-1FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC7A200T-2SB484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			285		1		Grid Array, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0			285		19 mm
XC7A200T-L2FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825	CMOS		400		.9	0.9 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	Also Operates at 1 V supply	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K410T-2FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS		500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1	1286 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7VX485T-2FF1157I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		600		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1156	4			No		e0	1818 MHz		600
XCKU115-2FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XCKU11P-2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCKU15P-1FFVA1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			668		0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			668		0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU5P-1SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XCS05-3VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		77	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e0	125 MHz	30 s	77	240 °C (464 °F)	14 mm
XCVU065-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	600			520		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCVU19P-2FSVA3824E	Xilinx	FPGA																										Tin Silver Copper			4					e1
XCVU27P-L2FSGA2577E	Xilinx	FPGA
XCVU9P-2FLGA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.24 mm	47.5 mm						832		47.5 mm
XQ6SLX150T-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XQ7A200T-1RB676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.35 mm	27 mm	No		e0	1098 MHz	30 s	400	225 °C (437 °F)	27 mm
XQ7A200T-1RS484M	Xilinx	FPGA	Military	Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1	1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484		3.19 mm	19 mm	No		e0	1098 MHz		285		19 mm
XQ7VX330T-2RF1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm			e0			600		35 mm
XQKU115-1RLD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920					.95		Grid Array				1 mm			82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517		4.14 mm	40 mm			e0					40 mm
XQKU115-2RLD1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		82920					.95		Grid Array				1 mm			82920 CLBS		Tin Lead	Bottom	S-PBGA-B1517		4.14 mm	40 mm			e0					40 mm
XA3S1400A-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	AEC-Q100	375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XA3S250E-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
XA7A100T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG		285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XA7S15-1CPGA196Q	Xilinx																														3							30 s		260 °C (500 °F)
XA7S50-1CSGA324I	Xilinx																														3							30 s		260 °C (500 °F)
XC2S150-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	260 °C (500 °F)	17 mm
XC2S150-5PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			144	150000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	263 MHz		140		28 mm
XC2S200-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 200000	e1	263 MHz	30 s	284	250 °C (482 °F)	23 mm
XC2S30-5TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	972	Yes	2.625 V	216			92	30000	2.5	1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	263 MHz	30 s	92	260 °C (500 °F)	20 mm
XC2S30-5VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	972	Yes	2.625 V	216			64	30000	2.5	1.5/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	263 MHz		60		14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.