Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5204-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	5.25 V	120	CMOS			4000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	20 mm
XC4005E-2PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No			125 MHz				42.164 mm
XC6SLX16-1LCPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	500 MHz	30 s		260 °C (500 °F)	8 mm
XC6VLX75T-2FF784M	Xilinx	FPGA																											Tin Lead								e0
DY6035BG432EI	Xilinx	FPGA		Ball	432	BGA	Square		Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256		3.3	3.3 V	Grid Array	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3			No		e0		30 s	256	225 °C (437 °F)
XC5206-5TQ176I	Xilinx	FPGA		Gull Wing	176	LFQFP	Square		Plastic/Epoxy	784	Yes	5.5 V	196	CMOS		148	6000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		4.6 ns	196 CLBS, 6000 Gates		Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	MAX available 10000 Logic gates	e0	83 MHz	30 s	148	225 °C (437 °F)	24 mm
XC7VX485T-L2FF1930E	Xilinx	FPGA		Ball	1924	BGA	Square		Plastic/Epoxy	485760	Yes	1.03 V		CMOS		700		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		700
XC7A75T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square		Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC4002XL-1VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square		Plastic/Epoxy	64	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 1600 Logic gates	e0	200 MHz	30 s	64	240 °C (464 °F)	14 mm
XC3064-50PG132MSPC0108	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		224 CLBS, 6400 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XCS20XL-4VQ100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square		Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates = 20000	e0		30 s	160	240 °C (464 °F)	14 mm
XC2018-100TQ100C	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square		Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.7 mm	14 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz	30 s	74	225 °C (437 °F)	14 mm
XC4005A-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	28 mm
XC3130A-1PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square		Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4VLX100-11FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square		Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS		768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			12288 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XC5215-5BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square		Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.6 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XH4028XLPQPQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes			CMOS				3.3		Flatpack, Fine Pitch				.5 mm					Tin Lead	Quad	S-PQFP-G208		3.92 mm	28 mm	No		e0					28 mm
XC2V6000-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square		Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	1104	225 °C (437 °F)	40 mm
XC5402L-4TQ144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes							3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC3164-3PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy	224	Yes			CMOS		70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s	70	225 °C (437 °F)
XC4052XLA-09BG432I	Xilinx	FPGA		Ball	432	LBGA	Square		Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	227 MHz	30 s	352	225 °C (437 °F)	40 mm
XCS20XL-3PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	400				7000	3.3		Flatpack, Fine Pitch			3 V	.5 mm			400 CLBS, 7000 Gates		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm
XC7VX330T-3FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square		Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		650		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No		e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XCV1000E-6FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square		Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XC3S1000-4PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm
5962-9752501QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1024		MIL-PRF-38535 Class Q		15000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 15000-45000						39.37 mm
XCVU095-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square		Plastic/Epoxy	1176000	Yes	.979 V	768			832		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
5962-9850901QYX	Xilinx	FPGA		Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V			MIL-PRF-38535 Class Q			3.3		Flatpack, Guard Ring			3 V	.635 mm						Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
XC7K420T-1LFFG901E	Xilinx	FPGA		Ball	900				Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1
XC5206L-5PQG100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular		Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 6000-10000	e3					20 mm
XC2VP50-7FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square		Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	5904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	852	225 °C (437 °F)	40 mm
XCVU080-2FFVB1760C	Xilinx	FPGA																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC7K70T-3FB484E	Xilinx	FPGA		Ball	484	BGA	Square		Plastic	65600	Yes			CMOS		185			1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	4			No		e0	1818 MHz	30 s	185	225 °C (437 °F)
XQVR300-4CB228V	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.5/3.3,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XC3090-100PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		144	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz	30 s	144	225 °C (437 °F)	28 mm
XC3090-50PP175C	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square		Plastic/Epoxy	320	No	5.25 V	320	CMOS		144	9000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops	e0	50 MHz		144		42.164 mm
XC4013-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square		Plastic/Epoxy	576	Yes	5.25 V	576	CMOS		192	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	32 mm
XC6SLX4-N3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square		Plastic/Epoxy		Yes	1.26 V	300					1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm			e1		30 s		260 °C (500 °F)	13 mm
XC4006E-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	256	Yes	5.25 V	256	CMOS		128	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	28 mm
XC4003E-1PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 3000 Logic gates	e0	166 MHz	30 s	80	225 °C (437 °F)	20 mm
XH4052XLBG432C	Xilinx	FPGA		Ball	432	HLBGA	Square		Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Heat Sink/Slug, Low Profile				1.27 mm					Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm
XCV200E-8CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square		Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		94	63504	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)	0.4 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	416 MHz	30 s	94	240 °C (464 °F)	12 mm
XA6SLX75T-2FGG484C	Xilinx	FPGA																											Tin Silver Copper			3					e1				250 °C (482 °F)
XC2VP50-8BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square		Plastic/Epoxy		Yes	1.575 V	5648	CMOS				1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XC3190A-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		144	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	227 MHz	30 s	144	225 °C (437 °F)	28 mm
XCVU065-L1FFVC1517C	Xilinx	FPGA																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XCV100E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC3020-100CQ100CSPC0110	Xilinx	FPGA	Commercial	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	100 MHz				17.272 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.