Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
CXC2VP4-5FG456	Xilinx																											Tin Lead			3					e0		30 s		225 °C (437 °F)
XC4020XL-3PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm		1.6 ns	784 CLBS, 13000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 20000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC7A30T-L2FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	33600	Yes	1.05 V		CMOS		250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B484			23 mm	No			1286 MHz		250		23 mm
XCE7VX690T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XCVU11P-L2FLGB2104E	Xilinx	FPGA
XC3020-125CQ100C	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	125 MHz				17.272 mm
5962-9851301NTX	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class N		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 30000		166 MHz				32 mm
XC7VX485T-2FF1930I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		700		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		700
XC7A200T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825			500		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A25T-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XC7A75T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	300	260 °C (500 °F)	10 mm
XCV800-4BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XC3390A-3PG175I	Xilinx	FPGA		Pin/Peg	175	PGA	Rectangular	Plastic/Epoxy		No			CMOS				5		Grid Array										Perpendicular	R-PPGA-P175				No
XC3390A-3VQ144C	Xilinx	FPGA		Gull Wing	144	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack										Quad	R-PQFP-G144				No
XC4005H-5MQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Metal	466	Yes	5.25 V	196	CMOS		192	4000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)		Quad	S-MQFP-G240	1	4.19 mm	31.64 mm	No	392 flip-flops; typical gates = 4000-5000		133.3 MHz		192		31.64 mm
XC4VLX15-11SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC3190-4PP175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	320	No	5.5 V	320	CMOS		144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	230 MHz		144		42.164 mm
XC4036XL-1BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.3 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	35 mm
XC4052XLA-8HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0	263 MHz				40 mm
XC4044XLA-9BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	227 MHz				35 mm
XC3064-70PC84ISPC0107	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	224	CMOS			3500	5		Chip Carrier			4.5 V	1.27 mm		9 ns	224 CLBS, 3500 Gates		Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500	e0	70 MHz				29.3116 mm
XCKU035-2FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700			520		.95	0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1			520		27 mm
XC2V2000-4FF676C	Xilinx																											Tin Lead			4					e0		30 s		225 °C (437 °F)
XCE7VX980T-2FFG1928C	Xilinx	FPGA	Other	Ball	1928	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG		480		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1928		3.65 mm	45 mm						480		45 mm
XC5410L-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes							3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XCS30XL-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s	196	225 °C (437 °F)	28 mm
XC7VX415T-3FFG1158I	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC7VX415T-2LFFG1158I	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC4025E-3PG229I	Xilinx	FPGA																										Tin Lead								e0
XC4025E-4HQG240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS			15000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.5 V	.5 mm		2.7 ns	1024 CLBS, 15000 Gates			Quad	S-PQFP-G240		4.1 mm	32 mm	No	Max usable 25000 Logic gates		111 MHz				32 mm
XC6SLX75-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC7A200T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		500		10 mm
XC3090-100PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS			5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				29.3116 mm
XC5VLX155T-3FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	12160 CLBS	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
5962-8982303MTX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XC4VFX60-12FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC5215-3PQ299I	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	484				15000	5		Grid Array			4.5 V	2.54 mm		3 ns	484 CLBS, 15000 Gates		Tin Lead	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	23000 Logic gates can also be used	e0	52 MHz				52.324 mm
XC4013XLA-07PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 30000 gates	e0	294 MHz	30 s	192	225 °C (437 °F)	32 mm
XC7VX415T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		350		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCV1000E-6FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No		e0	357 MHz		660		35 mm
XC3142A-2VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	144	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		2.2 ns	144 CLBS, 2000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		260 °C (500 °F)	14 mm
XC5215-5PQG160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	484	CMOS			15000	5		Flatpack			4.5 V	.65 mm		4.6 ns	484 CLBS, 15000 Gates		Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Typical gates = 15000-23000	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC7K410T-2LFFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm
XC3130-3PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS		74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P84				No					74
XC7K160T-L2FF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1286 MHz		400
5962-8994801QUA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS	MIL-PRF-38535 Class Q		2000	5		Flatpack			4.5 V		125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							50 MHz
XC7A100T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	10 mm
XC7A75T-L1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900			300		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.