Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S50E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384				23000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 50000	e0	357 MHz				23 mm
XC6SLX100T-3NFGG900Q	Xilinx	FPGA																										Tin Silver Copper			3					e1
XC7A30T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	33600	Yes	1.05 V		CMOS		250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B484			23 mm	No			1098 MHz		250		23 mm
XC7K325T-2FFV900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC6SLX16-3NCSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	806 MHz				13 mm
XCV100E-8FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	416 MHz	30 s	176	260 °C (500 °F)	17 mm
XC6VLX365T-1FF1759M	Xilinx	FPGA																										Tin Lead								e0
XC4010XL-2PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	179 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4010E-1PG191C	Xilinx	FPGA	Other	Pin/Peg	191	HPGA	Square	Ceramic, Metal-Sealed Cofired	400	No	5.25 V	400	CMOS		160	7000	5	5 V	Grid Array, Heat Sink/Slug	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	Max usable 10000 Logic gates		166 MHz		160		47.244 mm
XC7V285T-1FFG1157C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC4044XLA-07HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Can also use 80000 gates		294 MHz				28 mm
XC4085XLA-8HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3	263 MHz				40 mm
XC4085XLA-9HQG304I	Xilinx	FPGA		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1.1 ns	3136 CLBS, 55000 Gates		Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3	227 MHz				40 mm
XQ7VX690T-1RF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	693120	Yes	1.03 V	54150	HKMG		350		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1156				No			1818 MHz		350
XC3S1500-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0					17 mm
XC6SLX45-2CSG484Q	Xilinx	FPGA																										Tin Silver Copper			3					e1
XCVU095-3FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	768			832		1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
5962-8971303MNA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XA3S400A-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS			400000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	23 mm
XCE7VX330T-2FFV1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG		700		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1761		3.77 mm	42.5 mm						700		42.5 mm
XC7A75T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
XC4VFX40-11FFG672CS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS		352			1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4			No		e1	1181 MHz	30 s	352	250 °C (482 °F)
XC4VSX25-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes	1.26 V	2560	CMOS		320		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2560 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	320	225 °C (437 °F)	27 mm
XC6SLX45-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		358		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	358	225 °C (437 °F)	27 mm
XC3030A-7PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 2000 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3S2000-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm
XA6SLX4-3CPG196C	Xilinx	FPGA																										Tin Silver Copper			3					e1				260 °C (500 °F)
XC3S50-5VQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	1728	Yes			CMOS		63			1.2,1.2/3.3,2.5 V	Flatpack	TQFP100,.63SQ	Field Programmable Gate Arrays		.5 mm					Nickel/Palladium/Gold	Quad	S-PQFP-G100	3			No		e4			63
XC4028XL-3HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.6 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Max usable 28000 Logic gates		166 MHz				28 mm
XC5VSX95T-3FF1136I	Xilinx																											Tin Lead			4					e0		30 s		225 °C (437 °F)
XC4405-3PQ160C	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	S-PQFP-G160		4.1 mm	28 mm	No							28 mm
XCV150-6BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		180	164674	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	864 CLBS, 164674 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	333 MHz	30 s	180	225 °C (437 °F)	27 mm
XC2V80-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	120	225 °C (437 °F)	17 mm
XC7K160T-2LFFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC3SD1800A-4CS484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No		e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC3020-70CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		70 MHz		64		19.05 mm
XC6SLX150T-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		396			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	396	250 °C (482 °F)	27 mm
XQ6VSX475T-L1RF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	476000	Yes			CMOS		600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1098 MHz		600
XC6VLX365T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm
XC4044XL-3PG411C	Xilinx	FPGA	Other	Pin/Peg	411	HPGA	Square	Ceramic, Metal-Sealed Cofired	1600	No	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Heat Sink/Slug	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.6 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Max usable 44000 Logic gates		166 MHz		320		52.324 mm
XCE7VX485T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		700		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm			e1		30 s	700	245 °C (473 °F)	42.5 mm
XC3S200-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0					27 mm
XC4013XL-09CBGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	217 MHz				27 mm
XC4013XL-09CHTG176C	Xilinx	FPGA	Other	Gull Wing	176	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G176		1.6 mm	24 mm	No	Max usable 13000 Logic gates	e3	217 MHz				24 mm
XC3042-50CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				19.05 mm
XC3030-100PQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		2.87 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				20 mm
XCV200E-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	357 MHz	30 s	284	250 °C (482 °F)	23 mm
XC3S700AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	770 MHz	30 s		225 °C (437 °F)	21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.