Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A35T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		250		10 mm
5962-8982303MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XC4VLX100-12FFG1148CS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4			No		e1	1205 MHz	30 s	768	245 °C (473 °F)
XC7VX485T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		700		1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760			42.5 mm	No		e0	1818 MHz		700		42.5 mm
XC3S2000-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	725 MHz	30 s	333	225 °C (437 °F)	23 mm
XC4020XLA-09PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	784 CLBS, 13000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 40000 gates	e0	227 MHz	30 s	224	225 °C (437 °F)	28 mm
XC4044XLA-08HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No	Can also use 80000 gates		263 MHz				40 mm
XC4052XLA-08HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 100000 gates	e3	263 MHz	30 s		245 °C (473 °F)	28 mm
XCVU7P-L1FLVB2104I	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC2VP40-7FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS				1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.29 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1350 MHz	30 s		245 °C (473 °F)	40 mm
XC4008E-2PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS			6000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 8000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	28 mm
XC3S400-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		173	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	725 MHz	30 s	173	260 °C (500 °F)	17 mm
XC4004A-6PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		96	3200	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	6 ns	144 CLBS, 3200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	480 flip-flops; typical gates = 3200-4000	e0	90.9 MHz	30 s	96	225 °C (437 °F)	28 mm
XC40110XV-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Heat Sink/Slug, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	217 MHz				40 mm
XCV400-5BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		404	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	2400 CLBS, 468252 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	294 MHz	30 s	404	225 °C (437 °F)	42.5 mm
5962-9957501NUC	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS	MIL-PRF-38535 Class N		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Gold	Bottom	S-PBGA-B432		1.7 mm	40 mm	No		e4	200 MHz				40 mm
XC3020-50PQ100CSPC0110	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				20 mm
XC2S100E-6FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		202	37000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	600 CLBS, 37000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 100000	e1	357 MHz	30 s	202	260 °C (500 °F)	17 mm
XC4010E-2BG255I	Xilinx
XC5VFX70T-1FFV665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS		360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	5600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC3064-100PP132CSPC0108	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	224	CMOS			6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	7 ns	224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		100 MHz				37.084 mm
XC4VSX35-10FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS		448			1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No		e0	1028 MHz	30 s	448	225 °C (437 °F)
XQ6SLX150-1LFG900Q	Xilinx	FPGA																										Tin Lead			3					e0
XC4013E-3PG223I	Xilinx	FPGA		Pin/Peg	223	HPGA	Square	Ceramic, Metal-Sealed Cofired	576	No	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array, Heat Sink/Slug	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm		2 ns	576 CLBS, 10000 Gates		Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Max usable 13000 Logic gates	e0	125 MHz		192		47.244 mm
XA6SLX25-3FGG484C	Xilinx	FPGA																										Tin Silver Copper			3					e1				250 °C (482 °F)
XC7VX485T-2GFFG1930C	Xilinx	FPGA																										Tin Silver Copper			4					e1
XC4028XLA-09HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 50000 gates	e0	227 MHz	30 s	256	225 °C (437 °F)	32 mm
XC2S150E-6FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS		265	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	265	260 °C (500 °F)	17 mm
XC7VX1140T-2LFFG1926I	Xilinx	FPGA																										Tin/Silver/Copper			4					e1		30 s		245 °C (473 °F)
XC5215L-6BG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	484	CMOS			15000	3.3		Grid Array, Low Profile			3 V	1.27 mm			484 CLBS, 15000 Gates			Bottom	S-PBGA-B352		1.65 mm	35 mm	No	Typical gates = 15000-23000						35 mm
XCVU080-H1FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714			832		0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
5962-9471201MXX	Xilinx	FPGA	Military	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No			CMOS	MIL-STD-883	80		5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P120		4.318 mm	34.544 mm	No		e4	50 MHz		80		34.544 mm
XCKU035-L1SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391			520		0.9	0.9 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.88 V	.8 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No	Also Operates at 0.95 V nominal supply	e1			520		23 mm
XA7S25-1CSGA324I	Xilinx																														3							30 s		260 °C (500 °F)
XC6VLX75T-1LFF484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	.93 V								Grid Array			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		3 mm	23 mm	No		e0					23 mm
XQ6VSX315T-L1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	315000	Yes			CMOS		600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4			No		e1	1098 MHz	30 s	600	245 °C (473 °F)
XQ4062XL-3BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535	352	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 40000 to 130000	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4085XL-09BG560I	Xilinx	FPGA		Ball	560	BGA	Square	Plastic/Epoxy	3136	Yes			CMOS		448		3.3	3.3 V	Grid Array	BGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3			No		e0	217 MHz	30 s	448	225 °C (437 °F)
XC7K480T-2FFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1		Grid Array	BGA901,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1					31 mm
XC3142A-4PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000	e0	227 MHz		96		37.084 mm
XC3S400-5FT256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		173	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm			896 CLBS, 400000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0		30 s	173	225 °C (437 °F)	17 mm
XC3120A-1PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.75 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1500 Logic gates	e0	323 MHz	30 s	64	225 °C (437 °F)	20 mm
XQKU5P-1FFRB676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	125 °C (257 °F)		27120 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.67 mm	27 mm			e0		20 s	304	225 °C (437 °F)	27 mm
XC3190A-3PG175I	Xilinx	FPGA		Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS		144	5000	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	320 CLBS, 5000 Gates			Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		270 MHz		144		42.164 mm
5962-9850901QXX	Xilinx	FPGA									3.6 V			MIL-PRF-38535 Class N			3.3					3 V	2.54 mm									5.207 mm	52.324 mm	No							52.324 mm
XC4VFX12-11SF363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B363	4			No		e0	1181 MHz	30 s	240	225 °C (437 °F)
XC3S50AN-4FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	176 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	23 mm
XC5410-4PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	S-PQFP-G160		4.1 mm	28 mm	No							28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.