Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3195-5PG223I	Xilinx	FPGA	Industrial	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.5 V	484	CMOS		176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	484 CLBS, 6500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		176		47.244 mm
XC3142A-4PG132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 2000-3000		227 MHz		96		37.084 mm
XC6SLX25-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS		186		1	1,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	186	260 °C (500 °F)	17 mm
XC2VP50-5FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		812		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	812	245 °C (473 °F)	35 mm
XC7VX485T-3FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V		125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC7V1500T-1FFG784E	Xilinx	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy		Yes		229050							Grid Array					125 °C (257 °F)		229050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC4085XL-2BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
XC3S400-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XC3142A-2PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	323 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC40150XV-7HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.7 V	5184	CMOS			100000	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.3 V	.5 mm	85 °C (185 °F)	0.9 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s		225 °C (437 °F)	32 mm
XC6SLX45T-3NCSG484Q	Xilinx	FPGA																										Tin Silver Copper			3					e1
5962-8971301MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XCV600E-7HQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		158	186624	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	400 MHz	30 s	158	225 °C (437 °F)	32 mm
XCVU095-H1FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			832		0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	47.5 mm
XC4420-3PQPQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Fine Pitch				.5 mm						Quad	S-PQFP-G240		3.75 mm	32 mm	No							32 mm
5962-9225201MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			112		28.702 mm
XCKU085-1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
5962-8994803MNX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No							19.05 mm
XC2S100E-7FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		202	37000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 100000	e0	400 MHz	30 s	202	225 °C (437 °F)	23 mm
XCE7K410T-L2FFV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	HKMG		400		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm						400		27 mm
XQ6VLX240T-L1RF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic	241000	Yes			CMOS		720		.9	0.9 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1759	4			No		e0	1098 MHz		720
XC7K410T-L2FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
XC7S75-L1FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	.98 V	6000	HKMG		400		0.95		Grid Array	BGA676,26X26,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
XCE7VX485T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		600		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s	600	245 °C (473 °F)	45 mm
XQZU9EG-1FFRC900M	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260					0.85		Grid Array			.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm			e0		40 s		245 °C (473 °F)	31 mm
XC6SLX45T-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		296		19 mm
XC4008E-4PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		144	6000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 8000 Logic gates	e0	111 MHz	30 s	144	225 °C (437 °F)	28 mm
XCV3200E-7CG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired	73008	Yes	1.89 V	16224	CMOS		804	876096	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	16224 CLBS, 876096 Gates		Tin Lead	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e0	400 MHz		804		35 mm
XC3S1400AN-4TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm		4.88 ns	2816 CLBS, 1400000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	667 MHz	30 s		260 °C (500 °F)	20 mm
XC3142A-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	Typical gates = 2000-3000	e0	188 MHz		82		19.05 mm
XC2V3000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	650 MHz	30 s	720	245 °C (473 °F)	35 mm
XC2VP2-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		156		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	1050 MHz	30 s	156	250 °C (482 °F)	23 mm
XC7VX485T-2LFFG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950			700		1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm			e1			700		45 mm
XQ5VFX70T-1EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No		e0	1098 MHz		360		27 mm
XC3S4000-5FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS		712	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	725 MHz	30 s	712	245 °C (473 °F)	35 mm
XC3S5000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XQ4VLX100-11FFG1148I	Xilinx	FPGA	Industrial	Ball	1148	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA1148,34X34,40		1.14 V	1 mm	100 °C (212 °F)	0.66 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1148		3.4 mm	35 mm								35 mm
XCKU035-3FBVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	1700			520		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
XC6VLX75T-L1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	74496	Yes	.93 V		CMOS		360		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e0	1098 MHz	30 s	360	220 °C (428 °F)	29 mm
XC7A25T-3CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		150		10 mm
XC5VLX85-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC5VLX30T-1FFG323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e1		30 s	172	250 °C (482 °F)	19 mm
5962-8982301MTX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS				5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm
XC5206-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	5.5 V	196	CMOS		148	6000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		3.8 ns	196 CLBS, 6000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 6000-10000	e0	83 MHz	30 s	148	225 °C (437 °F)	28 mm
XCVU190-1FLGA2577C	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280			702		0.95		Grid Array	BGA2577,51X51,40		.922 V	1 mm	85 °C (185 °F)		134280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577		4.31 mm	52.5 mm			e1			702		52.5 mm
XCKU3P-3FFVA676I	Xilinx																											Tin Silver Copper			4					e1		30 s		250 °C (482 °F)
XCV200-5HQ240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	1176				236666	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm		0.7 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	294 MHz	30 s		225 °C (437 °F)	32 mm
XC4013E-2HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS		192	10000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	32 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.