Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5VLX50-2FFV1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			560		1		Grid Array	BGA1153,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm			e1		30 s	560	245 °C (473 °F)	35 mm
XC2018-33PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS		58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No			33 MHz		58
XC4010D-6PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	8000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	28 mm
XC2064-70PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	70 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4020-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1862	Yes	5.25 V	784	CMOS		193	16000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4 ns	784 CLBS, 16000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	2016 flip-flops; typical gates = 16000-20000	e0	133.3 MHz	30 s	193	225 °C (437 °F)	32 mm
XC3130A-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			1500	5		Chip Carrier			4.5 V	1.27 mm		2.7 ns	100 CLBS, 1500 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 2000 Logic gates	e3	270 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4013E-2PQG160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	576	CMOS			10000	5		Flatpack			4.5 V	.65 mm		1.6 ns	576 CLBS, 10000 Gates		Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	28 mm
XC4020E-3HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS		224	13000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 20000 Logic gates	e0	125 MHz	30 s	224	225 °C (437 °F)	28 mm
XC3S50-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS		63	50000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	725 MHz		63		14 mm
XA3S50-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192		AEC-Q100	124	50000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		192 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	124	245 °C (473 °F)	28 mm
XCS100E-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3		28 mm	No		e0	357 MHz	30 s	202	225 °C (437 °F)	28 mm
XC4062XLA-08BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 130000 gates	e0	263 MHz	30 s	384	225 °C (437 °F)	42.5 mm
XC3S1000-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes			CMOS		333			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B456	3			No		e0		30 s	333	225 °C (437 °F)
XC4085XLA-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm
XC4008E-1PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy	324	Yes	5.5 V	324	CMOS		144	6000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm			324 CLBS, 6000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	166 MHz	30 s	144	225 °C (437 °F)	28 mm
XC6VLX130T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7VX690T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC4408-3PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Fine Pitch				.5 mm						Quad	S-PQFP-G208		4.1 mm	28 mm	No							28 mm
XC4005E-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3S200AN-4FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	448 CLBS, 200000 Gates		Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz				23 mm
XC7K160T-1FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XC5202-6VQ64I	Xilinx	FPGA		Gull Wing	64	TFQFP	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		84	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		5.6 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	10 mm
XC5202-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		84	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	225 °C (437 °F)	29.3116 mm
XC3330A-3TQ100C	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No							14 mm
XC4085XL-1PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HPGA	Square	Ceramic, Metal-Sealed Cofired	3136	No	3.6 V	3136	CMOS		448	55000	3.3	3.3 V	Grid Array, Heat Sink/Slug	HSPGA559,43X43	Field Programmable Gate Arrays	3 V	2.54 mm	85 °C (185 °F)	1.3 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559		5.969 mm	57.404 mm	No	Max usable 85000 Logic gates		200 MHz		448		57.404 mm
XC5VLX30-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC4005XL-09VQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	196	Yes		196	CMOS		112		3.3	3.3 V	Flatpack	TQFP100,.63SQ	Field Programmable Gate Arrays		.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3		14 mm	No		e0	217 MHz	30 s	112	240 °C (464 °F)	14 mm
XC7VX690T-2GFFG1157I	Xilinx	FPGA																										Tin Silver Copper			4					e1
XC7V855T-1FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4028XLA-09BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	227 MHz	30 s	256	225 °C (437 °F)	27 mm
XC4062XLA-09BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e1	227 MHz	30 s		260 °C (500 °F)	40 mm
XC4085XLA-8BG432I	Xilinx	FPGA		Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm		1 ns	3136 CLBS, 55000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	263 MHz				40 mm
XC8101-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS			1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	192 flip-flops; 3.3 V operation; OTP based						29.3116 mm
XC40250XV-7PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	2.7 V	8464	CMOS			180000	2.5		Grid Array, Heat Sink/Slug, Interstitial Pitch			2.3 V	2.54 mm	85 °C (185 °F)	0.9 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559		5.334 mm	57.404 mm	No			250 MHz				57.404 mm
XC2VP30-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XA6SLX100-2FG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911			326		1.23		Grid Array	BGA484,22X22,40		1.2 V	1 mm	125 °C (257 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			326		23 mm
5962-8971301MNC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XCV600E-7FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s	512	250 °C (482 °F)	31 mm
5962-8971301MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883	74	4200	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	50 MHz		74		27.94 mm
XC4VFX12-11SFG363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No		e1	1181 MHz	30 s	240	260 °C (500 °F)
XA3S500E-4PQG208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	158	500000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC7K325T-1FF900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS		500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XQ6VLX240T-1RF1759I	Xilinx	FPGA																										Tin Lead								e0
XC4VLX60-10FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC7A75T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900			300		0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		300		10 mm
XC3130-3PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS		34		5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3			No		e0		30 s	34	225 °C (437 °F)
XC4VLX80-10FF1148CS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	80640	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1148	4			No		e0	1028 MHz	30 s	768	225 °C (437 °F)
XC3042-70PG84ISPC0107	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	144	CMOS			2000	5		Grid Array			4.5 V	2.54 mm		9 ns	144 CLBS, 2000 Gates		Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000	e3	70 MHz				27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.