Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV100-5PQG240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	2.625 V	600	CMOS			108904	2.5		Flatpack, Fine Pitch			2.375 V	.5 mm		0.7 ns	600 CLBS, 108904 Gates		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	294 MHz	30 s		245 °C (473 °F)	32 mm
XCS30XL-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS		169	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 30000	e3	217 MHz	30 s	169	245 °C (473 °F)	28 mm
XCVU440-1FLGB2377I	Xilinx	FPGA	Industrial	Ball	2377	BGA	Square		Plastic/Epoxy	5540850	Yes	.979 V	2880			1456		.95		Grid Array	BGA2377,49X49,40		.922 V	1 mm	100 °C (212 °F)		2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm			e1			1456		50 mm
XQVR600-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q	316	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XC4002A-6VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	LFQFP	Square		Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1600	5	5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	64 CLBS, 1600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	256 flip-flops; typical gates = 1600-2000	e0	90.9 MHz	30 s	64	240 °C (464 °F)	14 mm
XC2064-33PG68C	Xilinx	FPGA	Commercial	Pin/Peg	68	PGA	Square		Ceramic	64	No			CMOS		58		5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P68				No			33 MHz		58
XC4VLX160-10FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square		Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS		768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			16896 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	35 mm
XQZU19EG-1FFRC1760M	Xilinx	FPGA SOC		Ball	1760	BGA	Square		Plastic/Epoxy	1143450	Yes	.876 V	65340			512		0.85		Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e0		40 s	512	245 °C (473 °F)	42.5 mm
XC6SLX100T-3NFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XC4010E-1PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square		Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	7000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	28 mm
XCS10XL-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	3.6 V	196				3000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can also use 10000 gates	e3		30 s		260 °C (500 °F)	20 mm
XC3190A-2PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	5.5 V	320	CMOS			5000	5		Flatpack, Fine Pitch			4.5 V	.5 mm		2.2 ns	320 CLBS, 5000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm		Max usable 6000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	28 mm
XC7K420T-2LFFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square		Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s		250 °C (482 °F)	35 mm
XC3S5000-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS		489	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	8320 CLBS, 5000000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		489		27 mm
XC7K325T-1LFFG676I	Xilinx	FPGA		Ball	676				Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom		4			No		e1		30 s		250 °C (482 °F)
XCV600E-8FGG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	416 MHz	30 s	444	250 °C (482 °F)	27 mm
XC2V80-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square		Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	120	225 °C (437 °F)	17 mm
XCKU035-3FBVA900E	Xilinx	FPGA	Other	Ball	900	BGA	Square		Plastic/Epoxy	444343	Yes	1.03 V	1700			520		1	1 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XCV100E-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square		Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		94	32400	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	357 MHz	30 s	94	260 °C (500 °F)	12 mm
XC7VX690T-L2FF1926E	Xilinx	FPGA		Ball	1924	BGA	Square		Plastic/Epoxy	693120	Yes			CMOS		720			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
DL6035QP208FC	Xilinx	FPGA		Gull Wing	208	HLFQFP	Square		Plastic/Epoxy	1024	Yes	3.47 V	1024	CMOS		256		3.3	2.5,3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3		28 mm	No		e0		30 s	256	225 °C (437 °F)	28 mm
XC4VFX12-12FF668CS1	Xilinx	FPGA		Ball	668	BGA	Square		Plastic/Epoxy	12312	Yes			CMOS		320			1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4			No		e0	1181 MHz		320
XC4036XLA-09HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 65000 gates	e3	227 MHz				32 mm
XC3164A-09PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square		Plastic/Epoxy		Yes	5.25 V	224	CMOS			3500	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	1.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm		Max usable 4500 Logic gates	e3	370 MHz	30 s		245 °C (473 °F)	28 mm
XC4028XL-2HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square		Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.5 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Max usable 28000 Logic gates		179 MHz				28 mm
XC4013XL-08HT144C	Xilinx	FPGA	Other	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144	1	1.6 mm	20 mm	No	Typical gates = 10000-30000		238 MHz		192		20 mm
XCVU080-3FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square		Plastic/Epoxy	975000	Yes	1.03 V	672			832		1		Grid Array	BGA1760,42X42,40		.97 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XC5204-6PQG160I	Xilinx	FPGA		Gull Wing	160	QFP	Square		Plastic/Epoxy		Yes	5.5 V	120	CMOS			4000	5		Flatpack			4.5 V	.65 mm		5.6 ns	120 CLBS, 4000 Gates		Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC7A12T-1CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	10 mm
XCV800-5FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square		Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
5962-9851101NTB	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class N	193	40000	3.3	3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 130000	e0	166 MHz		193		32 mm
XC4005A-5TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	20 mm
XC4010-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	8000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3S50A-4VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		68	50000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	667 MHz		62		14 mm
XC7V285T-1FFG484C	Xilinx	FPGA		Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No		e1		30 s		250 °C (482 °F)
XC7V585T-2FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC3164-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy	224	Yes	5.5 V	224	CMOS		70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC7V585T-2LFFG1761C	Xilinx	FPGA																											Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			4					e1		30 s		245 °C (473 °F)
XC4052XLA-9BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square		Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	227 MHz				40 mm
XCZU27DR-2LFFVG1517E	Xilinx	FPGA SOC																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC7VX415T-3FFG1927C	Xilinx																												Tin Silver Copper			4					e1
XC4062XL-08HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square		Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 40000-130000	e0	238 MHz	30 s	384	225 °C (437 °F)	32 mm
XCV600E-6BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square		Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	357 MHz	30 s	316	260 °C (500 °F)	40 mm
XC5204-3PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square		Plastic/Epoxy	120	Yes	5.25 V	120	CMOS		124	4000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	3 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	28 mm
XCVU45P-2FSVH2104E	Xilinx	FPGA																											Tin Silver Copper			4					e1
XC2VP20-7FFG896I	Xilinx	FPGA		Ball	896	BGA	Square		Plastic/Epoxy		Yes	1.575 V	2320	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1	1350 MHz	30 s		245 °C (473 °F)	31 mm
5962-8994803MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V		CMOS	MIL-STD-883	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.683 mm	17.27 mm	No		e4	100 MHz		64		17.27 mm
XC7A35T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.