Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4062XLA-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz				35 mm
XC3342A-6PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC7K160T-2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675					1		Grid Array			.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC7A15-2CPG236C	Xilinx	FPGA			238			Plastic	15360	Yes	1.05 V		CMOS		140		1	1 V		BGA238,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper			3		10 mm	No		e1	1286 MHz	30 s	140	260 °C (500 °F)	10 mm
XC2VP20-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	564	245 °C (473 °F)	35 mm
XC4062XL-1BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.3 ns	2304 CLBS, 40000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 62000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4044XL-3HQG304I	Xilinx	FPGA		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1.6 ns	1600 CLBS, 27000 Gates			Quad	S-PQFP-G304		4.5 mm	40 mm	No	Max usable 44000 Logic gates		166 MHz				40 mm
XC6VLX365T-1LFF1759I	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy		Yes	.97 V								Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0		30 s		225 °C (437 °F)	42.5 mm
XCV200-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		284	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.6 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	333 MHz	30 s	284	225 °C (437 °F)	23 mm
XC4028XL-1HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.3 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 28000 Logic gates	e0	200 MHz		256		28 mm
XA6SLX16-2FG256C	Xilinx	FPGA																										Tin Lead			3					e0
XC5VLX330-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	25920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VSX240T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	18720 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	960	225 °C (437 °F)	42.5 mm
XC4025-4PG223C	Xilinx	FPGA	Other	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.25 V	1024	CMOS		256	20000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4 ns	1024 CLBS, 20000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	2560 flip-flops; typical gates = 20000-25000	e0	133.3 MHz		256		47.244 mm
XC4VLX200-11FFG1513CS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	200448	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1513	4			No		e1	1205 MHz	30 s	960	245 °C (473 °F)
XC4VFX20-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4013E-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		2.7 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e0	111 MHz	30 s	192	225 °C (437 °F)	28 mm
XCS05XL-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS		77	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Maximum usable gates 5000	e0	217 MHz	30 s	77	225 °C (437 °F)	29.3116 mm
XC7VX1140T-2FFG1928C	Xilinx	FPGA																										Tin Silver Copper								e1
XC6SLX9-3NTQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	806 MHz				20 mm
XCKU115-1FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
5962-9957401NUX	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS	MIL-PRF-38535 Class N		1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	Yes							42.5 mm
XC5404-4PQ160C	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	S-PQFP-G160		4.1 mm	28 mm	No							28 mm
XC3020-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3042-70CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz		82		19.05 mm
XC4VLX60-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS				1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0					27 mm
XCKU100-2FLVA1517E	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	958440	Yes	.979 V	4200			524		.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		4200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	524	245 °C (473 °F)	40 mm
XC5VSX35T-3FFV665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS		360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	2720 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC4VLX40-11FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		448		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC3030A-7PCG68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			1500	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	100 CLBS, 1500 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 2000 Logic gates		113 MHz				24.2316 mm
XCKU15P-2LFFVA1156E	Xilinx	FPGA																										Tin Silver Copper			4					e1
XC6VCX130T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XCV200E-8FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	1176 CLBS, 63504 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	416 MHz	30 s	284	250 °C (482 °F)	23 mm
XC4044XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e0	227 MHz	30 s	320	225 °C (437 °F)	40 mm
5962-8863805XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS	MIL-STD-883		1800	5		Grid Array			4.5 V		125 °C (257 °F)		1800 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
XC5210-4PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		196	10000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	28 mm
XC3190A-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		122	5000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	227 MHz	30 s	122	225 °C (437 °F)	20 mm
XC6SLX75-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		408		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3090-100CQ164CSPC0107	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				27.432 mm
XCS40XL-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e1	250 MHz	30 s	205	250 °C (482 °F)	27 mm
XQ6SLX75T-3CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	862 MHz		292
XQ6SLX75T-3FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS		348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	3			No		e1	862 MHz	30 s	348	250 °C (482 °F)
XCVU125-H1FLVB2104C	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC3020-100PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		100 MHz				24.2316 mm
XC3020-125PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	125 MHz		58		24.2316 mm
XC5206-6PQG160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS			6000	5		Flatpack			4.5 V	.65 mm		5.6 ns	196 CLBS, 6000 Gates		Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC4028XL-3PG299I	Xilinx	FPGA		Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays	3 V	2.54 mm		1.6 ns	1024 CLBS, 18000 Gates			Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 28000 Logic gates		166 MHz		256		52.324 mm
XC5VSX35T-2FF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2720 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e0		30 s	360	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.