Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV300-5BG432I	Xilinx	FPGA		Ball	432	LBGA	Square		Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	1536 CLBS, 322970 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	316	225 °C (437 °F)	40 mm
XCV50E-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCE7VX690T-3FFG1927E	Xilinx	FPGA		Ball	1927	BGA	Square		Plastic/Epoxy		Yes	1.03 V	54150					1		Grid Array			.97 V	1 mm		0.58 ns	54150 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s		245 °C (473 °F)	45 mm
XCVU080-1FFVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square		Plastic/Epoxy	975000	Yes	.979 V	672			832		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC4013XL-3HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	166 MHz	30 s		225 °C (437 °F)	32 mm
5962R9957301NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square		Plastic/Epoxy	15552	Yes	2.625 V		CMOS	MIL-PRF-38535	316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes		e0			316		40 mm
XC2VP50-7FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square		Plastic/Epoxy		Yes	1.575 V	5904	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e1	1350 MHz	30 s		245 °C (473 °F)	35 mm
XC6VLX130T-3FF1156M	Xilinx	FPGA																											Tin Lead			4					e0
XCV50-4PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	2.625 V	384	CMOS			57906	2.5		Flatpack, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.8 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	250 MHz	30 s		245 °C (473 °F)	32 mm
XCV50-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square		Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		166	57906	2.5	1.2/3.6,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.8 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s	166	225 °C (437 °F)	32 mm
XC7VX1140T-1FL1926C	Xilinx	FPGA		Ball	1924	BGA	Square		Plastic/Epoxy	1139200	Yes			CMOS		720			0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		720
XC3090A-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	135 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC7A200T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	215360	Yes	.98 V	16825			500		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A25T-3CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	10 mm
XCV200-4PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square		Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		166	236666	2.5	1.2/3.6,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm		0.8 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s	166	225 °C (437 °F)	32 mm
XC5VSX50T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square		Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC7K480T-L2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square		Plastic/Epoxy	477760	Yes	.93 V	37325	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No	Also Operates at 1 V supply	e1		30 s	400	245 °C (473 °F)	35 mm
XC4010E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square		Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XA6SLX45-2FG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	358			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3			No		e0	667 MHz	30 s	358	225 °C (437 °F)
XQR5VFX130-1CF1752B	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	1.05 V	10240	CMOS				1		Grid Array			.95 V	1 mm	125 °C (257 °F)		10240 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1752		9.6 mm	45 mm			e0					45 mm
XC7V450T-L1FFG1761I	Xilinx																												Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC7A350T-L2FBG676E	Xilinx	FPGA		Ball	676	BGA	Square		Plastic	348480	Yes	.93 V		CMOS		400		.9	0.9 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4		27 mm	No		e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A350T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic	348480	Yes	1.05 V		CMOS		285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4		23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XA6SLX75T-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	292	225 °C (437 °F)
XA6SLX9-3FT256C	Xilinx	FPGA																											Tin/Lead (Sn63Pb37)			3					e0		30 s		225 °C (437 °F)
XC4036XLA-8HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	32 mm
XC4062XLA-9HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	227 MHz				28 mm
XC3190A-1PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		144	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.75 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	323 MHz	30 s	144	225 °C (437 °F)	28 mm
XC7VX550T-3FFG1158I	Xilinx	FPGA																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XA7S100-1FGGA676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square		Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	AEC-Q100; TS 16949			1		Grid Array			.95 V	1 mm	125 °C (257 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm				1098 MHz	30 s		250 °C (482 °F)	27 mm
XCE7K420T-3FFG901E	Xilinx	FPGA		Ball	901	BGA	Square		Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG		380		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1			380		31 mm
XC2V1500-5FFG896I	Xilinx	FPGA		Ball	896	BGA	Square		Plastic/Epoxy		Yes	1.575 V	1920	CMOS			1500000	1.5		Grid Array			1.425 V	1 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1	750 MHz	30 s		245 °C (473 °F)	31 mm
XQ6VLX240T-1LRF1156C	Xilinx	FPGA																											Tin Lead								e0
XCV100E-6BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square		Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	196	260 °C (500 °F)	35 mm
XCV200-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	250 MHz				17 mm
XC2064-50PG68M	Xilinx	FPGA	Military	Pin/Peg	68	PGA	Square		Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS		58	600	5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	15 ns	64 CLBS, 600 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		50 MHz		58		27.94 mm
XC4025-6HQ304C	Xilinx	FPGA	Other	Gull Wing	304	FQFP	Square		Plastic/Epoxy	1024	Yes	5.25 V	1024	CMOS		256	20000	5	5 V	Flatpack, Fine Pitch	QFP304(UNSPEC)	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	6 ns	1024 CLBS, 20000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.23 mm	40 mm	No	2560 flip-flops; typical gates = 20000-25000	e0	90.9 MHz	30 s	256	225 °C (437 °F)	40 mm
XC3S100E-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square		Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		83	100000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	657 MHz	30 s	72	260 °C (500 °F)	8 mm
XC6SLX150-3CSG484Q	Xilinx	FPGA																											Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			3					e1		30 s		260 °C (500 °F)
XC4008E-2PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square		Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		144	6000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.6 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 8000 Logic gates	e0	125 MHz	30 s	144	225 °C (437 °F)	28 mm
XC3042-100PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000		100 MHz				29.3116 mm
XC40250XV-08BG560I	Xilinx	FPGA		Ball	560	LBGA	Square		Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.1 ns	8464 CLBS, 180000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 500000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4010XL-09CBGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e1	217 MHz				27 mm
XC7V285T-2FFG1157C	Xilinx	FPGA		Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2V6000-6FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square		Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	1104	225 °C (437 °F)	40 mm
XC4013XLA-08BGG256I	Xilinx	FPGA		Ball	256	BGA	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1 ns	576 CLBS, 10000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 30000 gates	e1	263 MHz	30 s		250 °C (482 °F)	27 mm
XC6SLX150T-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XC2VP50-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.