Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3042-70PP132CSPC0107	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	144	CMOS			2000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		3.7338 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				37.084 mm
XC5215-4BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XC7V450T-2FFG1157I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC3195-4PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	484	Yes	5.5 V	484	CMOS		138	6500	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	3.3 ns	484 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz	30 s	138	225 °C (437 °F)	28 mm
XC4044XLA-07HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 80000 gates	e0	294 MHz	30 s	320	225 °C (437 °F)	28 mm
XC4052XLA-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	263 MHz				42.5 mm
XC5210-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	32 mm
XQ5VFX70T-2EF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	6080	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136		3.4 mm	35 mm	No		e0	1265 MHz		640		35 mm
5962-9473002MYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	1368	Yes			CMOS	MIL-STD-883	192		5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e4	90.9 MHz		192		39.37 mm
5962-8971303MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC5206L-4PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e3					29.3116 mm
XCKU085-3FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1	1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XC6VLX550T-1LFF1759E	Xilinx	FPGA																										Tin Lead								e0
XC3020-70PQ100ISPC0107	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	64	CMOS			1000	5		Flatpack			4.5 V	.65 mm		9 ns	64 CLBS, 1000 Gates			Quad	R-PQFP-G100		2.87 mm	14 mm	No	256 flip-flops; typical gates = 1000-1500		70 MHz				20 mm
XCE7K410T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm						400		27 mm
XC7A100T-L1CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925			300		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC4010XL-2PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	179 MHz	30 s	160	225 °C (437 °F)	28 mm
XC2018-33PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS	MIL-STD-883 Class B	74	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	20 ns	100 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	174 flip-flops; typical gates = 1000-1500		33 MHz		74		27.94 mm
5962-9230502NYX	Xilinx	FPGA	Military	Flat	164	QFF	Square			Yes	5.5 V		CMOS	MIL-PRF-38535 Class N		5000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	6 ns	5000 Gates	-55 °C (-67 °F)		Quad	S-XQFP-F164		2.92 mm	28.702 mm	No			50 MHz				28.702 mm
XC3190A-3TQG176I	Xilinx	FPGA		Gull Wing	176	LFQFP	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS			5000	5		Flatpack, Low Profile, Fine Pitch			4.5 V	.5 mm		2.7 ns	320 CLBS, 5000 Gates		Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	24 mm		Max usable 6000 Logic gates	e3	270 MHz	30 s		260 °C (500 °F)	24 mm
XC6VSX315T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3020A-7PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	113 MHz		58		24.2316 mm
XC3064A-7PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS		70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	113 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC7A15-2CSG324I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	15360	Yes	1.05 V		CMOS		200		1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3		15 mm	No		e1	1286 MHz	30 s	200	260 °C (500 °F)	15 mm
XCE7VX690T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s		245 °C (473 °F)	45 mm
XC4062XL-3BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XC3090-70CQ164MSPC0107	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.432 mm
XC7A200T-1FBV484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array			.95 V	1 mm		1.27 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm			e1		30 s		250 °C (482 °F)	23 mm
XC6VCX195T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3S1000L-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS		221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0		30 s	221	225 °C (437 °F)	19 mm
XCV50-4PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		166	57906	2.5	1.2/3.6,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm		0.8 ns	384 CLBS, 57906 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s	166	225 °C (437 °F)	32 mm
XC7A12T-3CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
XC5VFX100T-1FFG1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC5VFX70T-2FFG665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	5600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XQ4085XL-1BG432M	Xilinx																											Tin Lead			3					e0		30 s		225 °C (437 °F)
XQVU11P-1FLRC2104I	Xilinx																											Tin/Lead			4					e0		5 s		250 °C (482 °F)
XC3195-5PQ208C	Xilinx	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		176	6500	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	190 MHz	30 s	176	225 °C (437 °F)	28 mm
XC4062XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Guard Ring			3 V	.65 mm	125 °C (257 °F)		2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No							39.37 mm
XC4020XLA-8PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm		1 ns	784 CLBS, 13000 Gates		Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	263 MHz				32 mm
XC4044XLA-7HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	294 MHz	30 s		225 °C (437 °F)	32 mm
XC7VX980T-1FLG1928C	Xilinx	FPGA																										Tin Silver Copper								e1
XC5206-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS			6000	5		Chip Carrier			4.5 V	1.27 mm		3.8 ns	196 CLBS, 6000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC6SLX75-1LFG676Q	Xilinx	FPGA																										Tin Lead			3					e0
XCV2000E-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC4013L-5PQ240C	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS			10000	5		Flatpack, Fine Pitch			4.75 V	.5 mm			576 CLBS, 10000 Gates			Quad	S-PQFP-G240		4.1 mm	32 mm	No	Typical gates = 10000-30000						32 mm
XQ2V1000-4BGG575N	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS			1000000	1.5		Grid Array			1.425 V	1.27 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No		e1	650 MHz				31 mm
XC3S500E-4VQ100C	Xilinx																											Nickel/Palladium/Gold			3					e4
XC3195A1PG175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS		144	6500	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.75 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Max usable 7500 Logic gates		323 MHz		144		42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.