Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU57P-2FSVK2892E	Xilinx	FPGA
XCVU7P-2FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square		Plastic/Epoxy	1724100	Yes	.876 V	98520			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		98520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU9P-2FSGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square		Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm						832		47.5 mm
XCVU9P-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square		Plastic/Epoxy	2586150	Yes	.927 V	147780			832		0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
XQ4005E-4PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired	466	No	5.5 V	196	CMOS	MIL-PRF-38535	112	3000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	2.01 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Maximum usable gates = 9000	e3	125 MHz		112		42.164 mm
XQ4VLX25-10FF668M	Xilinx	FPGA	Military	Ball	668	BGA	Square		Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		2688 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XQ4VSX55-10FF1148M	Xilinx	FPGA	Military	Ball	1148	BGA	Square		Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS		640		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6144 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XQ5VFX130T-2EF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square		Plastic/Epoxy	131072	Yes	1.05 V	11200	CMOS		840		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738		3.5 mm	42.5 mm	No		e0	1265 MHz		840		42.5 mm
XQ7A200T-1RB484M	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	16825 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.35 mm	23 mm	No			1098 MHz		285		23 mm
XQ7A200T-1RS484I	Xilinx	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1	1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484		3.19 mm	19 mm	No		e0	1098 MHz		285		19 mm
XQ7VX690T-1RF1761I	Xilinx	FPGA		Ball	1761	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	HKMG		850		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	54150 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm			e0			850		42.5 mm
XQ7VX690T-2RF1158I	Xilinx	FPGA		Ball	1156	BGA	Square		Plastic	693120	Yes	1.03 V	54150	HKMG		350		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1156				No			1818 MHz		350
XQKU040-1RBA676M	Xilinx	FPGA	Military	Ball	676	BGA	Square		Plastic/Epoxy		Yes	.979 V	30300					.95		Grid Array			.922 V	1 mm	125 °C (257 °F)		30300 CLBS	-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B676	4	3.44 mm	27 mm			e0		5 s		250 °C (482 °F)	27 mm
XQKU060-1RFA1156I	Xilinx	FPGA		Ball	1156	BGA	Square		Plastic/Epoxy	725550	Yes		41460			520		.95		Grid Array				1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0			520		35 mm
XQKU060-2RFA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	725550	Yes		41460			520		.95		Grid Array				1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0			520		35 mm
XQVR300-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	316	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XQZU11EG-1FFRC1760M	Xilinx	FPGA SOC		Ball	1760	BGA	Square		Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85		Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e0		40 s	512	245 °C (473 °F)	42.5 mm
XQZU9EG-1FFRB1156M	Xilinx	FPGA SOC		Ball	1156	BGA	Square		Plastic/Epoxy	599550	Yes	.876 V	34260					0.85		Grid Array			.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm			e0		40 s		245 °C (473 °F)	35 mm
XA6SLX75T-3FG484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	268			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	268	225 °C (437 °F)
XC4013XLA-09PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square		Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm		1.1 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 30000 gates	e0	227 MHz	30 s	192	225 °C (437 °F)	28 mm
XCV1000E-7FG900I	Xilinx	FPGA		Ball	900	BGA	Square		Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	660	225 °C (437 °F)	31 mm
XC3195A-5PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square		Plastic/Epoxy	484	Yes	5.5 V	484	CMOS		138	6500	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm		4.1 ns	484 CLBS, 6500 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Typical gates = 6500-7500	e0	188 MHz	30 s	138	225 °C (437 °F)	28 mm
XC4013XLA-09PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 30000 gates	e3	227 MHz	30 s		245 °C (473 °F)	32 mm
XC6VHX380T-1LFFG1154I	Xilinx	FPGA																											Tin Silver Copper			4					e1
XC5VSX50T-3FFG1136I	Xilinx																												Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC3190A-4TQ176C	Xilinx	FPGA	Other	Gull Wing	176	LFQFP	Square		Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		144	5000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Max usable 6000 Logic gates	e0	227 MHz	30 s	144	225 °C (437 °F)	24 mm
XC4020XL-3BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 20000 Logic gates	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XC7K410T-1LFFG676I	Xilinx	FPGA		Ball	676				Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1		30 s		250 °C (482 °F)
5962-9225202MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes		196	CMOS	MIL-STD-883	112	4000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			112		28.702 mm
XA6SLX45T-3CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square		Plastic/Epoxy	43661	Yes				AEC-Q100	190			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	190	260 °C (500 °F)
5962-9851001NTC	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class N		22000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Quad	S-PQFP-G240		4.1 mm	32 mm	No	Maximum usable gates 65000	e4	166 MHz				32 mm
XC7A200T-L1CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	215360	Yes	.98 V	16825			500		0.95		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	10 mm
XC7A25T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG		150		0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XCV200-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square		Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		176	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	294 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4036EX-2HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square		Plastic/Epoxy	1296	Yes		1296	CMOS		288	22000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Max usable 36000 Logic gates	e0	166 MHz	30 s	288	225 °C (437 °F)	40 mm
XC7V2000T-2FLG1925I	Xilinx	FPGA	Industrial	Ball	1925	BGA	Square		Plastic/Epoxy	1954560	Yes	1.03 V	152700	HKMG		1200		1		Grid Array	BGA1925,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm			e1			1200		45 mm
XCV100-6PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square		Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		166	108904	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm		0.6 ns	600 CLBS, 108904 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	333 MHz	30 s	166	225 °C (437 °F)	32 mm
XC5VLX330-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square		Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	25920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	1200	225 °C (437 °F)	42.5 mm
XC4044XL-09HQ240I	Xilinx	FPGA		Gull Wing	240	HLFQFP	Square		Plastic/Epoxy	1600	Yes			CMOS		320		3.3	3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		.5 mm					Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3			No		e0	217 MHz	30 s	320	225 °C (437 °F)
XC6SLX100-N3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	326	250 °C (482 °F)	23 mm
XC7VX690T-1FFG1158E	Xilinx	FPGA																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC3030A-6VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 2000 Logic gates	e3	135 MHz	30 s		260 °C (500 °F)	14 mm
XA6SLX25-2FG484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	24051	Yes			CMOS	AEC-Q100	266			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	266	225 °C (437 °F)
XC2VP4-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square		Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		248		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	752 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	1200 MHz	30 s	248	225 °C (437 °F)	23 mm
DL6009BG352GC	Xilinx	FPGA		Ball	352	BGA	Square		Plastic/Epoxy	256	Yes	3.47 V	256	CMOS		128		3.3	2.5,3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays	3.14 V	1.27 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3		35 mm	No		e0		30 s	128	225 °C (437 °F)	35 mm
XC7V585T-2FFG484C	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array							91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XCV300-6FGG456I	Xilinx	FPGA		Ball	456	BGA	Square		Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	333 MHz	30 s		250 °C (482 °F)	23 mm
XCV400E-7FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	400 MHz	30 s	404	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.