Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX9-2TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	102		1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	667 MHz	30 s	102	260 °C (500 °F)	20 mm
XC6SLX9-2TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	102		1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	667 MHz	30 s	102	260 °C (500 °F)	20 mm
XC6SLX9-3TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	102		1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.21 ns	715 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	862 MHz	30 s	102	260 °C (500 °F)	20 mm
XC7A35T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A100T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC6SLX9-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	102		1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.21 ns	715 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	862 MHz	30 s	102	260 °C (500 °F)	20 mm
XC7A200T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC6SLX4-2TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	100		1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	667 MHz	30 s	100	260 °C (500 °F)	20 mm
XC6SLX9-2FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	667 MHz	30 s	186	260 °C (500 °F)	17 mm
XC3S50AN-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	667 MHz	30 s	101	260 °C (500 °F)	20 mm
XC6SLX45T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	190		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC7A200T-1FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A35T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A35T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6SLX9-2CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	160		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No	e1	667 MHz	30 s	160	260 °C (500 °F)	13 mm
XC7A200T-1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A35T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A100T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
XC6SLX45-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7A50T-2CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No	e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A100T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7K325T-2FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	e1	1818 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A200T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1286 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7A35T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A35T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	CMOS	250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1286 MHz	30 s	250	250 °C (482 °F)	23 mm
XC7S25-1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		150		15 mm
XC6SLX45-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	667 MHz	30 s	218	260 °C (500 °F)	15 mm
XC7A200T-2SBG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XC6SLX16-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	667 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A15T-1FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300				1		Grid Array			.95 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e1		30 s		250 °C (482 °F)	23 mm
XC7A200T-1SBG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7A15T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A35T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No	e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A75T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC6SLX4-2TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	100		1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	667 MHz	30 s	100	260 °C (500 °F)	20 mm
XC6SLX25-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	667 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A100T-1FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7A35T-1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	CMOS	250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1098 MHz	30 s	250	250 °C (482 °F)	23 mm
XC7S6-1FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	469 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		100		15 mm
XC6SLX75-3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	328		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	862 MHz	30 s	328	260 °C (500 °F)	19 mm
XC7A200T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1412 MHz	30 s	500	245 °C (473 °F)	35 mm
XC6SLX9-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	667 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A200T-2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC6SLX45-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	667 MHz	30 s	218	260 °C (500 °F)	15 mm
XC7A75T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	e1	1286 MHz	30 s	500	245 °C (473 °F)	35 mm
XC6SLX16-2FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	667 MHz	30 s	186	260 °C (500 °F)	17 mm
XC6SLX45T-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	296		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	296	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.