Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX16-2CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square		Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	160		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No	e1	667 MHz	30 s	160	260 °C (500 °F)	13 mm
XC7S25-2CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1286 MHz		150		15 mm
XC6SLX25T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	250		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	250	250 °C (482 °F)	23 mm
XC3S400-4TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	97	400000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	896 CLBS, 400000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	630 MHz	30 s	97	260 °C (500 °F)	20 mm
XC6SLX150-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	338	250 °C (482 °F)	23 mm
XC6SLX45T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	296		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	296	250 °C (482 °F)	23 mm
XCAU20P-L1SFVB784I	Xilinx	FPGA
XC7A25T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XCAU20P-L1FFVB676I	Xilinx	FPGA
XC7S15-1CPGA196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm		e1	1098 MHz		100		8 mm
XC7K325T-2FFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square		Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No	e1	1818 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7A100T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-2FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC6SLX100-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX4-2CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square		Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	120		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No	e1	667 MHz	30 s	120	260 °C (500 °F)	13 mm
XCAU20P-2SFVB784E	Xilinx	FPGA		Ball	784	FBGA	Square		Plastic/Epoxy	238437	Yes	.876 V	13625		228		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		13625 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm					228		23 mm
XC6SLX9-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	200		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	667 MHz	30 s	200	260 °C (500 °F)	15 mm
XCAU10P-2UBVA368I	Xilinx	FPGA		Ball	368	VFBGA	Rectangular		Plastic/Epoxy	96250	Yes	.876 V	5500		128		0.85		Grid Array, Very Thin Profile, Fine Pitch	BGA368,18X22,20		.825 V	.5 mm	100 °C (212 °F)		5500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B368		.692 mm	9.5 mm					128		11.5 mm
XC7S15-2FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		100		15 mm
XCKU040-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square		Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95	0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No	e1			520		35 mm
XCAU10P-L1SBVB484I	Xilinx	FPGA
XC6SLX9-2CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square		Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	160		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No	e1	667 MHz	30 s	160	260 °C (500 °F)	13 mm
XC7S6-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square		Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC3S50A-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	667 MHz	30 s	101	260 °C (500 °F)	20 mm
XC7S25-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1		Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		150		13 mm
XCAU25P-L1SFVB784I	Xilinx	FPGA
XC7A75T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K160T-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A50T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075	CMOS	250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1412 MHz	30 s	250	250 °C (482 °F)	23 mm
XC6SLX45-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7A35T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A200T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A35T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600	CMOS	250		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm		1.27 ns	2600 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	1098 MHz	30 s	250	250 °C (482 °F)	23 mm
XCAU25P-2SFVB784I	Xilinx	FPGA
XC7A12T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XQR5VFX130-1CN1752V	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS			1		Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No						45 mm
XC7S25-1CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		150		15 mm
XC6SLX75-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	400		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	862 MHz	30 s	400	250 °C (482 °F)	27 mm
XCAU25P-2FFVB676E	Xilinx	FPGA
XC6VLX760-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square		Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC7A200T-2SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1	1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No	e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XCAU10P-2SBVB484E	Xilinx	FPGA
XC7A35T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1412 MHz	30 s	250	260 °C (500 °F)	17 mm
XC3SD1800A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
XCAU10P-L1UBVA368I	Xilinx	FPGA
XCKU060-1FFVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square		Plastic/Epoxy	725550	Yes	.979 V	2760		624		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No	e1		30 s	624	245 °C (473 °F)	40 mm
XC7A12T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7S75-1FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	6000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm		e1	1098 MHz		400		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.