Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU040-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95	0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
XC7K325T-3FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7VX485T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700		1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No		e1	1818 MHz		700		45 mm
XC3S1400A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	148	260 °C (500 °F)	17 mm
XC7S25-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		150		15 mm
XC7S50-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		250		15 mm
XC7A15T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A50T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A75T-1FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	300		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7K325T-1FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K410T-2FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	500	245 °C (473 °F)	31 mm
XC6SLX45T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	296		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	296	250 °C (482 °F)	23 mm
XCKU035-2SFVA784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520		0.95	0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XC6SLX45-3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	310		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	310	260 °C (500 °F)	19 mm
XC7K410T-2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K70T-2FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	300		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S50-1FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		250		15 mm
XC6SLX25-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A200T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC6SLX100-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	480		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	480	250 °C (482 °F)	27 mm
XC3S100E-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC7A12T-3CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm
XCKU025-1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			312		35 mm
XC3S1600E-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	132	250 °C (482 °F)	21 mm
XCKU060-1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760		624		.95	0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No		e1		30 s	624	245 °C (473 °F)	35 mm
XC3S50A-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2	1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	667 MHz	30 s	101	260 °C (500 °F)	20 mm
XC6SLX45-3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	320		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	320	260 °C (500 °F)	19 mm
XC2V1000-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No		e1	650 MHz		328		31 mm
XC7A100T-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG	285		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0		30 s	285	225 °C (437 °F)	23 mm
XC3S1600E-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC7K70T-1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	285		1	1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC6SLX100T-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	376		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm	No		e1	862 MHz		376		27 mm
XC6SLX16-3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7K160T-3FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XCKU040-2FBVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95	0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
XC7A75T-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	300		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
XCKU040-L1SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520		0.9	0.9 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.88 V	.8 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No	Also Operates at 0.95 V nominal supply	e1			520		23 mm
XC7VX485T-1FF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	350		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		350
XCKU3P-1SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XC3S250E-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC7S100-2FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		400		23 mm
XC7S100-2FGGA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1286 MHz		400		27 mm
XCKU035-2FBVA900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95	0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XC7A75T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7K70T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	300		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S100-1FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
XC7VX690T-2FFG1927I	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	600		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC6SLX9-L1TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS	102		1	1,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	0.46 ns	715 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			102		20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.