Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A50T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No	e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7K325T-1FB676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	326080	Yes			CMOS	400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No	e0	1818 MHz	30 s	400	225 °C (437 °F)
XC7A15T-2CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
XC3S400-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	173	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	630 MHz	30 s	173	260 °C (500 °F)	17 mm
XC6SLX45-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	862 MHz	30 s	218	260 °C (500 °F)	15 mm
XQR5VFX130-1CN1752B	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS			1		Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No						45 mm
XC7A50T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7S50-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm		e1	1098 MHz		250		15 mm
XCAU25P-1FFVB676I	Xilinx	FPGA
XC6SLX25T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX25-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	266		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	266	250 °C (482 °F)	23 mm
XC7S25-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1286 MHz		150		15 mm
XC7A50T-3CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No	e1	1412 MHz	30 s	250	260 °C (500 °F)	10 mm
XC3S250E-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
XC7A15T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square		Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
XCAU15P-1UBVA368E	Xilinx	FPGA
XCKU035-2FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square		Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95	0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No	e1		30 s	520	245 °C (473 °F)	31 mm
XCKU3P-1FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	355950	Yes	.876 V	20340		304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1		30 s	304	250 °C (482 °F)	27 mm
XC6SLX150T-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	396		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	862 MHz	30 s	396	250 °C (482 °F)	27 mm
XC7K325T-2FFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	e1	1818 MHz	30 s	400	250 °C (482 °F)	27 mm
XC6SLX25T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XCAU20P-2FFVB676I	Xilinx	FPGA
XC7K160T-2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7A12T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC3S400-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	141	400000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	630 MHz	30 s	141	245 °C (473 °F)	28 mm
XC6SLX150T-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	296		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	296	250 °C (482 °F)	23 mm
XCKU035-1FBVA900C	Xilinx	FPGA	Other	Ball	900	BGA	Square		Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95	0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No	e1		30 s	520	245 °C (473 °F)	31 mm
XC7A12T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square		Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A75T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
XC3S400A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	195	400000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC7A35T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7S15-1CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm		e1	1098 MHz		100		13 mm
XC5VLX30T-1FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square		Plastic/Epoxy	30720	Yes	1.05 V	2400	CMOS	360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)		2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1	1098 MHz	30 s	360	250 °C (482 °F)	27 mm
XC7S50-1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm		e3	1098 MHz		250		15 mm
XC7A200T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K410T-2FFG900I	Xilinx	FPGA		Ball	900	BGA	Square		Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No	e1	1286 MHz	30 s	500	245 °C (473 °F)	31 mm
XC3S1400A-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC7A25T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC6SLX25T-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No	e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	358		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	358	250 °C (482 °F)	27 mm
XC6SLX150-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	338	250 °C (482 °F)	23 mm
XC7K70T-1FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	285		1	1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XCAU15P-1FFVB676I	Xilinx	FPGA
XCAU15P-2SBVB484E	Xilinx	FPGA
XC7A15T-1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square		Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC6SLX75-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square		Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	310		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	667 MHz	30 s	310	260 °C (500 °F)	19 mm
XC7K160T-2FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.