Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7S6-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469			100		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	469 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1286 MHz		100		15 mm
XCKU3P-1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340			304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC3S200-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		97	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	630 MHz	30 s	97	260 °C (500 °F)	20 mm
XC7K160T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	12675					.95		Grid Array			.93 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XCKU5P-2FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC6SLX150-3FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		570		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	862 MHz	30 s	570	250 °C (482 °F)	31 mm
XC7K160T-3FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XCKU040-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920			520		.95	0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1		30 s	520	245 °C (473 °F)	35 mm
XCKU060-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760			624		.95	0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No		e1			624		35 mm
XC7S6-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469			100		1		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		100		15 mm
XC7A75T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7S100-1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG		400		1		Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
XC3S400A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		195	400000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC7A15T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6SLX45-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		310		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	310	260 °C (500 °F)	19 mm
XCKU035-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700			520		.95	0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
XCKU060-1FFVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760			624		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
XC7A15T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XCKU3P-1FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340			304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC3S250E-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		66	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC7A15T-1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300					1		Grid Array			.95 V	1 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1					23 mm
XC2S600E-6FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	864	CMOS		514	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	514	250 °C (482 °F)	23 mm
XC6SLX75-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		280		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	280	250 °C (482 °F)	23 mm
XC7K325T-L2FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCAU10P-1FFVB676I	Xilinx	FPGA
XA6SLX45-3CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	218			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	218	260 °C (500 °F)
XC3S2000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		489	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	725 MHz	30 s	489	260 °C (500 °F)	27 mm
XC3S500E-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	176	260 °C (500 °F)	19 mm
XC7A100T-1FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		285		1		Grid Array			.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e0			285		23 mm
XC7A35T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC3SD1800A-4CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3S200A-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		68	200000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	667 MHz	30 s	62	260 °C (500 °F)	14 mm
XC7A75T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS		285		1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K325T-2FF900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900		3.35 mm	31 mm	No		e0	1818 MHz		500		31 mm
XCKU115-2FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC3S50A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	112	260 °C (500 °F)	17 mm
XC7A15T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300					1		Grid Array			.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1					23 mm
XC7K160T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285		1	1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XCAU20P-2SFVB784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625			228		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		13625 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm						228		23 mm
XC7K160T-L2FBG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	0.91 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
XC6SLX100-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm
XC3S1200E-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC6SLX16-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC6SLX25-3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A75T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	5900 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7K70T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		285		1	1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A35T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XCAU10P-1FFVB676E	Xilinx	FPGA

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.