Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU115-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	832	245 °C (473 °F)	42.5 mm
XC3S1000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1200E-4FTG256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC3S1400AN-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3S250E-4VQG100IS1	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	66	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC3S4000-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	489	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	630 MHz	30 s	489	260 °C (500 °F)	27 mm
XC4VLX60-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6656 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC6SLX150T-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XC6SLX45-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	310		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	310	260 °C (500 °F)	19 mm
XC6SLX75-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	400		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	400	225 °C (437 °F)	27 mm
XC6SLX9-2FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	186	225 °C (437 °F)	17 mm
XC7A25T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150		0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XC7A25T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A75T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1	1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7K325T-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K325T-1FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K325T-2FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1	1818 MHz	30 s	500	245 °C (473 °F)	31 mm
XCKU15P-1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668		.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1			668		35 mm
XCVU11P-1FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000		624		.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						624		47.5 mm
XQ6SLX75-2CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS	328			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	328	225 °C (437 °F)
XC2S30-5VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5	1.5/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	263 MHz	30 s	92	260 °C (500 °F)	14 mm
XC2VP50-5FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	812		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	5904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1050 MHz	30 s	812	225 °C (437 °F)	35 mm
XC3S50AN-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS		50000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.97 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	280 MHz				20 mm
XC3S50AN-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	770 MHz	30 s	101	260 °C (500 °F)	20 mm
XC3S700A-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	311	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC6SLX75-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	400		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	400	250 °C (482 °F)	27 mm
XC6SLX75T-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	268		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	268	250 °C (482 °F)	23 mm
XC7A200T-1FB484I	Xilinx	FPGA		Ball	484	HBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		285		1		Grid Array, Heat Sink/Slug			.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484		2.54 mm	23 mm			e0			285		23 mm
XC7A25T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-L2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG	150		0.9		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7K325T-1FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K480T-2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS	380		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	380	245 °C (473 °F)	31 mm
XC7S75-L1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	.98 V	6000	HKMG	400		0.95		Grid Array	BGA484,22X22,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
XC7VX690T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XCKU040-3FBVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	1920		520		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
XCKU040-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.927 V	1920		520		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No	Also Operates at 0.95 V nominal supply	e1			520		35 mm
XCKU15P-1FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668		0.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e1		30 s	668	245 °C (473 °F)	35 mm
XCKU3P-1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304		.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XCS30-3TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	576	Yes	5.5 V	576	CMOS	196	10000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		1.6 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e0	125 MHz	30 s	196	225 °C (437 °F)	20 mm
XCVU3P-L2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.742 V	49260		520		0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)		49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1		30 s	520	245 °C (473 °F)	40 mm
XCVU9P-L2FLGA2577E	Xilinx	FPGA
XC2S200-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		144	200000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	140	245 °C (473 °F)	28 mm
XC2V1500-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	650 MHz	30 s	392	250 °C (482 °F)	27 mm
XC3S1000-4FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.61 ns	1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S200-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS	97	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	480 CLBS, 200000 Gates		Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	630 MHz		97		20 mm
XC3S500E-4FTG256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	190	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	149	260 °C (500 °F)	17 mm
XC3S500E-4VQG100IS1	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	66	500000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC3S700A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	161	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	148	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.