Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5210-5PG223I	Xilinx	FPGA		Pin/Peg	223	HPGA	Square	Ceramic, Metal-Sealed Cofired	324	No	5.5 V	324	CMOS		196	10000	5	5 V	Grid Array, Heat Sink/Slug	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.6 ns	324 CLBS, 10000 Gates			Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	MAX available 16000 Logic gates		83 MHz		196		47.244 mm
XC6VLX195T-1FF784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No		e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC8101-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	384	Yes	5.25 V	384	CMOS		80	1000	5	3.3/5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	384 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	192 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	80	225 °C (437 °F)	20 mm
5962-8971302MNX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3S200AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC7VX415T-2FFV1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927		3.65 mm	45 mm			e1					45 mm
XC6VLX75T-2FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC5206-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	196	CMOS		81	6000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 10000 Logic gates	e0	83 MHz	30 s	81	240 °C (464 °F)	14 mm
XC3S1400AN-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No			667 MHz		288		23 mm
XC40110XV-08BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	4096	Yes	2.7 V	4096	CMOS		448	75000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 235000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC3090-70PG175CSPC0109	Xilinx	FPGA	Commercial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS			9000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)	9 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				42.164 mm
XC4406-3TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC4044XLA-08BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 80000 gates	e1	263 MHz	30 s		260 °C (500 °F)	35 mm
XC3030-50PC84ISPC0107	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				29.3116 mm
XC4062XLA-08HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 130000 gates	e0	263 MHz	30 s	384	225 °C (437 °F)	32 mm
XC7V2000T-2GFFG1925E	Xilinx
XC6VLX130T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A30T-1FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	33600	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No			1098 MHz		170		17 mm
XC5204-4PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	120	CMOS			4000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	3.8 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC7A50T-L2FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075	CMOS		250		.9	0.9 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.51 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 1 V supply	e1	1098 MHz	30 s	250	250 °C (482 °F)	23 mm
XCV300E-7FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	400 MHz	30 s	312	225 °C (437 °F)	23 mm
XC3090A-6PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		144	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	135 MHz	30 s	144	225 °C (437 °F)	28 mm
XC3330A-6PQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC4028XLA-07HQ240I	Xilinx	FPGA		Gull Wing	240	HLFQFP	Square	Plastic/Epoxy	1024	Yes			CMOS		256		3.3	3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		.5 mm					Tin Lead	Quad	S-PQFP-G240	3			No		e0	294 MHz	30 s	256	225 °C (437 °F)
XC4VSX55-12FF1148CS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes			CMOS		640			1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1148	4			No		e0	1205 MHz	30 s	640	225 °C (437 °F)
XC6SLX100-L1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS		326		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	326	250 °C (482 °F)	23 mm
XC4VSX25-11FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	23040	Yes	1.26 V	2560	CMOS		320		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2560 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4013E-3HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS		192	10000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	28 mm
XC3042-100PG84CSPC0107	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	144	CMOS			2000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000	e3	100 MHz				27.94 mm
XC3130A-4PG84I	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm		3.3 ns	100 CLBS, 1500 Gates			Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		227 MHz		74		27.94 mm
XCV200E-7FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC7VX415T-1FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600		1	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XCS05XL-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	238	Yes	3.6 V	100	CMOS		77	2000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e3	250 MHz	30 s	77	260 °C (500 °F)	14 mm
XC7A75T-L1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900			285		.95		Grid Array			.92 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1			285		23 mm
XC4036XL-08HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160	1	4.1 mm	28 mm	No	Typical gates = 22000-65000		238 MHz		288		28 mm
XC3342A-6TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC3S4000-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0					23 mm
XC7VX980T-2GFFG1928E	Xilinx	FPGA																										Tin Silver Copper								e1
XC7VX980T-3FFG1930E	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500			900		1		Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.58 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm			e1			900		45 mm
XCV600E-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		404	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV2000E-6FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e0	357 MHz	30 s	512	225 °C (437 °F)	40 mm
XCKU115-1FLVD1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XA6SLX25T-3FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	250			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	250	250 °C (482 °F)
XC3090A-7PG175I	Xilinx	FPGA		Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS		144	5000	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		5.1 ns	320 CLBS, 5000 Gates			Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Max usable 6000 Logic gates		113 MHz		144		42.164 mm
XC4006E-2PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	256	Yes	5.25 V	256	CMOS		128	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	28 mm
XC3120-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz		64		19.05 mm
XC4085XLA-09HQ208I	Xilinx	FPGA		Gull Wing	208	HFQFP	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		160	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4052XLA-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e0	227 MHz	30 s	352	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.