Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4010XL-3TQ176I	Xilinx	FPGA		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.6 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	24 mm
XC4036XL-1BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e0	200 MHz	30 s	288	225 °C (437 °F)	35 mm
XC3090-70CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28.702 mm
XC5VLX50-2FFV324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			220		1		Grid Array	BGA324,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm			e1		30 s	220	250 °C (482 °F)	19 mm
XCE7VX485T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		350		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s	350	245 °C (473 °F)	35 mm
XC4010E-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	7000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4010XL-3BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Grid Array			3 V	1.27 mm		1.6 ns	400 CLBS, 7000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XCV600-5BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS		316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	316	225 °C (437 °F)	40 mm
XC5210-6PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS			10000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC3142A-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm		3.3 ns	144 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 3000 Logic gates	e0	227 MHz	30 s	82	225 °C (437 °F)	20 mm
XC4310-4PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	S-PQFP-G160		4.1 mm	28 mm	No							28 mm
XC7K410T-1LFFG900I	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom		4			No		e1
XC4013E-3PGG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	576	CMOS			10000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		576 CLBS, 10000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No		e3	125 MHz				47.244 mm
XCV50-4HQ240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	384				57906	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm		0.8 ns	384 CLBS, 57906 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s		225 °C (437 °F)	32 mm
XC7VX485T-3FF1158E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		350		1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		350
XC5VLX20T-1FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS		172		1		Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm			e1		30 s	172	250 °C (482 °F)	19 mm
XQ6VLX130T-1LFFG1156C	Xilinx	FPGA																										Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			4					e1		30 s		245 °C (473 °F)
XC2018-70PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	10 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	174 flip-flops; typical gates = 1000-1500		70 MHz		74		27.94 mm
XC4VLX60-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4013XL-3PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 13000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	32 mm
XA6SLX25T-3FTG484I	Xilinx	FPGA																										Tin Silver Copper								e1
XQ6VLX240T-2RFG784E	Xilinx	FPGA																										Tin Silver Copper								e1
XC5215-6PQG299I	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	484				15000	5		Grid Array			4.5 V	2.54 mm		5.6 ns	484 CLBS, 15000 Gates		Matte Tin	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	23000 Logic gates can also be used	e3	36 MHz				52.324 mm
XC2S300E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	1536				93000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 300000	e0	357 MHz				20 mm
XC3S2000-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1					19 mm
XC4028XLA-07HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	0.9 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 50000 gates	e0	294 MHz		256		28 mm
XC4085XLA-09BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 180000 gates	e1	227 MHz	30 s		260 °C (500 °F)	42.5 mm
XC7A30T-2CSG324C	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	33600	Yes	1.05 V		CMOS		210		1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B324			15 mm	No			1286 MHz		210		15 mm
XCV150-4BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1.27 mm		0.8 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	27 mm
XC7A12T-2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A50T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075			250		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XCV1000-4BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS		404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	6144 CLBS, 1124022 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCE7VX485T-L2FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		700		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1930		3.65 mm	45 mm						700		45 mm
XC4013E-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2.7 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	111 MHz	30 s	192	225 °C (437 °F)	27 mm
XA3S50-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192		AEC-Q100	124	50000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		192 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	125 MHz	30 s	124	245 °C (473 °F)	28 mm
XA6SLX45-3FGG484C	Xilinx	FPGA																										Tin Silver Copper			3					e1				250 °C (482 °F)
XC7K325T-2LFFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475			350		0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s	350	245 °C (473 °F)	31 mm
XC4VFX12-12FFG668I	Xilinx																											Tin Silver Copper			4					e1		30 s		250 °C (482 °F)
XC3020A-2PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes			CMOS		64		5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3			No		e0	325 MHz	30 s	64	225 °C (437 °F)
XC7V2000T-2FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400					1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7VX485T-3FFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	75900			600		1		Grid Array			.97 V	1 mm	85 °C (185 °F)		75900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No		e1			600		35 mm
XC3190A-3PPG175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Plastic/Epoxy		No	5.25 V	320	CMOS			5000	5		Grid Array, Heat Sink/Slug			4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		4.191 mm	42.164 mm	No	Max usable 6000 Logic gates		270 MHz				42.164 mm
XC2VP20-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS		404		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	404	250 °C (482 °F)	27 mm
XC2V10000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	880 MHz	30 s		245 °C (473 °F)	35 mm
XC5204-5PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	120	CMOS			4000	5		Flatpack			4.5 V	.65 mm		4.6 ns	120 CLBS, 4000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC4003E-1PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			2000	5		Chip Carrier			4.5 V	1.27 mm			100 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	166 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC6SLX9-3NCSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	806 MHz				13 mm
XC6VSX475T-L1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS		840		.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.