Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCS20XL-3TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	3.6 V	400				20000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm		1.1 ns	400 CLBS, 20000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	179 MHz				20 mm
XC3190A-4TQG176I	Xilinx	FPGA		Gull Wing	176	LFQFP	Square		Plastic/Epoxy		Yes	5.5 V	320	CMOS			5000	5		Flatpack, Low Profile, Fine Pitch			4.5 V	.5 mm		3.3 ns	320 CLBS, 5000 Gates		Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	24 mm		Max usable 6000 Logic gates	e3	227 MHz	30 s		260 °C (500 °F)	24 mm
XQ6VSX315T-1RF1759E	Xilinx	FPGA																											Tin Lead			4					e0
XC6VLX130T-1LFFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	128000	Yes	.97 V	10000	CMOS		240				Grid Array	BGA484,22X22,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.86 mm	23 mm			e1		30 s	240	250 °C (482 °F)	23 mm
XC3S1500-4CPG132I	Xilinx	FPGA		Ball	132	TFBGA	Square		Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates			Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XCV600E-7FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square		Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XC2VPX20-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square		Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS		552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1350 MHz	30 s	552	225 °C (437 °F)	31 mm
XC5202-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XCS30XL-4TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.1 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 30000	e0	217 MHz	30 s	192	225 °C (437 °F)	20 mm
XC7VX550T-2FF1927I	Xilinx	FPGA		Ball	1924	BGA	Square		Plastic/Epoxy	554240	Yes			CMOS		600			1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		600
XC4010-5PG191C	Xilinx	FPGA	Other	Pin/Peg	191	PGA	Square		Ceramic, Metal-Sealed Cofired	400	No	5.25 V	400	CMOS		160	8000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Silver Copper	Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000	e1	133.3 MHz		160		47.244 mm
XC3S1400AN-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B484		2.6 mm	23 mm	No			770 MHz		288		23 mm
XC3342L-8TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes			CMOS				3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC6VCX130T-1FF484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		240		1	1,1.2/2.5,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.79 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XC3142A-3PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		270 MHz		74		27.94 mm
XC4036XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square		Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 65000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC2V3000-4BG728I	Xilinx	FPGA		Ball	728	BGA	Square		Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e0	650 MHz		516		35 mm
XC2VP20-8FF896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square		Plastic/Epoxy		Yes	1.575 V	2320	CMOS				1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0		30 s		225 °C (437 °F)	31 mm
XC4004A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		61	3200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	144 CLBS, 3200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 3200-4000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XCV150-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square		Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	23 mm
XCKU115-3FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square		Plastic/Epoxy	1451100	Yes	1.03 V	5520			832		1	1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC2S100E-6PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square		Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		202	37000	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm		0.47 ns	600 CLBS, 37000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 100000	e3	357 MHz	30 s	202	245 °C (473 °F)	28 mm
XCE7V585T-L2FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square		Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	45525 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XA3S100E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square		Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS			100000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	23 mm
XC4013XL-1BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	200 MHz	30 s	192	225 °C (437 °F)	27 mm
5962-8982303MXX	Xilinx	FPGA	Military	Pin/Peg	175	PGA	Square		Ceramic, Metal-Sealed Cofired		No		320	CMOS	MIL-STD-883		5000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No			100 MHz				42.164 mm
XC5210-4TQ176I	Xilinx	FPGA		Gull Wing	176	LFQFP	Square		Plastic/Epoxy	324	Yes	5.5 V	324	CMOS		196	10000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		3.8 ns	324 CLBS, 10000 Gates		Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Typical gates = 10000-16000	e0	83 MHz	30 s	196	225 °C (437 °F)	24 mm
XCE7K325T-1FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm								27 mm
XC7VX690T-3FFG1930C	Xilinx	FPGA																											Tin Silver Copper			4					e1
XC7V285T-1FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square		Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No		e1		30 s		245 °C (473 °F)	42.5 mm
XC7V585T-1FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4085XLA-08HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square		Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		160	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4020XLA-09PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 40000 gates	e0	227 MHz	30 s	224	225 °C (437 °F)	28 mm
XC4085XLA-9HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square		Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3	227 MHz				40 mm
XC4028XL-1BGG256I	Xilinx	FPGA		Ball	256	BGA	Square		Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm		1.3 ns	1024 CLBS, 18000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 28000 Logic gates	e1	200 MHz	30 s		250 °C (482 °F)	27 mm
XC4003-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	238	Yes	5.25 V	100	CMOS		61	2500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XQ6SLX150T-2CSG484Q	Xilinx	FPGA		Ball	484	BGA	Square		Plastic	147443	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B484				No			667 MHz		296
5962-9561001MUC	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 2000-3000	e4	188 MHz		96		37.084 mm
XCE7K420T-2FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square		Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG		400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XC4020-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	5.25 V	784	CMOS			16000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	6 ns	784 CLBS, 16000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	2016 flip-flops; typical gates = 16000-20000	e3		30 s		245 °C (473 °F)	28 mm
XC7K410T-1FB900C	Xilinx	FPGA		Ball	900	BGA	Square		Plastic/Epoxy	406720	Yes			CMOS		500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XC4VFX140-10FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square		Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS		896		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1028 MHz	30 s	896	225 °C (437 °F)	42.5 mm
XQVR300-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	QFP228(UNSPEC)	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XA3S400-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square		Plastic/Epoxy	8064	Yes				AEC-Q100	264			1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3			No		e0	125 MHz	30 s	264	225 °C (437 °F)
XC7A100T-L2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	101440	Yes	.93 V	7925			300		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC7A12T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XCV800-4BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square		Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	42.5 mm
XC5VLX30-2FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square		Plastic/Epoxy	30720	Yes	1.05 V	2400			220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.