Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5204-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	120	Yes	5.5 V	120	CMOS		124	4000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		3 ns	120 CLBS, 4000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 4000-6000	e0	83 MHz	30 s	124	240 °C (464 °F)	14 mm
XC4VLX25-10SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1028 MHz	30 s	240	260 °C (500 °F)
XCE7VX485T-3FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG		700		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm			e1		30 s	700	245 °C (473 °F)	42.5 mm
XC3030A-7PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4VFX40-11FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		448		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			4656 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1181 MHz	30 s	448	245 °C (473 °F)	35 mm
XC6VCX130T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7V585T-3FFG484E	Xilinx	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array					125 °C (257 °F)		91050 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4028XLA-08BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	1024 CLBS, 18000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	263 MHz	30 s	256	225 °C (437 °F)	27 mm
XA6SLX75-2FGG484C	Xilinx	FPGA																										Tin Silver Copper			3					e1				250 °C (482 °F)
XC3S5000-5FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes			CMOS		633			1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	3			No		e0		30 s	633	225 °C (437 °F)
XC4013XLA-8PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm		1 ns	576 CLBS, 10000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz				28 mm
XC6SLX16-N3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz		186		17 mm
XA3S1200E-4CPG132I	Xilinx	FPGA		Ball	132	TFBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS			1200000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz				8 mm
XCV300E-8FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	416 MHz	30 s	312	225 °C (437 °F)	23 mm
XQ6VLX550T-1LRF1759C	Xilinx	FPGA																										Tin Lead			4					e0
XC6VCX195T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.79 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV50-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS			57906	2.5		Grid Array, Thin Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	12 mm
XC7VX690T-L2FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		850		1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1761		3.5 mm	42.5 mm	No		e1	1818 MHz		850		42.5 mm
XC4025E-3HQ208C	Xilinx	FPGA	Commercial	Gull Wing	208	HLFQFP	Square	Plastic/Epoxy	1024	Yes			CMOS		256		5	5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3			No		e0		30 s	256	225 °C (437 °F)
XC5VLX30-2FFG324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e1		30 s	220	250 °C (482 °F)	19 mm
XC5VLX85T-2FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC4005-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS		112	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	28 mm
XC4025E-3PG299C	Xilinx	FPGA	Other	Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.25 V	1024	CMOS		256	15000	5	5 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	1024 CLBS, 15000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 25000 Logic gates		125 MHz		256		52.324 mm
XC5215-4PQG299C	Xilinx	FPGA	Other	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	484				15000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	23000 Logic gates can also be used	e3	48 MHz				52.324 mm
XC3S1400AN-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	667 MHz				20 mm
XC3S2000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1					17 mm
XC4028XLA-09HQG240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1.1 ns	1024 CLBS, 18000 Gates		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 50000 gates	e3	227 MHz				32 mm
XC4036XLA-07HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 65000 gates	e3	294 MHz	30 s		245 °C (473 °F)	28 mm
XC4052XLA-9BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	227 MHz				42.5 mm
XC3030-50PQ100CSPC0104	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				20 mm
XC4003H-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS		160	2500	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	200 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	28 mm
XCVU125-H1FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520			884		0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm		Also Operates at 1 V nominal supply	e1		30 s	884	245 °C (473 °F)	47.5 mm
XC2V10000-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC4036XL-1PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack			3 V	.65 mm			1296 CLBS, 22000 Gates			Quad	S-PQFP-G160		4.1 mm	28 mm	No			200 MHz				28 mm
XA6SLX4-2CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic/Epoxy	3840	Yes				AEC-Q100	132			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B225	3			No		e1	62.5 MHz	30 s	132	260 °C (500 °F)
XC3020-100CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500	e0	100 MHz				19.05 mm
XA3SD3400A-FGG676Q	Xilinx	FPGA		Ball	676		Rectangular	Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom	R-PBGA-B676	3			No		e1
XC7A25T-1CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XCV800-6BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		316	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	333 MHz	30 s	316	225 °C (437 °F)	40 mm
XC2VP7-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS		248		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	1200 MHz	30 s	248	225 °C (437 °F)	23 mm
XC5215-5PG299I	Xilinx	FPGA		Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.5 V	484	CMOS		244	15000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.6 ns	484 CLBS, 15000 Gates			Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Typical gates = 15000-23000		83 MHz		244		52.324 mm
XC6VCX130T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.79 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC2VPX20-6FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS		552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1200 MHz	30 s	552	225 °C (437 °F)	31 mm
XC4052XLA-09HQG208I	Xilinx	FPGA		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1.1 ns	1936 CLBS, 33000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 100000 gates	e3	227 MHz	30 s		245 °C (473 °F)	28 mm
XC4028XLA-08BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e1	263 MHz	30 s		250 °C (482 °F)	27 mm
XC4028XL-3BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	1024 CLBS, 18000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XC6SLX75-L1CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	74637	Yes			CMOS		328			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	328	225 °C (437 °F)
XC6SLX4-3TQG144Q	Xilinx	FPGA																										Matte Tin			3					e3		30 s		260 °C (500 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.