Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX25-1LFT256Q	Xilinx	FPGA																										Tin Lead			3					e0
XC7A35T-1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300			250		0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		250		10 mm
XC4052XLA-07HQ240I	Xilinx	FPGA		Gull Wing	240	HLFQFP	Square	Plastic/Epoxy	1936	Yes			CMOS		352		3.3	3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		.5 mm					Tin Lead	Quad	S-PQFP-G240	3			No		e0	294 MHz	30 s	352	225 °C (437 °F)
XC4028XL-09BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes			CMOS		256		3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No		e0	217 MHz	30 s	256	225 °C (437 °F)
XC3130A-2PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.2 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4VLX40-11FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			4608 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e1	1205 MHz	30 s	640	245 °C (473 °F)	35 mm
XC6SLX100T-3NFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XC7V855T-L1FFG1157C	Xilinx																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC4020XLA-08BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	784 CLBS, 13000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e0	263 MHz	30 s	224	225 °C (437 °F)	27 mm
XC3S700AN-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz				17 mm
XC6SLX75T-3CSG484Q	Xilinx	FPGA																										Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			3					e1		30 s		260 °C (500 °F)
5962-9225203MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	133.3 MHz		112		28.702 mm
XC3S50AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC6SLX9-N3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz		186		17 mm
XC2VPX70-5FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS		992		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin Lead	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1050 MHz	30 s	992	225 °C (437 °F)	42.5 mm
XC7A12T-L2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG		150		0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC5VLX30-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC3090-70CB164CSPC0107	Xilinx	FPGA	Other	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			5000	5		Flatpack, Guard Ring			4.75 V	.65 mm	85 °C (185 °F)	9 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28.702 mm
XQZU11EG-1FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85		Grid Array	BGA1760,42.5X42.5,40		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e0		40 s	512	245 °C (473 °F)	42.5 mm
XC7VX485T-2GFFG1158I	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC3142-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	270 MHz	30 s	82	225 °C (437 °F)	20 mm
XC3130-5PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		190 MHz		74		27.94 mm
XC4052XLA-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	263 MHz				40 mm
XC5210-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		196	10000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC4005XL-09PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 3000-9000	e0	217 MHz	30 s	112	225 °C (437 °F)	20 mm
XA3S400-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	264	260 °C (500 °F)	17 mm
XCKU11P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	512	245 °C (473 °F)	31 mm
XC5206-4PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	196	CMOS			6000	5		Flatpack			4.5 V	.65 mm		3.8 ns	196 CLBS, 6000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 6000-10000	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC5404L-4TQ176C	Xilinx	FPGA		Gull Wing	176	LFQFP	Square	Plastic/Epoxy		Yes							3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G176		1.6 mm	24 mm	No							24 mm
XC5202-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC4010E-4PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400				7000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		5.207 mm	47.244 mm		Max usable 20000 Logic gates		111 MHz				47.244 mm
XC5VLX330-2FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	1200	245 °C (473 °F)	42.5 mm
XC4013-5PQ256C	Xilinx	FPGA	Commercial	Gull Wing	256	QFP		Plastic/Epoxy	1368	Yes			CMOS		192		5	5 V	Flatpack	QFP256(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Quad					No			133.3 MHz		192
XC4VLX25-10SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1028 MHz	30 s	240	260 °C (500 °F)
XC4013E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC6VLX760-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS		1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XA6SLX45T-3FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	296			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XC4008E-4PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.5 V	324	CMOS			6000	5		Flatpack, Fine Pitch			4.5 V	.5 mm		2.7 ns	324 CLBS, 6000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 8000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	28 mm
XC4020XLA-9PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	227 MHz				32 mm
XC4036XLA-8HQ208I	Xilinx	FPGA		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1 ns	1296 CLBS, 22000 Gates		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	263 MHz				28 mm
XC7K480T-3FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325					1		Grid Array			.97 V	1 mm		0.58 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901		3.35 mm	31 mm			e1					31 mm
XA6SLX9-3FTG256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	9152	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XC7Z020-1CLG484E	Xilinx	FPGA SOC		Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			330	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm			e1		30 s	330	260 °C (500 °F)	19 mm
XC7V2000T-2LFHG1761E	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700			850		1		Grid Array	BGA1761,42X42,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm			e1			850		45 mm
XC5215-5BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.5 V	484	CMOS		244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.5 V	1.27 mm		4.6 ns	484 CLBS, 15000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Typical gates = 15000-23000	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XQ5VSX240T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.5 mm	42.5 mm	No		e0	1098 MHz		960		42.5 mm
XC2V6000-5FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS		1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	750 MHz	30 s	1104	225 °C (437 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.