Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5VLX50-2FFG1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			560		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e1		30 s	560	245 °C (473 °F)	35 mm
XC4010XL-09CTQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 10000 Logic gates	e3	217 MHz				20 mm
XC6VLX195T-1LFF784E	Xilinx	FPGA																										Tin Lead								e0
XC3164A-5PG132I	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.5 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.1 ns	224 CLBS, 3500 Gates			Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 3500-4500		188 MHz		110		37.084 mm
XC5215-6HQ240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy	484	Yes	5.5 V	484	CMOS		244	15000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		5.6 ns	484 CLBS, 15000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	32 mm
XCKU9P-3FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.927 V	34260			304		0.9		Grid Array	BGA900,30X30,40		.873 V	1 mm	100 °C (212 °F)		34260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XC40110XV-8BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.1 ns	4096 CLBS, 75000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	217 MHz				35 mm
5962-9230503MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes			CMOS	MIL-STD-883	160		5	5 V	Flatpack, Guard Ring	QFL196,1.4SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4	77 MHz		160		28.702 mm
XC3S200A-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	225 °C (437 °F)	17 mm
XC4010-10PG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	400	CMOS			8000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000						47.244 mm
XQ6VSX475T-1LRFG1156C	Xilinx	FPGA																										Tin Lead								e0
XQ6VSX315T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	24600	CMOS				1		Grid Array			.95 V	1 mm	85 °C (185 °F)	0.59 ns	24600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XCS30XL-4PQ208Q	Xilinx	FPGA	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	125 °C (257 °F)	1.1 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 30000	e0	217 MHz	30 s	192	225 °C (437 °F)	28 mm
XC7A25T-1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC4028EX-3PG299I	Xilinx	FPGA		Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	1024	No		1024	CMOS		256	18000	5	5 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays		2.54 mm			1024 CLBS, 18000 Gates			Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 28000 Logic gates		166 MHz		256		52.324 mm
XC4028EX-4HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1024	Yes		1024	CMOS		256	18000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 28000 Logic gates	e0	143 MHz	30 s	256	225 °C (437 °F)	32 mm
XCV100-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		166	108904	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	333 MHz	30 s	166	225 °C (437 °F)	32 mm
XC4VLX160-12FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS		768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		16896 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XCS20-3TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	7000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		1.6 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e0	125 MHz	30 s	160	225 °C (437 °F)	20 mm
XC3042A-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		96	2000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 3000 Logic gates	e0	135 MHz	30 s	96	225 °C (437 °F)	20 mm
XC5202L-3PQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	64	CMOS			2000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 2000-3000	e0					20 mm
XQKU095-2RFB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes		67200					.95		Grid Array							67200 CLBS		Tin Lead	Bottom	S-PBGA-B2104						e0
XC6SLX150-3NFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XC4013XLA-8BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1 ns	576 CLBS, 10000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	263 MHz				27 mm
XC2S600E-6FTGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC3142A-1TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.75 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		260 °C (500 °F)	20 mm
XC5VSX50T-3FFG665I	Xilinx																											Tin Silver Copper			4					e1		30 s		250 °C (482 °F)
XCVU160-3FLGC2104C	Xilinx	FPGA
5962-9471202MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	238	Yes			CMOS	MIL-STD-883	77		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	90.9 MHz		77		19.05 mm
5962-8863803MXC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4					27.94 mm
XA6SLX9-3CSG324C	Xilinx	FPGA																										Tin Silver Copper			3					e1				260 °C (500 °F)
XC4013E-1PQG208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.5 V	576	CMOS			10000	5		Flatpack, Fine Pitch			4.5 V	.5 mm			576 CLBS, 10000 Gates		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC6VLX240T-1LFF1156M	Xilinx	FPGA																										Tin Lead			4					e0
XCE7K410T-1FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	31775 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm						400		27 mm
XC3195A1PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 7500 Logic gates	e0	323 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC7A100T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	300	245 °C (473 °F)	35 mm
XC5VFX30T-2FFV665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS		360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	2560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC4VLX25-11FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC7V585T-3FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes		91050							Grid Array				1 mm			91050 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2VP50-7FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS		852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	5904 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	852	225 °C (437 °F)	40 mm
XC2VP2-5FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e1	1050 MHz	30 s	204	250 °C (482 °F)	27 mm
XQ4013XL-3BG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535	192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e0	166 MHz	30 s	192	225 °C (437 °F)	27 mm
XCKU115-1FLVA2104C	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
5962-8971303QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	7 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							100 MHz
XC6VLX75T-1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC3064-100PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.5 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA		100 MHz		110		37.084 mm
XC6VLX365T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC2S600E-7FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	864	CMOS		514	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	514	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.