Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3030A-7PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	1500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3042-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz		74		27.94 mm
XC3090A-7PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		138	5000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	113 MHz	30 s	138	225 °C (437 °F)	28 mm
XC3S1000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1000-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		173	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	630 MHz	30 s	173	225 °C (437 °F)	17 mm
XC3S1000-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		173	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	725 MHz	30 s	173	260 °C (500 °F)	17 mm
XC3S100E-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		83	100000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	72	260 °C (500 °F)	8 mm
XC3S100E-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S1200E-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	150	225 °C (437 °F)	17 mm
XC3S1200E-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		250	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	657 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S1200E-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	657 MHz	30 s	150	225 °C (437 °F)	17 mm
XC3S1400A-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S1400A-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XC3S1400A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XC3S1400A-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	770 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S1400A-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	770 MHz	30 s	148	260 °C (500 °F)	17 mm
XC3S1400AN-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	770 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3S1500-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1500-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1500-4FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	630 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S1500-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1500-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	725 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S1600E-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S1600E-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		376	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XC3S1600E-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		250	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	657 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S200-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		141	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	630 MHz		141		28 mm
XC3S200-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		141	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	480 CLBS, 200000 Gates		Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	630 MHz		141		28 mm
XC3S200-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		97	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	630 MHz		97		20 mm
XC3S2000-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S2000-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S2000-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		489	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		489		27 mm
XC3S2000-4FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	630 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S2000-4FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		565	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	630 MHz	30 s	565	250 °C (482 °F)	31 mm
XC3S200A-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		68	200000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.62 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	770 MHz	30 s	62	260 °C (500 °F)	14 mm
XC3S200AN-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	770 MHz	30 s	160	260 °C (500 °F)	17 mm
XC3S250E-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	572 MHz		80		20 mm
XC3S250E-4VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		66	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	572 MHz		59		14 mm
XC3S400-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		221	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	896 CLBS, 400000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S400-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		173	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.61 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	630 MHz	30 s	173	225 °C (437 °F)	17 mm
XC3S4000-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS		633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	725 MHz	30 s	633	250 °C (482 °F)	31 mm
XC3S400AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	770 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S5000-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS		633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	725 MHz	30 s	633	250 °C (482 °F)	31 mm
XC3S500E-4CPG132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3S700A-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		311	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC3S700A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		311	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3SD1800A-4CSG484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC4005E-4PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS		112	3000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 5000 Logic gates	e0	111 MHz	30 s	112	225 °C (437 °F)	28 mm
XC4010E-3HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	7000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.