Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU9P-1FLGA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.24 mm	47.5 mm						832		47.5 mm
XC6VLX760-2FF1760M	Xilinx	FPGA																										Tin Lead			4					e0
5962-8994802MTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XA3S400-4FT256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm			896 CLBS, 400000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	125 MHz	30 s	264	225 °C (437 °F)	17 mm
XC2S200E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS		289	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	225 °C (437 °F)	23 mm
XCSG40XL-5CSG280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array, Thin Profile, Fine Pitch			3 V	.8 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e1	250 MHz				16 mm
XC2S100E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	600				37000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	600 CLBS, 37000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 100000	e0	357 MHz				27 mm
XQ7A50T-L1CS325I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	52160	Yes	.98 V	4075	HKMG		150		.95	0.95 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.92 V	.8 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B324	3		15 mm	No		e0	1098 MHz		150		15 mm
XC6216-2PQG240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	5.5 V	4096	CMOS			16000	5		Flatpack, Fine Pitch			4.5 V	.5 mm	100 °C (212 °F)		4096 CLBS, 16000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Typical gates = 16000-24000	e3	111 MHz	30 s		245 °C (473 °F)	32 mm
XC4005XL-1PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	196	CMOS			3000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.3 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e3	200 MHz	30 s		245 °C (473 °F)	20 mm
XC3090-100PQ160ISPC0107	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS			5000	5		Flatpack			4.5 V	.65 mm		7 ns	320 CLBS, 5000 Gates			Quad	S-PQFP-G160		3.92 mm	28 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				28 mm
XC4005XL-09PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes		196	CMOS		112		3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3		29.3116 mm	No		e0	217 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
5962-9225201MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
XC7VX1140T-G2FFG1928E	Xilinx
XC4085XLA-8BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	263 MHz				42.5 mm
XQ7V585T-1RF1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG		600		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	45525 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157		3.48 mm	35 mm			e0			600		35 mm
XC7K325T-L2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475					.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XQ6VSX315T-2RF1759E	Xilinx	FPGA																										Tin Lead			4					e0
XC3S1500-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm
XC6SLX16-1LCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	500 MHz				15 mm
XCKU060-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.927 V	2760			624		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	624	245 °C (473 °F)	35 mm
XC3020-70PG84BSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		70 MHz				27.94 mm
XC3020-100PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		64	CMOS			1000	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500	e3	100 MHz				27.94 mm
XC2V2000-5BGG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS			2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No		e1	750 MHz				40 mm
XC7VX415T-2GFFG1927I	Xilinx	FPGA																										Tin Silver Copper			4					e1
XC5VLX20T-1FFG323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS		172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e1		30 s	172	250 °C (482 °F)	19 mm
XC4VLX60-11FF668IS2	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448			1.2,1.2/3.3,2.5 V	Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B668	4			No		e0	1205 MHz	30 s	448	225 °C (437 °F)
XC4VLX60-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS		448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			6656 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC40150XV-08HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 300000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	32 mm
XA7A15T-2CPG236I	Xilinx	FPGA		Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	HKMG		106		1		Grid Array, Low Profile, Fine Pitch			.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1		30 s	106	260 °C (500 °F)	10 mm
XC6SLX75T-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		320		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	320	250 °C (482 °F)	27 mm
XQ5VSX50T-1EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No		e0	1098 MHz		360		27 mm
XQ6VLX240T-1LRF1759C	Xilinx	FPGA																										Tin Lead			4					e0
XC2S50E-7PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 50000	e3	400 MHz	30 s	182	245 °C (473 °F)	28 mm
XCV100E-6CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		94	32400	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	357 MHz	30 s	94	260 °C (500 °F)	12 mm
XCV100E-7PQG240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		158	32400	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm		0.42 ns	600 CLBS, 32400 Gates		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	400 MHz	30 s	158	245 °C (473 °F)	32 mm
XQ4VLX60-10EFG668M	Xilinx	FPGA	Military	Ball	668	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS						Grid Array	BGA668,26X26,40		1.14 V	1 mm	125 °C (257 °F)	0.78 ns		-55 °C (-67 °F)		Bottom	S-PBGA-B668		2.85 mm	27 mm								27 mm
XC4036EX-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes		1296	CMOS		288	22000	5	5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e0	166 MHz	30 s	288	225 °C (437 °F)	40 mm
XC5VSX50T-3FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	4080 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC3090-70CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	70 MHz		142		28.702 mm
XC3130A-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	370 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4VLX100-11FF1148IS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes			CMOS		768			1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1148	4			No		e0	1205 MHz	30 s	768	225 °C (437 °F)
XCVU125-1FLVA2104E	Xilinx																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XCVU13P-2LFHGA2104E	Xilinx	FPGA
XC4044XLA-07HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Can also use 80000 gates		294 MHz				32 mm
XC4062XLPG475C	Xilinx	FPGA		Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	2304	CMOS			40000	5		Grid Array, Heat Sink/Slug, Interstitial Pitch			4.75 V	2.54 mm			2304 CLBS, 40000 Gates			Perpendicular	S-CPGA-P475		5.334 mm	54.864 mm	No	Typical gates = 40000-130000						54.864 mm
XC4036XL-09HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.2 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 22000-65000	e0	217 MHz	30 s	288	225 °C (437 °F)	28 mm
XC4020XL-09HTG144C	Xilinx	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No	Typical gates = 13000-40000	e3	217 MHz				20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.