Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VHX255T-2FF1155I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS		440		1	1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1286 MHz		440		35 mm
XC5202-6VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		84	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	14 mm
XC3330A-3PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No							24.2316 mm
XC7A12T-L1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG		150		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC4005H-6MQ240I	Xilinx	FPGA	Industrial	Gull Wing	240	FQFP	Square	Metal	466	Yes	5.5 V	196	CMOS		192	4000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)		Quad	S-MQFP-G240	1	4.19 mm	31.64 mm	No	392 flip-flops; typical gates = 4000-5000		90.9 MHz		192		31.64 mm
XC4VFX60-11FF672IS1	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS		352			1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4			No		e0	1181 MHz	30 s	352	220 °C (428 °F)
XC6VLX240T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
5962-9752201QXC	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	466	No	5.5 V	196	CMOS	MIL-PRF-38535 Class Q	112	3000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	3.9 ns	196 CLBS, 3000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Typical gates = 3000-9000	e4	111 MHz		112		42.164 mm
XC7VX485T-3FFG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900					1		Grid Array			.97 V		100 °C (212 °F)		75900 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC7K325T-2FBV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC6VSX475T-1LFF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V	37200	CMOS		600		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	37200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e0			600		35 mm
XC5204-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS		124	4000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	240 °C (464 °F)	14 mm
XQ6VLX240T-2RF1759M	Xilinx	FPGA	Military	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS		720		1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	18840 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			720		42.5 mm
XCV50-6HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	384				57906	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	333 MHz	30 s		225 °C (437 °F)	32 mm
5962-9850901QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V		CMOS	MIL-PRF-38535 Class Q	192	28000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.68 mm	No		e4	143 MHz		192		39.68 mm
XC7A15T-L2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300			250		0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-L1CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300			250		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC4005-5PG156C	Xilinx	FPGA	Other	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS		112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P156		3.683 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000	e3	133.3 MHz		112		42.164 mm
XC4013XL-3PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC4VLX40-12FFG668I	Xilinx																											Tin Silver Copper			4					e1		30 s		250 °C (482 °F)
XC4085XLA-8HQG240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1 ns	3136 CLBS, 55000 Gates		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	263 MHz				32 mm
XC3S1000-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm
XC4003A-6PG120I	Xilinx	FPGA	Industrial	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No	5.5 V	100	CMOS		80	2500	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P120		3.81 mm	34.544 mm	No	360 flip-flops; typical gates = 2500-3000		90.9 MHz		80		34.544 mm
5962-9561001MUX	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS			2000	5		Grid Array				2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 2000-3000		188 MHz				37.084 mm
XC6VSX315T-1LFF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.93 V								Grid Array			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0					35 mm
XC5410-4PG223I	Xilinx	FPGA		Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm						Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No							47.244 mm
XA3S1500-4FG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes				AEC-Q100	487			1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3			No		e0	125 MHz		487
XCE7VX550T-L2FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	43300					1		Grid Array			.97 V	1 mm		0.61 ns	43300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC3S200AN-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	770 MHz				27 mm
XC7K355T-1FFG901E	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1		Grid Array	BGA901,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1					31 mm
XC2V2000-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	750 MHz	30 s	456	250 °C (482 °F)	27 mm
XQ6VLX550T-1RF1759E	Xilinx	FPGA																										Tin Lead			4					e0
XC6VLX130T-1LFF784M	Xilinx	FPGA																										Tin Lead								e0
XC2V4000-6BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0	820 MHz	30 s	684	225 °C (437 °F)	40 mm
XC5VLX155T-2FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	12160 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC7A200T-1FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array			.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.1 mm	35 mm			e1			500		35 mm
XC4VFX12-12SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XCVU125-1FLVB1760E	Xilinx																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC4013XL-1HTG144C	Xilinx	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No	Max usable 13000 Logic gates	e3	200 MHz				20 mm
XC5VLX220T-3FF1738C	Xilinx	FPGA		Ball	1738	BGA	Square	Plastic/Epoxy	221184	Yes			CMOS		680			1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1738	4			No		e0	550 MHz	30 s	680	225 °C (437 °F)
XC4052XLA-09BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e1	227 MHz	30 s		260 °C (500 °F)	42.5 mm
XC6SLX150T-3NCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XC4044EX-4BGG432C	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	5.25 V	1600	CMOS			27000	5		Grid Array, Low Profile			4.75 V	1.27 mm	85 °C (185 °F)		1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.65 mm	40 mm	No	Typical gates = 27000-80000	e1	111 MHz				40 mm
XC3S1000-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0					20 mm
XA7S15-2CPGA196I	Xilinx																														3							30 s		260 °C (500 °F)
XC3S1400A-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz	30 s	148	225 °C (437 °F)	17 mm
XC6VHX565T-3FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V	44280	CMOS		720		1		Grid Array	BGA1923,44X44,40		.95 V	1 mm	85 °C (185 °F)	0.59 ns	44280 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm			e1		30 s	720	245 °C (473 °F)	45 mm
XC4025E-3PG223M	Xilinx	FPGA	Military	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	784	CMOS			13000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		784 CLBS, 13000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P223		4.318 mm	47.244 mm	No			125 MHz				47.244 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.