Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV200E-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		158	63504	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	357 MHz	30 s	158	225 °C (437 °F)	32 mm
XC4085XLA-07HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		256	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Can also use 180000 gates	e0	294 MHz	30 s	256	225 °C (437 °F)	40 mm
XC4036XLA-08HQ208I	Xilinx	FPGA		Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1 ns	1296 CLBS, 22000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 65000 gates	e0	263 MHz	30 s	288	225 °C (437 °F)	28 mm
XC2VP20-8FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS				1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC4085XLA-9HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	227 MHz	30 s		225 °C (437 °F)	32 mm
XQ5VFX100T-1EF1738M	Xilinx	FPGA	Military	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8960	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	0.9 ns		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1738		3.5 mm	42.5 mm	No		e0	1098 MHz		680		42.5 mm
XCKU035-1FBVA900E	Xilinx	FPGA	Commercial Extended	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	520	245 °C (473 °F)	31 mm
XC2S50E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	225 °C (437 °F)	28 mm
XQVU095-1RFC1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes		67200			520		.95		Grid Array					100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517			40 mm			e0			520		40 mm
XC7K480T-1FF1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		400
XC7K410T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775					.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC7A25T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XC4005XL-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e0	166 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC4052XL-3PG411I	Xilinx	FPGA		Pin/Peg	411	HPGA	Square	Ceramic, Metal-Sealed Cofired	1936	No	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Heat Sink/Slug	SPGA411,39X39	Field Programmable Gate Arrays	3 V	2.54 mm		1.6 ns	1936 CLBS, 33000 Gates			Perpendicular	S-CPGA-P411		5.969 mm	52.324 mm	No	Max usable 52000 Logic gates		166 MHz		352		52.324 mm
5962-9851101QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	5472	Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class Q	192	40000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 130000	e4	166 MHz		192		39.37 mm
XC4036XLA-07BG352I	Xilinx	FPGA		Ball	352	BGA	Square	Plastic/Epoxy	1296	Yes			CMOS		288		3.3	3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Bottom	S-PBGA-B352	3			No		e0	294 MHz	30 s	288	225 °C (437 °F)
XC3130A-3PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 2000 Logic gates	e3	270 MHz	30 s		245 °C (473 °F)	20 mm
XC4VFX40-12FFG672CS1	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		352		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.15 ns	4656 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4VLX100-12FF1148CS2	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V		CMOS		768		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XCS20XL-5CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 20000	e0	250 MHz	30 s	160	240 °C (464 °F)	12 mm
XC6SLX150T-3NFG484Q	Xilinx	FPGA																										Tin Lead			3					e0
XC7K480T-2FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS		380		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	380	245 °C (473 °F)	31 mm
XC4VLX160-12FFG1148I	Xilinx																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC4013XLA-09BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1.1 ns	576 CLBS, 10000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 30000 gates	e1	227 MHz	30 s		250 °C (482 °F)	27 mm
XCS10XL-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196				3000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3		30 s		245 °C (473 °F)	29.3116 mm
XC7K325T-1LFBG900C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1		30 s		245 °C (473 °F)
XQ4013E-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535	192	10000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates = 30000	e0	111 MHz		192		39.37 mm
XA6SLX16-2FGG256Q	Xilinx	FPGA																										Tin Silver Copper			3					e1
XC3090-70PQ160ISPC0107	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS			5000	5		Flatpack			4.5 V	.65 mm		9 ns	320 CLBS, 5000 Gates		Tin Lead	Quad	S-PQFP-G160		3.92 mm	28 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28 mm
XC5VSX50T-1FFG665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC4013E-2PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS			10000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 13000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	32 mm
XC3042-70CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				19.05 mm
XC6VLX550T-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS		1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC2V40-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS		88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	650 MHz	30 s	88	260 °C (500 °F)	17 mm
XC5406L-4PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes							3.3		Flatpack				.65 mm						Quad	S-PQFP-G160		4.1 mm	28 mm	No							28 mm
XC6SLX150-3NFGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XCVU125-L1FLVA2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	1200					.9		Grid Array			.873 V				1200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104						e1
XCS40XL-3PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784				13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3		30 s		245 °C (473 °F)	32 mm
XCS05XL-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	100				2000	3.3		Chip Carrier			3 V	1.27 mm			100 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3					29.3116 mm
XC2VP40-7FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1350 MHz	30 s	804	225 °C (437 °F)	35 mm
XC4020XL-2PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.5 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 20000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	28 mm
XC7V1500T-2LFLG1761C	Xilinx	FPGA
XC6SLX45T-3NFG484Q	Xilinx	FPGA																										Tin Lead			3					e0
XCKU060-1FFVA1156E	Xilinx	FPGA	Commercial Extended	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			624		35 mm
XCKU115-2FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520			832		.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC5404L-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes							3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC3S500E-4FG320IS1	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		232	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC6SLX100T-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS		376			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0		30 s	376	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.