Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4062XL-09HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3			Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No	Typical gates = 40000-130000		217 MHz				40 mm
XCS10-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS		112	3000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAXIMUM usable gates 10000	e0	166 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC3064-100PQ160CSPC0107	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS			3500	5			Flatpack			4.75 V	.65 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		3.92 mm	28 mm	No	688 flip-flops; typical gates = 3500-4500		100 MHz				28 mm
5962-8971302MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5			Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC8106-ESPQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	1728	CMOS			5616	5			Flatpack			4.5 V	.65 mm	85 °C (185 °F)	5.5 ns	1728 CLBS, 5616 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 78 I/OS; MAX 864 flip-flops; OTP based						20 mm
XCV1600E-8BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		404	419904	1.8		1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC5VLX110-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1		1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC4VFX20-10FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2			Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2136 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC4VLX40-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		448		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC3S100E-4CPG132IS1	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		83	100000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	72	260 °C (500 °F)	8 mm
XC3142-2PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No			CMOS		96		5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-PPGA-P132				No			325 MHz		96
XC4036XL-1BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3			Grid Array, Low Profile			3 V	1.27 mm		1.3 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	40 mm
XC2VP20-8FFG896I	Xilinx	FPGA		Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS				1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1		30 s		245 °C (473 °F)	31 mm
XC4052XLA-7BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3			Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	294 MHz				42.5 mm
XC3142A-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		74	2000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	144 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	270 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4020XL-09CHTG176C	Xilinx	FPGA	Other	Gull Wing	176	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G176		1.6 mm	24 mm	No	Max usable 20000 Logic gates	e3	217 MHz				24 mm
XC6VHX565T-3FFG1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V	44280	CMOS		640		1			Grid Array	BGA1924,44X44,40		.95 V	1 mm	85 °C (185 °F)	0.59 ns	44280 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm			e1		30 s	640	245 °C (473 °F)	45 mm
XCKU115-1LFLVD1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS		338		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	338	245 °C (473 °F)	40 mm
XC2V1500-4FF676C	Xilinx																												Tin Lead			4					e0		30 s		225 °C (437 °F)
XCVU125-L1FLVA2104C	Xilinx	FPGA																											Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC3064-50PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No		224	CMOS		110	3500	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		224 CLBS, 3500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA		50 MHz		110		37.084 mm
XC5202-3VQG64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5			Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	10 mm
XC7VX415T-3FFG1927I	Xilinx	FPGA	Industrial	Ball	1927	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG		600		1			Grid Array	BGA1927,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.75 mm	45 mm			e1			600		45 mm
XC4025E-3BG432I	Xilinx	FPGA																											Tin Lead			3					e0
XCV800-4BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		316	888439	2.5		1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	250 MHz	30 s	316	225 °C (437 °F)	40 mm
XCVU125-3FLVB2104I	Xilinx																												Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC6SLX100-3NFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XC4028XLA-07HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3		3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 50000 gates	e0	294 MHz	30 s	256	225 °C (437 °F)	32 mm
XC4028XLA-7HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3			Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	0.9 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	294 MHz				28 mm
XC7VX485T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC3142A-3TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		96	2000	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		2.7 ns	144 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 3000 Logic gates	e0	270 MHz	30 s	96	225 °C (437 °F)	20 mm
XQKU5P-2SFRB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.52 mm	23 mm			e0		20 s	304	225 °C (437 °F)	23 mm
XCVU27P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000			676		0.9			Grid Array	BGA2577,51X51,40		.873 V	1 mm	100 °C (212 °F)		162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						676		52.5 mm
XC6VLX130T-2FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1		1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
5962-9957501QXB	Xilinx	FPGA	Military	Pin/Peg	475	HIPGA	Square	Ceramic, Metal-Sealed Cofired		No	3.6 V	3136	CMOS	MIL-PRF-38535 Class Q		55000	3.3			Grid Array, Heat Sink/Slug, Interstitial Pitch			3 V	2.54 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P475		5.969 mm	54.864 mm	No		e0	200 MHz				54.864 mm
XC4008E-4PGG191M	Xilinx	FPGA	Military	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	324	CMOS			6000	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		324 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No		e3	111 MHz				47.244 mm
XCKU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XA6SLX16-3CSG225Q	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic/Epoxy	14579	Yes				AEC-Q100	160				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B225	3			No		e1	62.5 MHz	30 s	160	260 °C (500 °F)
XA3S1600E-4FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	376	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XCV600-4FG600I	Xilinx	FPGA		Ball	600	BGA		Plastic/Epoxy	15552	Yes			CMOS		404				1.2/3.6,2.5 V	Grid Array	BGA600(UNSPEC)	Field Programmable Gate Arrays								Bottom					No					404
XC7A75T-L2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900			300		0.9		0.9 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.51 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
DY6009EQ240EC	Xilinx	FPGA		Gull Wing	240	HLFQFP	Square	Plastic/Epoxy	256	Yes	3.47 V	256	CMOS		128		3.3		3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240				No		e0			128
XC3190-5PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		138	5000	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	190 MHz	30 s	138	225 °C (437 °F)	28 mm
XC2S400E-6FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		410	145000	1.8		1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 400000	e0	357 MHz	30 s	410	240 °C (464 °F)	17 mm
XA6SLX75-3FGG676C	Xilinx	FPGA																											Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			3					e1		30 s		250 °C (482 °F)
XC6SLX150T-3NFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XC3S4000-5FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes			CMOS		633				1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	3			No		e0		30 s	633	225 °C (437 °F)
XCVU125-L1FLVB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	1200					.9			Grid Array			.873 V				1200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104						e1

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.