Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4036XL-09BG352I	Xilinx	FPGA		Ball	352	BGA	Square		Plastic/Epoxy	1296	Yes			CMOS		288		3.3	3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3			No		e0	217 MHz	30 s	288	225 °C (437 °F)
XC5202-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square		Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		84	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		3 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 2000-3000	e0	83 MHz	30 s	84	240 °C (464 °F)	14 mm
XC6SLX4-L1CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square		Plastic/Epoxy	3840	Yes	1.05 V	300	CMOS		120		1	1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1		30 s	120	260 °C (500 °F)	13 mm
XC7V285T-3FFG784I	Xilinx	FPGA		Ball	784	BGA	Square		Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B784	4			No		e1		30 s		245 °C (473 °F)
XC3195A-5PG223I	Xilinx	FPGA		Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	484	No	5.5 V	484	CMOS		176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.1 ns	484 CLBS, 6500 Gates			Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 6500-7500		188 MHz		176		47.244 mm
XC3130A-5VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square		Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		80	1500	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		4.1 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 1500-2000	e0	188 MHz	30 s	80	240 °C (464 °F)	14 mm
XC2V3000-6BG728I	Xilinx	FPGA		Ball	728	BGA	Square		Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	3584 CLBS, 3000000 Gates		Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No		e0	820 MHz		516		35 mm
XCV100-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy		Yes	2.625 V	600	CMOS			108904	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XC8103-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy	1024	Yes	5.25 V	1024	CMOS		128	3000	5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	1024 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	512 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	128	225 °C (437 °F)	29.3116 mm
XC2V10000-4FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square		Plastic/Epoxy		Yes	1.575 V	15360	CMOS			10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	765 MHz	30 s		225 °C (437 °F)	35 mm
XC3S200AN-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.36 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	770 MHz				20 mm
XC6VCX195T-2FFG784I	Xilinx	FPGA		Ball	784	BGA	Square		Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XQ6SLX150-L1FG484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	147443	Yes			CMOS		338			1,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	338	225 °C (437 °F)
XC2V2000-5BGG957I	Xilinx	FPGA		Ball	957	HBGA	Square		Plastic/Epoxy		Yes	1.575 V	2688	CMOS			2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No		e1	750 MHz				40 mm
XC7A15T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	16640	Yes	1.05 V	1300			250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC5VLX330T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square		Plastic/Epoxy	331776	Yes	1.05 V	25920			960		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	960	245 °C (473 °F)	42.5 mm
XC4VFX60-11FF1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	56880	Yes			CMOS		576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1181 MHz	30 s	576	225 °C (437 °F)
XC6SLX100T-3NFGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XC7V855T-3FFG484C	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4003E-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square		Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		80	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		1.6 ns	100 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	125 MHz	30 s	80	225 °C (437 °F)	29.3116 mm
XC7K420T-2LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	416960	Yes	.93 V	32575			400		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	250 °C (482 °F)	35 mm
XC6VCX130T-1FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square		Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.79 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
5962-8982301ZC	Xilinx	FPGA	Military	Flat	164	QFF	Square				Yes	5.5 V	320	CMOS	MIL-STD-883		9000	5		Flatpack			4.5 V	1.27 mm	125 °C (257 °F)	14 ns	320 CLBS, 9000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F164		2.92 mm		No		e4	16 MHz
XC7V1500T-1FFG484C	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy		Yes		229050							Grid Array							229050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4			No		e1		30 s		250 °C (482 °F)
XC4005L-6PQG208C	Xilinx	FPGA		Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 3000-9000	e3					28 mm
XC6SLX4-2TQG144Q	Xilinx	FPGA																											Matte Tin			3					e3		30 s		260 °C (500 °F)
XC3S4000-4FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square		Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS		712	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	630 MHz	30 s	712	245 °C (473 °F)	35 mm
XQ5VSX50T-2EF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square		Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665		2.9 mm	27 mm	No		e0	1265 MHz		360		27 mm
XC4005E-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4044XL-2HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square		Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 44000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	28 mm
XC2V3000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square		Plastic/Epoxy		Yes	1.575 V	3584	CMOS			3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1					40 mm
XC5206-3VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	5.25 V	196	CMOS			6000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC7A50T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XCV200-5FGG456I	Xilinx	FPGA		Ball	456	BGA	Square		Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm		0.7 ns	1176 CLBS, 236666 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	23 mm
XC4010XL-3PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	20 mm
XC5VSX240T-2FF1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square		Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS		960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	18720 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	960	225 °C (437 °F)	42.5 mm
XC4013D-6PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	576	Yes	5.25 V	576	CMOS		192	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	28 mm
XC3090-50PP175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square		Plastic/Epoxy	320	No	5.5 V	320	CMOS		144	9000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops	e0	50 MHz		144		42.164 mm
XC4005H-6PG223I	Xilinx	FPGA	Industrial	Pin/Peg	223	PGA	Square		Ceramic, Metal-Sealed Cofired	466	No	5.5 V	196	CMOS		190	4000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	392 flip-flops; typical gates = 4000-5000	e0	90.9 MHz		190		47.244 mm
XC4020-6PQ240I	Xilinx	FPGA	Industrial	Gull Wing	240	FQFP	Square		Plastic/Epoxy	1862	Yes	5.5 V	784	CMOS		193	16000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	784 CLBS, 16000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	2016 flip-flops; typical gates = 16000-20000	e0	90.9 MHz	30 s	193	225 °C (437 °F)	32 mm
XA6SLX45-3FG484C	Xilinx	FPGA																											Tin/Lead (Sn63Pb37)			3					e0		30 s		225 °C (437 °F)
XQVR600-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS		316	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	QFP228(UNSPEC)	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
XC4005-10PG156M	Xilinx	FPGA	Military	Pin/Peg	156	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	196	CMOS			4000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P156		3.683 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000						42.164 mm
XC2VP125-5FFG1704I	Xilinx	FPGA		Ball	1704	BGA	Square		Plastic/Epoxy		Yes	1.575 V	13904	CMOS				1.5		Grid Array			1.425 V	1 mm		0.36 ns	13904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e1	1050 MHz	30 s		245 °C (473 °F)	42.5 mm
XC6VLX240T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square		Plastic/Epoxy	241152	Yes			CMOS		600			1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1286 MHz	30 s	600	245 °C (473 °F)
XC7VX690T-1FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		720		1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	54150 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No		e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XC2VP20-7BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square		Plastic/Epoxy		Yes	1.575 V	2320	CMOS				1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XQKU15P-1FFRE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square		Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm			e0		20 s	564	225 °C (437 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.