Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC8101-2PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	384	CMOS			1000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	192 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XCVU7P-3FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.927 V	98520			832		0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC7A15-3FTG256E	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	15360	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns		0 °C (32 °F)		Bottom	S-PBGA-B256			17 mm	No			1412 MHz		170		17 mm
XCVU095-1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			832		0.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XC5204-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS		124	4000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	240 °C (464 °F)	14 mm
XA3S200-4VQ100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	125 MHz	30 s	173	240 °C (464 °F)	14 mm
XCV405E-6BGG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	70 °C (158 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357 MHz	30 s		260 °C (500 °F)	42.5 mm
XC5402-4PG156I	Xilinx	FPGA		Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm						Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No							42.164 mm
5962-9752301QZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535 Class Q	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e4	111 MHz		160		34.29 mm
XC7K325T-2FB900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS		500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e0	1818 MHz	30 s	500	225 °C (437 °F)	31 mm
XC2S100E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC5202-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		84	2000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	225 °C (437 °F)	20 mm
XQ6VSX315T-1RF1759I	Xilinx	FPGA																										Tin Lead								e0
XC7A35T-L2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600			250		0.9		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A100T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC4013XL-1PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm		1.3 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e0	200 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4062XL-08CHQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS		256	40000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Max usable 62000 Logic gates	e0	238 MHz	30 s	256	225 °C (437 °F)	40 mm
XC4052XL-3BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XC5VLX110-2FF1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	800	225 °C (437 °F)	35 mm
XC5VLX110T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC4005-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS		112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC4VLX160-11FFG1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS		960		1.2		Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		16896 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e1	1205 MHz	30 s	960	245 °C (473 °F)	40 mm
XC6SLX45-L1FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		358		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		30 s	358	225 °C (437 °F)	27 mm
XC7V855T-1LFFG1157C	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy		Yes									Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1157	4		35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC6SLX150T-3FG900Q	Xilinx	FPGA																										Tin Lead			3					e0
XA7S25-2FTGB196I	Xilinx
XC40110XV-09BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	4096	Yes	2.7 V	4096	CMOS		448	75000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.3 ns	4096 CLBS, 75000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 235000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	40 mm
XC3190A-5PP175I	Xilinx	FPGA		Pin/Peg	175	PGA	Square	Plastic/Epoxy	320	No	5.5 V	320	CMOS		144	5000	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.1 ns	320 CLBS, 5000 Gates			Perpendicular	S-PPGA-P175	1	4.191 mm	42.164 mm	No	Typical gates = 5000-6000		188 MHz		144		42.164 mm
XC4013XLA-9BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	227 MHz				27 mm
XCV1000E-7HQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		158	331776	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	400 MHz	30 s	158	225 °C (437 °F)	32 mm
XC3S500E-5VQG100CS1	Xilinx	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	10476	Yes			CMOS		66			1.2,1.2/3.3,2.5 V	Flatpack	TQFP100,.63SQ	Field Programmable Gate Arrays		.5 mm					Matte Tin	Quad	S-PQFP-G100	3			No		e3	657 MHz	30 s	59	260 °C (500 °F)
XC4010XL-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 7000-20000	e0	217 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3342A-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
XA6SLX45-3FG676Q	Xilinx	FPGA																										Tin Lead			3					e0
5962-8982302MUA	Xilinx	FPGA	Military	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		3.683 mm	27.432 mm	No		e0					27.432 mm
XC6VLX75T-1LFF784E	Xilinx	FPGA																										Tin Lead								e0
XCV200-6PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		166	236666	2.5	1.2/3.6,2.5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm		0.6 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	333 MHz	30 s	166	225 °C (437 °F)	32 mm
XC4028XL-3BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e0	166 MHz	30 s	256	225 °C (437 °F)	35 mm
XC5VLX50T-2FFV665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600			360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC3130A-09PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 2000 Logic gates	e3	370 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4VLX40-12FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS		640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	640	225 °C (437 °F)	35 mm
XC3S100E-5TQG144CS1	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	657 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3142-5PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		96		37.084 mm
XC5406-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC6VLX240T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1286 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC2S150E-6PQGG208I	Xilinx	FPGA		G	208	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	Maximum usable gates = 150000	e3	357 MHz				28 mm
XC4062XLA-9HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	227 MHz	30 s		225 °C (437 °F)	32 mm
XC5210-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		196	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.