Xilinx Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5415-4HQ208C	Xilinx	FPGA		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				.5 mm						Quad	S-PQFP-G208		4.1 mm	28 mm	No							28 mm
XC3020-70PC84ISPC0110	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC4VFX40-11FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		448		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1181 MHz	30 s	448	225 °C (437 °F)	35 mm
XC4028EX-4HQ240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1024	Yes		1024	CMOS		256	18000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		.5 mm			1024 CLBS, 18000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 28000 Logic gates	e0	143 MHz	30 s	256	225 °C (437 °F)	32 mm
XC7VX690T-1FFG1930E	Xilinx	FPGA																										Tin Silver Copper			4					e1
XC2S300E-6TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	1536				93000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm		0.47 ns	1536 CLBS, 93000 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 300000	e0	357 MHz				20 mm
XC4062XLA-7HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	294 MHz				32 mm
XC4085XLA-8HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160		4.1 mm	28 mm	No		e3	263 MHz				28 mm
XCKU11P-L1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320			512		0.72		Grid Array	BGA900,30X30,40		.698 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1			512		31 mm
XC7A200T-2LFBG484C	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		250 °C (482 °F)
5962-9561101MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	190 MHz		142		28.702 mm
XA6SLX75T-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	268			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	268	250 °C (482 °F)
XC6264-2PQG240C	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	16384	CMOS			64000	5		Flatpack, Fine Pitch			4.75 V	.5 mm			16384 CLBS, 64000 Gates		Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	16384 flip-flops; typical gates = 64000-100000	e3	111 MHz				32 mm
XC4052XL-3BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC2V4000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	650 MHz	30 s	912	245 °C (473 °F)	40 mm
XC2V4000-6BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS		684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0	820 MHz	30 s	684	225 °C (437 °F)	40 mm
XC7V2000T-2LFLG1925C	Xilinx	FPGA																										Tin Silver Copper								e1
XC6SLX150T-N3FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		540		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz	30 s	540	225 °C (437 °F)	31 mm
XC4036EX-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	5.5 V	1296	CMOS		288	22000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.5 V	1.27 mm			1296 CLBS, 22000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	166 MHz	30 s	288	225 °C (437 °F)	35 mm
XC4VLX80-10FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	80640	Yes	1.26 V	8960	CMOS		768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			8960 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e1	1028 MHz	30 s	768	245 °C (473 °F)	35 mm
XC6SLX45-N3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		218		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz	30 s	218	260 °C (500 °F)	15 mm
XC4005E-4PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS		112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P156		4.318 mm	42.164 mm	No	Max usable 5000 Logic gates		111 MHz		112		42.164 mm
XC7VX330T-2LFFG1761E	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500			650		1		Grid Array	BGA1761,42X42,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4	3.75 mm	45 mm			e1		30 s	650	245 °C (473 °F)	45 mm
XC3090-70PP175ISPC0109	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Plastic/Epoxy		No	5.5 V	320	CMOS			9000	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)	9 ns	320 CLBS, 9000 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P175		3.937 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		70 MHz				42.164 mm
XC7VX485T-2LFFG1158C	Xilinx	FPGA																										Tin Silver Copper			4					e1		30 s		245 °C (473 °F)
XC2V40-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS		88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	88	225 °C (437 °F)	17 mm
XC4036XL-2BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	1296 CLBS, 22000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
XC4052XLA-09BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4062XLA-08HQG240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm		1 ns	2304 CLBS, 40000 Gates			Quad	S-PQFP-G240		4.1 mm	32 mm	No	Can also use 130000 gates		263 MHz				32 mm
XC3142-2PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic	144	No			CMOS		96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P132				No			325 MHz		96
XC2V500-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS		172	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2VP30-6FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	416	250 °C (482 °F)	27 mm
XC6VLX130T-3FFG484C	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes			CMOS		240			1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B484	4			No		e1	1412 MHz	30 s	240	250 °C (482 °F)
XC6VSX315T-2FFG1759E	Xilinx	FPGA		Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes			CMOS		720			1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4			No		e1	1286 MHz	30 s	720	245 °C (473 °F)
XC6SLX75-3NCSG484Q	Xilinx	FPGA																										Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			3					e1		30 s		260 °C (500 °F)
XC6VCX195T-2FF784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC4VFX12-11FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
5962-8971302QTX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							70 MHz
XC6VSX475T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.67 ns	37200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC2318-70TQ100C	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No			70 MHz				14 mm
XC2S600E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	864	CMOS		514	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	514	225 °C (437 °F)	27 mm
XC4025E-2PG229C	Xilinx	FPGA																										Tin Lead								e0
XC7A35T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC4052XL-3HQ240I	Xilinx	FPGA		Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.6 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 52000 Logic gates	e0	166 MHz	30 s	352	225 °C (437 °F)	32 mm
XC4VLX25-11SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1205 MHz	30 s	240	260 °C (500 °F)
XC4VLX160-11FF1513IS2	Xilinx	FPGA		Ball	1513	BGA	Square	Plastic/Epoxy	152064	Yes			CMOS		960			1.2,1.2/3.3,2.5 V	Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1513	4			No		e0	1205 MHz	30 s	960	225 °C (437 °F)
XC5215-6BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.5 V	484	CMOS		244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.5 V	1.27 mm		5.6 ns	484 CLBS, 15000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
5962-9851001QYX	Xilinx	FPGA	Military	Flat	228	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q		22000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000		166 MHz				39.37 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.