Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5M80ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
EP2A15F672C9	Intel	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS	480		1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.425 V		1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480		27 mm		492
XC2C512-10FGG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS	270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 270 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	91 MHz	30 s	270	250 °C (482 °F)	23 mm	Yes	270
XC9536XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XCR3032XL-7CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
5M2210ZF256C4	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	247.5 MHz		203		17 mm	Yes	203
5M570ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	184.1 MHz				17 mm	Yes	159
5M570ZM100C5N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	74
CY37512VP256-83BGC	Cypress Semiconductor	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 197 I/O	1	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.46 mm	27 mm	No	512 Macrocells	e0	62.5 MHz				27 mm	Yes	197
EP1K30FC256-2N	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	171		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	171 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		171		17 mm		171
EPM2210F324C3	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS	272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM2210F324C4	Intel	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS	272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM2210F324I5	Intel	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e0			272		19 mm	Yes	272
EPM240M100C4N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	6.1 ns		Yes	2.625 V	192	CMOS	80		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
EPM570GM100I5N	Intel	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS	76		1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			76		6 mm	Yes	76
EPM7512AEFC256-12N	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	71.9 MHz				17 mm	Yes	212
EPM7512AEFI256-10	Intel	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	87 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPM7512AEFI256-10N	Intel	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	87 MHz				17 mm	Yes	212
LC4128ZC-75MN132I	Lattice Semiconductor	EE PLD		Ball	132	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128		100	PAD-TYPE	1.8	1.8 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 96 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	111 MHz	40 s	96	260 °C (500 °F)	8 mm	Yes	96
LC4128ZE-7MN144I	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 96 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	7 mm	Yes	96
LC4256ZE-5MN144C	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	5.8 ns		Yes	1.9 V	256	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 108 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	149 MHz	40 s		260 °C (500 °F)	7 mm	Yes	108
XC2C32A-4CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	450 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC2C64A-7CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
EP1K100FI256-2N	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		186		17 mm		186
EP20K30EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns	1200	Yes	1.89 V		CMOS	120		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EPM1270GM256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS	212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM2210F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210F256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			204		17 mm	Yes	204
EPM2210GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	204		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM240ZM68C6N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS	54		1.8	1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM240ZM68C7N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	12 ns		Yes	1.89 V	192	CMOS	54		1.8	1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPXA1F484C2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0				220 °C (428 °F)	23 mm		186
LC4032ZC-35MN56C	Lattice Semiconductor	EE PLD		Ball	56	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	1.9 V	32		36	PAD-TYPE	1.8	1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	212 MHz	40 s	32	260 °C (500 °F)	6 mm	Yes	32
LC4256ZE-7MN144C	Lattice Semiconductor	EE PLD		Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,12X12,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 108 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144	3	1.1 mm	7 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	7 mm	Yes	108
XC2C256-6FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC95144XL-10CS144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	144	CMOS	117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	138.88 MHz	30 s	117	240 °C (464 °F)	12 mm	Yes	117
XC95144XL-7CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	144	CMOS	117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
XCR3128XL-10CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
5M160ZM68I5N	Intel	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
5M2210ZF256C5	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
LC4064ZE-7MN64I	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS			1.8	1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 48 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	5 mm	Yes	48
XC2C128-7CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS	100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	119 MHz	30 s	100	240 °C (464 °F)	8 mm	Yes	100
XC2C384-7FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	112 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC2C256-7FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	184	225 °C (437 °F)	17 mm	Yes	184
5M160ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
CY39100V388B-125MGC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	388	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.7 V	1536	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA388,26X26,50	Programmable Logic Devices	Yes	Macrocell	2.3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 294 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B388		2.46 mm	35 mm	No	Also operates at 3.3 V nominal supply	e0					35 mm	Yes	294
5M1270ZF324I5N	Intel	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	271 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz				19 mm	Yes	271
EP20K400FC672-1X	Intel	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS	496		2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V		1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			496		27 mm		502

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.