Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM570F100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	11 mm	Yes	76
5M570ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	17 mm	Yes	159
EPM2210F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns	Yes	2.625 V	1700	CMOS	204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM240M100C5N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
EPM1270F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS	212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
5M2210ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns	Yes	1.89 V	1700	CMOS	203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz		203		17 mm	Yes	203
EPM1270F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS	212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM240ZM100C7N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	12 ns	Yes	1.89 V	192	CMOS	80		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			80		6 mm	Yes	80
EPM2210F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns	Yes	2.625 V	1700	CMOS	204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM570F100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	11 mm	Yes	76
XC2C64A-7CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	200 MHz	30 s		260 °C (500 °F)	6 mm	Yes	45
XC2C256-7FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
EPM570ZM144C7N	Intel	Flash PLD	Other	Ball	144	BGA	Rectangular	Plastic/Epoxy	15.1 ns	Yes	1.89 V	440	CMOS	116		1.8		1.5/3.3,1.8 V	Grid Array	BGA144,13X13,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B144	3		7 mm	No	It can also operate at 3.3 V	e1			116		7 mm	Yes	116
EPM2210F324C5N	Intel	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns	Yes	2.625 V	1700	CMOS	272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s	272	260 °C (500 °F)	19 mm	Yes	272
LCMXO2-640HC-4MG132C	Lattice Semiconductor	Flash PLD	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	7.24 ns	Yes	3.462 V			79		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also operates at 3.3 V nominal supply	e1		30 s	79	250 °C (482 °F)	8 mm		80
EPM240F100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	11 mm	Yes	80
5M2210ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns	Yes	1.89 V	1700	CMOS	203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	100 °C (212 °F)	203 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz	30 s	203	260 °C (500 °F)	17 mm	Yes	203
EPM570M100C5N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	6 mm	Yes	76
XC2C64A-7CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	200 MHz	30 s		260 °C (500 °F)	6 mm	Yes	45
EPM570M100I5N	Intel	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			76		6 mm	Yes	76
XC2C256-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	106	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 106 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XCR3032XL-7CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS			3.3		3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	7 mm	Yes	36
EPM570M100C4N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	7 ns	Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1			76		6 mm	Yes	76
XC9572XL-10CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	38		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e1	100 MHz	30 s	38	260 °C (500 °F)	7 mm	Yes	38
5M570ZM100I5N	Intel	Flash PLD	Industrial	Ball	100	TFBGA	Square	Plastic/Epoxy	17.7 ns	Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	100 °C (212 °F)	74 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	74
XC2C32A-6CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	300 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
XC95144XL-10CSG144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS	117		3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
5M1270ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
EPM570F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns	Yes	2.625 V	440	CMOS	160		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
XC9536XL-10CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	36		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
EPM1270M256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS	212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
LC4032ZE-7MN64C	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	32	CMOS			1.8		1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm		4 Dedicated Inputs, 32 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	5 mm	Yes	32
XC2C64A-7CP56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	200 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
5M1270ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	100 °C (212 °F)	211 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
EPM2210F324I5N	Intel	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns	Yes	2.625 V	1700	CMOS	272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	100 °C (212 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s	272	260 °C (500 °F)	19 mm	Yes	272
5M240ZM100C5N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V	192	CMOS	79		1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	79 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz		79		6 mm	Yes	79
EPM240M100I5N	Intel	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
LC4032ZE-7MN64I	Lattice Semiconductor	EE PLD		Ball	64	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	32	CMOS			1.8		1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm		4 Dedicated Inputs, 32 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B64	3	1.1 mm	5 mm	No		e1	111 MHz	40 s		260 °C (500 °F)	5 mm	Yes	32
XC2C32A-6CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	33 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	300 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
5M40ZM64I5N	Intel	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns	Yes	1.89 V					1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm		30
XC2C64A-5CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	333 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45
EPM2210F324C4N	Intel	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns	Yes	2.625 V	1700	CMOS	272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1			272		19 mm	Yes	272
EPM240GM100C5N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.89 V	192	CMOS	80		1.8		1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100			6 mm	No	It can also operate at 3.3 V	e1			80		6 mm	Yes	80
5M2210ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns	Yes	1.89 V	1700	CMOS	203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz		203		17 mm	Yes	203
5M2210ZF324C5N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns	Yes	1.89 V	1700	CMOS	271		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	271 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz		271		19 mm	Yes	271
XC2C256-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC2C64A-5CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	333 MHz	30 s		260 °C (500 °F)	6 mm	Yes	45
5M40ZM64C4N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns	Yes	1.89 V					1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	184.1 MHz				4.5 mm		30

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.