Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K200SFI672-2	Intel	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470		27 mm		470
EPF10K50SFC484-1	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	254		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254		23 mm		254
EPF6016AFC100-2	Intel	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS	81		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Field Programmable Gate Arrays		Macrocell	3 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	153 MHz		81		11 mm		81
EPF6024ABI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	218		3.3	2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	3 V		1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin/Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz	30 s	218	220 °C (428 °F)	27 mm		218
EPM1270GF256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS	212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0			212		17 mm	Yes	212
EPM1270GM256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS	212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM2210F256A5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	124 °C (255.2 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0			204		17 mm	Yes	204
EPM2210F256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS	204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210GF256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS	204		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM240GF100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS	80		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
EPM3512AFC256-10N	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 208 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1					17 mm	Yes	208
EPM3512AFC256-7	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 208 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0					17 mm	Yes	208
EPM7128BUC49-10	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	128	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	94.3 MHz			220 °C (428 °F)	7 mm	Yes	41
EPM7256AEFC256-10N	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	95.2 MHz				17 mm	Yes	164
ISPLSI5384VE-100LF256I	Lattice Semiconductor	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	384	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
LC4128ZC-75MN132C	Lattice Semiconductor	EE PLD		Ball	132	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128		100	PAD-TYPE	1.8	1.8 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 96 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	111 MHz	40 s	96	260 °C (500 °F)	8 mm	Yes	96
LC4256V-75FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	111 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
LC4512V-5FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	512		212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	156 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
LC4512V-75FT256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512		212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	111 MHz	30 s	208	225 °C (437 °F)	17 mm	Yes	208
LC5256MV-75FN256C	Lattice Semiconductor	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm		0 Dedicated Inputs, 141 I/O	0		Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1		40 s		250 °C (482 °F)	17 mm	Yes	141
LCMXO256C-3M100C4W	Lattice Semiconductor	Flash PLD		Ball	100	LFBGA	Square	Plastic/Epoxy	4.9 ns	256	Yes	3.465 V		CMOS	78		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm		7 Dedicated Inputs, 78 I/O	7		Tin Lead	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No	It can also operate at 2.5 V and 3.3 V	e0	388 MHz	30 s	78	240 °C (464 °F)	8 mm		78
M4A3-384/192-10FANC	Lattice Semiconductor	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS		PAL-TYPE	3.3	3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	62.5 MHz	40 s		250 °C (482 °F)	17 mm	Yes	192
XC2C256-6CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS	106	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e1	139 MHz	30 s	106	260 °C (500 °F)	8 mm	Yes	106
XC2C256-7FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	184	225 °C (437 °F)	17 mm	Yes	184
XC2C512-10FG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS	270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 270 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	91 MHz	30 s	270	225 °C (437 °F)	23 mm	Yes	270
XC2C512-7FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	119 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC95288XL-10FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XCR3128XL-10CSG144C	Xilinx	EE PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	12 mm	Yes	108
XCR3128XL-7CSG144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	12 mm	Yes	108
XCR3512XL-12FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	77 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
PZ3064DS10EC	NXP Semiconductors	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	11.5 ns		Yes	3.6 V		CMOS					Grid Array, Low Profile, Fine Pitch				Macrocell	2.7 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 44 I/O	2	-40 °C (-40 °F)		Bottom	S-PBGA-B56		1.35 mm	6 mm	No			90 MHz				6 mm		44
PZ3320N8YY	NXP Semiconductors	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS			3.3		Grid Array				Macrocell	2.97 V			85 °C (185 °F)	192 I/O		-40 °C (-40 °F)		Bottom	S-PBGA-B256				No			91 MHz						192
PZ3064AS7EC	NXP Semiconductors	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	9 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 44 I/O	2	0 °C (32 °F)		Bottom	S-PBGA-B56		1.35 mm	6 mm	No			111 MHz				6 mm		44
PZ3960C7EB	NXP Semiconductors	Loadable PLD	Commercial	Ball	492	BGA	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS			3.3		Grid Array				Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 384 I/O	1	0 °C (32 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		100 MHz				35 mm		384
PZ3960N8EB-S	NXP Semiconductors	Loadable PLD	Industrial	Ball	492	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS			3.3		Grid Array				Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 384 I/O	1	-40 °C (-40 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		91 MHz				35 mm		384
PZ3064AS10EC	NXP Semiconductors	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	11.5 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 44 I/O	2	0 °C (32 °F)		Bottom	S-PBGA-B56		1.35 mm	6 mm	No			83 MHz				6 mm		44
PZ3960N8EB	NXP Semiconductors	Loadable PLD	Industrial	Ball	492	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	3.63 V		CMOS			3.3		Grid Array				Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 384 I/O	1	-40 °C (-40 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		91 MHz				35 mm		384
PZ3960C7EB-S	NXP Semiconductors	Loadable PLD	Commercial	Ball	492	BGA	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS			3.3		Grid Array				Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 384 I/O	1	0 °C (32 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		100 MHz				35 mm		384
PZ3320C7YY	NXP Semiconductors	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	9 ns		Yes	3.63 V		CMOS			3.3		Grid Array				Macrocell	2.97 V			70 °C (158 °F)	192 I/O		0 °C (32 °F)		Bottom	S-PBGA-B256				No			100 MHz						192
PZ3064DS12EC	NXP Semiconductors	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	13.5 ns		Yes	3.6 V		CMOS					Grid Array, Low Profile, Fine Pitch				Macrocell	2.7 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 44 I/O	2	-40 °C (-40 °F)		Bottom	S-PBGA-B56		1.35 mm	6 mm	No			77 MHz				6 mm		44
CY37064VP48-143BAI	Infineon Technologies	EE PLD	Industrial	Ball	48	FBGA	Rectangular	Plastic/Epoxy	8.5 ns		Yes		64	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	R-PBGA-B48				No		e0						Yes
CY37384P256-66BGC	Infineon Technologies	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	384	CMOS				3.3/5,5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes		4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O		0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B256			27 mm	No		e0	47.6 MHz				27 mm	Yes
CY37384P256-66BGI	Infineon Technologies	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20 ns		Yes	5.5 V	384	CMOS				3.3/5,5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes		4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B256			27 mm	No		e0	47.6 MHz				27 mm	Yes
XCR3032XL-10CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
XCR3512XL-7FGG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 260 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	135 MHz	30 s		250 °C (482 °F)	23 mm	Yes	260
XCR3032XL-7CS48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
XCR3128XL-6CSG144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	104 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	167 MHz	30 s		260 °C (500 °F)	12 mm		104
XC2C512-7FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	119 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.