Ball Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K30EFI672-3X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		220
EPF10K30EFC672-2X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		220
EPF6024AFC256-2	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	219	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 219 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	153 MHz	20 s	219	220 °C (428 °F)	17 mm		219
EPF10K130EBI356-3X	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS		2.5		Grid Array, Low Profile				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPF10K130EBC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							369
EPF10K30EFC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm		220
EP20K60EFC324-2N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.41 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		196
EP20K300EFC672-2N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V		CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz	30 s	400	260 °C (500 °F)	27 mm		408
EP20K100EBC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							246
EP20K100EFC784	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EPM7512BBI256-7	Altera	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.7 mm	27 mm	No		e0	119 MHz			220 °C (428 °F)	27 mm	Yes	212
EPM570GF100C5	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	8.7 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array	BGA100,10X10,40	Programmable Logic Devices	Yes			1 mm						Bottom	S-PBGA-B100				No								Yes
EPF10K30EFC256-1X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	176 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm		176
EP20K400BC652-2VX	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	34 MHz				45 mm		502
EPM2210M100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPM2210GF256C3	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	204
EPF10K130EFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V		CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	369	260 °C (500 °F)	23 mm		369
EPF10K200SFC484-1X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V		CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	369	220 °C (428 °F)	23 mm		369
EPM2210GF256A4N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	204
EP20K400EFC784-3	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EPM7128AEFI256-6	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.1 mm	17 mm	No		e0	166.7 MHz			220 °C (428 °F)	17 mm	Yes	100
EPF10K50EFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	2880 Logic Elements	e0	140 MHz	20 s	254	220 °C (428 °F)	23 mm		254
EP20K200EBC356ES	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EP20K200BI356-1X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	2.625 V		CMOS	271	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 277 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			271	220 °C (428 °F)	35 mm		277
EPM7256BFI100-10	Altera	EE PLD		Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	256	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 84 I/O	4		Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	95.2 MHz			220 °C (428 °F)	11 mm	Yes	84
EP20K1500CF33C9	Altera	Loadable PLD	Commercial	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	70 °C (158 °F)	808 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm		808
EP20K200BC784-3	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP20K1000EFC33-2	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.13 ns	38400	Yes	1.89 V		CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0		20 s	700	220 °C (428 °F)	33 mm		708
EPM1270GF256A3	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes		980	CMOS			1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EP20K100BC356-1X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			246	220 °C (428 °F)	35 mm		252
EPM1270GF256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	1.89 V	980	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	212
EPM1270M100I3N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPM2210GF256C4N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	204
EPF10K50EBI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP20K1000CB652I-9	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EP20K300EFC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.68 ns	11520	Yes	1.89 V		CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	400	220 °C (428 °F)	27 mm		408
EP20K600EFC672-1N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e1	160 MHz	30 s	500	245 °C (473 °F)	27 mm		508
EPF10K50VFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	14 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 291 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		291
EPF10K50VBC356-4	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	2880	Yes	3.6 V		CMOS	274	3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EP20K100EFC324-2N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	238	260 °C (500 °F)	19 mm		246
EP20K100FC400-2	Altera	Loadable PLD	Other	Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EPM7128AEFI169-7	Altera	EE PLD	Commercial	Ball	169	BGA	Square	Plastic/Epoxy	7.5 ns		Yes		128	CMOS			2.5/3.3,3.3 V	Grid Array	BGA169,13X13	Programmable Logic Devices	Yes			1.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169	3			No		e0				220 °C (428 °F)		Yes
EPF10K100EFI672-2X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	12 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EPF10K50EFI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EP20K200FI672-1	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 382 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		382
EP20K100FC324-2N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1		30 s	246	260 °C (500 °F)	19 mm		252
EP20K200EFC672XES	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EP20K160EFC484-3X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		316

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.