Ball Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K50BC356-3

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

5.25 V

CMOS

274

5

3.3/5,5 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

66.67 MHz

20 s

274

220 °C (428 °F)

35 mm

274

EP20K200EFC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

27 mm

376

EP20K200CF484C7

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.48 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e0

368

220 °C (428 °F)

23 mm

376

EPM7128AEUI169-5

Altera

EE PLD

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

1.55 mm

11 mm

No

e0

192.3 MHz

220 °C (428 °F)

11 mm

Yes

100

EP20K100FC196-2

Altera

Loadable PLD

Other

Ball

196

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

2.1 mm

15 mm

No

e1

220 °C (428 °F)

15 mm

EPM240M100I4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 80 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

80

EP20K200CFC672-8

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EPF10K130EBI600-2X

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

12 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

424 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EP20K400BC652-3

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

3.6 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

20 s

496

220 °C (428 °F)

45 mm

502

EPM2210GF324I3N

Altera

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 272 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

19 mm

Yes

272

EPM2210GM100I4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EP20K100EFI672-1

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

220 °C (428 °F)

246

EP20K300EFI672-2XN

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.29 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

245 °C (473 °F)

27 mm

408

EP20K600EBC652-2XN

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.25 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

45 mm

488

EPF10K130EFI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

9 ns

6656

Yes

2.7 V

CMOS

413

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

413 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

413

220 °C (428 °F)

27 mm

413

EP20K100BI324-1

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 252 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B324

No

e1

252

EPM7128BUI169-4

Altera

EE PLD

Ball

169

FBGA

Square

Plastic/Epoxy

4 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

.8 mm

Tin Lead

Bottom

S-PBGA-B169

No

e0

220 °C (428 °F)

Yes

EPM7128AFC100-5

Altera

EE PLD

Commercial

Ball

100

TBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.1 mm

11 mm

No

e0

220 °C (428 °F)

11 mm

Yes

84

EPF10K30EFC484-1X

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP20K1000EBC652-3

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.32 ns

38400

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EP20K200EFI484-2XN

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

1.97 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

376

EP20K200EFC484

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

220 °C (428 °F)

23 mm

376

5M570ZM100C5

Altera

Flash PLD

Other

Ball

100

TFBGA

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

440

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

74 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

1.2 mm

6 mm

No

e0

118.3 MHz

6 mm

Yes

74

EP20K100EFI672-2

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

220 °C (428 °F)

246

EP20K100BI356-2

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 252 I/O

4

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

246

220 °C (428 °F)

35 mm

252

EPF10K200EFI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

10 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

470

220 °C (428 °F)

27 mm

470

EPM7128BUI169-4N

Altera

EE PLD

Industrial

Ball

169

FBGA

Square

Plastic/Epoxy

4 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

.8 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

No

e1

Yes

EPM570F100I4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

76

EPF10K10AFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

576

Yes

3.6 V

CMOS

150

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

576 Logic Elements; 72 Labs

e0

80 MHz

150

220 °C (428 °F)

17 mm

150

EPM570F256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

160

EP1K100FC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

333 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

37.5 MHz

20 s

333

220 °C (428 °F)

23 mm

333

EPF10K100BBC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

Grid Array

Mixed

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF8820ABI225-A-4

Altera

Loadable PLD

Industrial

Ball

225

BGA

Square

Plastic/Epoxy

1.9 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

Can also operate at 5 V supply

e1

27 mm

152

EP20K200FC484-1N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

30 s

376

260 °C (500 °F)

23 mm

382

EPM570GM256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K100EFI672-3

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

4992

Yes

2.7 V

CMOS

338

2.5

2.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

338 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

338

220 °C (428 °F)

27 mm

338

EPM3256AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 161 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

161

EPM1270F256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EPF10K30ABC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

1.3 ns

1728

Yes

3.6 V

CMOS

246

3.3

3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

246

220 °C (428 °F)

27 mm

191

EPM7256BUC169-10

Altera

EE PLD

Commercial

Ball

169

LFBGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

Macrocell

2.375 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 141 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

11 mm

No

e0

188.7 MHz

20 s

235 °C (455 °F)

11 mm

Yes

141

EPF10K30EFI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

9.5 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP20K60EFI324-2X

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

188

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 196 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

188

220 °C (428 °F)

19 mm

196

EPM2210GF256I3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPM570ZM256A7N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

15.1 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM570F100A4N

Altera

Flash PLD

Automotive

Ball

100

LBGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

11 mm

Yes

76

EP20K100EBI356-2XN

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

2.02 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 246 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

246

EPM7128AEUI169-10

Altera

EE PLD

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

1.55 mm

11 mm

No

e0

98 MHz

220 °C (428 °F)

11 mm

Yes

100

EPF10K30EBC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 176 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.