Ball Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM2210GF256A5N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

204

EPM7384AEBC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

384 Macrocells

e1

166.7 MHz

220 °C (428 °F)

27 mm

212

EPF10K250ABC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

12160

Yes

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

45 mm

470

EPF10K250EFI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

12160

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

470

220 °C (428 °F)

470

EP20K200EBI652-2

Altera

Loadable PLD

Ball

652

LBGA

Square

Plastic/Epoxy

8320

Yes

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.27 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

1.63 mm

45 mm

No

e1

368

220 °C (428 °F)

45 mm

376

EPF10K200SFC484-2N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

369 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

369

260 °C (500 °F)

23 mm

369

EPM7128AEUC169-10

Altera

EE PLD

Commercial

Ball

169

LFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

1.55 mm

11 mm

No

e0

98 MHz

220 °C (428 °F)

11 mm

Yes

100

EPF10K20BI356-5

Altera

Loadable PLD

Industrial

Ball

356

HLBGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array, Heat Sink/Slug, Low Profile

Registered

4.5 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1152 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

35 mm

EPF8820BI225-3

Altera

Loadable PLD

Industrial

Ball

225

BGA

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

1.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e1

27 mm

148

EP20K100FC400-1

Altera

Loadable PLD

Other

Ball

400

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B400

3

No

e1

220 °C (428 °F)

EPF10K130EBC600-3X

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPF10K10AFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.8 ns

576

Yes

3.6 V

CMOS

150

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

576 Logic Elements; 72 Labs

e0

80 MHz

150

220 °C (428 °F)

17 mm

150

EPM7256AEFI100-4

Altera

EE PLD

Industrial

Ball

100

BGA

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B100

No

e0

250 MHz

84

EPM570F100C3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

76

EP1K10FC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 130 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

130

EPM7064BFI100-3

Altera

EE PLD

Ball

100

LBGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 68 I/O

0

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

285.7 MHz

220 °C (428 °F)

11 mm

Yes

68

EP20K30EFC324-2

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.69 ns

1200

Yes

1.89 V

CMOS

120

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e1

160 MHz

120

220 °C (428 °F)

19 mm

128

EP20K200FI784-2

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPM7128AFC100-6

Altera

EE PLD

Commercial

Ball

100

LBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

144.9 MHz

220 °C (428 °F)

11 mm

Yes

84

EPM7064AEFI100-5

Altera

EE PLD

Industrial

Ball

100

BGA

Square

Plastic/Epoxy

5 ns

Yes

64

CMOS

2.5/3.3,3.3 V

Grid Array

BGA100,10X10,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B100

3

No

e0

220 °C (428 °F)

Yes

EPF10K10AFI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

16 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 150 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

150

EPF10K100ABC356-2

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPM7128AEFC100-12

Altera

EE PLD

Commercial

Ball

100

TBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.1 mm

11 mm

No

e0

100 MHz

220 °C (428 °F)

11 mm

Yes

84

EPM570GM256A5N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM7128AEFI169-5

Altera

EE PLD

Commercial

Ball

169

BGA

Square

Plastic/Epoxy

5 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA169,13X13

Programmable Logic Devices

Yes

1.5 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

3

No

e0

220 °C (428 °F)

Yes

EPM7128BFI100-10N

Altera

EE PLD

Industrial

Ball

100

BGA

Square

Plastic/Epoxy

10 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array

BGA100,10X10,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

Yes

5M80ZM68C5

Altera

Flash PLD

Other

Ball

68

TFBGA

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

64

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA68,9X9,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

52 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B68

1.2 mm

5 mm

No

e0

118.3 MHz

5 mm

Yes

52

EP20K400EBI652-2XN

Altera

Loadable PLD

Ball

652

BGA

Square

Plastic/Epoxy

1.83 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

45 mm

488

EPM2210F324I3

Altera

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

1700

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B324

3

No

e0

220 °C (428 °F)

Yes

EPF10K100EFC484-2N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

338

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

338

260 °C (500 °F)

23 mm

338

EPF10K130EBI356-2X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPF10K130EFC672-2

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

2.625 V

CMOS

413

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

20 s

413

220 °C (428 °F)

27 mm

413

EP20K160EFC672

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 324 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

324

EPM7128AEFI100-7N

Altera

EE PLD

Industrial

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e1

129.9 MHz

260 °C (500 °F)

11 mm

84

EP20K100BC484-1

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

252

EP20K600CF33C7

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

220 °C (428 °F)

33 mm

588

EPF10K50VFC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

310

3.3

3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

310

220 °C (428 °F)

23 mm

EPF10K100EFC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

338

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

338

220 °C (428 °F)

23 mm

338

EPM7128BUI169-7N

Altera

EE PLD

Industrial

Ball

169

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

.8 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

No

e1

Yes

EPF10K200SBI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

9984

Yes

2.7 V

CMOS

274

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

274 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e0

274

220 °C (428 °F)

35 mm

274

EP20K200EFC484-2XN

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

160 MHz

30 s

368

260 °C (500 °F)

23 mm

376

EP20K300EBC652-1

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.68 ns

11520

Yes

1.89 V

CMOS

400

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

400

220 °C (428 °F)

45 mm

408

EPF10K50BC356-3

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

5.25 V

CMOS

274

5

3.3/5,5 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

66.67 MHz

20 s

274

220 °C (428 °F)

35 mm

274

EP20K200EFC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

27 mm

376

EP20K200CF484C7

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.48 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e0

368

220 °C (428 °F)

23 mm

376

EPM7128AEUI169-5

Altera

EE PLD

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

1.55 mm

11 mm

No

e0

192.3 MHz

220 °C (428 °F)

11 mm

Yes

100

EP20K100FC196-2

Altera

Loadable PLD

Other

Ball

196

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

2.1 mm

15 mm

No

e1

220 °C (428 °F)

15 mm

EPM240M100I4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 80 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.