Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K100FC400-3	Altera	Loadable PLD	Other	Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EPF10K130EBI600-1X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		424
EP20K600CF672C9N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm		508
EPM1270F256I3N	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 212 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1				245 °C (473 °F)	17 mm	Yes	212
EPM7064AEFI100-4	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	222.2 MHz			220 °C (428 °F)	11 mm	Yes	68
EPM7128AFI100-7	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	116.3 MHz			220 °C (428 °F)	11 mm	Yes	84
EP20K60EBC356-1X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V		CMOS	188	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	35 mm		196
EPF10K10AFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V				3.3		Grid Array				Mixed	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		1.86 mm	23 mm	No		e1					23 mm		150
EPM240F100C4N	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	6.1 ns		Yes	2.625 V	192	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	11 mm	Yes	80
EP20K100BI672-3	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							252
EP20K600CB672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)		Bottom	S-PBGA-B672		3.5 mm	27 mm	No							27 mm		508
5M160ZM100I5	Altera	Flash PLD	Industrial	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS		1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	100 °C (212 °F)	79 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e0	118.3 MHz				6 mm	Yes	79
EP1K100FC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	90 MHz	20 s	186	220 °C (428 °F)	17 mm		186
EP20K600EFC33-2X-2	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V		85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020				No		e1							588
EP20K600EFC33-2	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V		CMOS	580	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0		20 s	580	220 °C (428 °F)	33 mm		588
EPM7512AEBI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V	512	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	512 Macrocells	e0	163.9 MHz	20 s		220 °C (428 °F)	27 mm	Yes	212
EP20K100EFC144-2X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EPF10K40BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EPM240GM100I4	Altera	Flash PLD		Ball	100	FBGA	Square	Plastic/Epoxy	6.1 ns		Yes		192	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B100				No								Yes
EPF10K10ABI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	3.6 V				3.3		Grid Array				Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EPM7512BUC169-6	Altera	EE PLD		Ball	169	LFBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile, Fine Pitch				Macrocell	2.375 V	.8 mm		0 Dedicated Inputs, 141 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e1				220 °C (428 °F)	11 mm		141
EPM570F256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	160
EPM570GF256I5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 160 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	160
EP20K400BI652-2	Altera	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 502 I/O	4		Tin Lead	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e0			496	220 °C (428 °F)	45 mm		502
EPF10K100BM560-4	Altera	Loadable PLD	Military	Ball	560	BGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz
EP20K400FI784-2	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPXA10F1020C3	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 711 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm		711
EPM7128BUI169-7	Altera	EE PLD		Ball	169	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		128	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes			.8 mm					Tin Lead	Bottom	S-PBGA-B169				No		e0				220 °C (428 °F)		Yes
EPF10K50SFC484-1N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	254	260 °C (500 °F)	23 mm		254
EP20K200CBC652-8X	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EPF10K10ABC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	3.6 V				3.3		Grid Array				Mixed	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EPM570GM256I4	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	7 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EP20K100BC356-2	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	246	220 °C (428 °F)	35 mm		252
EPF10K200SFC672-1X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V		CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470	220 °C (428 °F)	27 mm		470
EP20K600EFC672XES	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		508
EPM7032BUI49-7	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		32	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Lead	Bottom	S-PBGA-B49				No		e0				220 °C (428 °F)		Yes
5M80ZM68I5	Altera	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e0	118.3 MHz				5 mm	Yes	52
EPF10K30EFC256-2X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	176 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm		176
EPM7512BFC256-5N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1	163.9 MHz				17 mm	Yes	212
EPF8820ABC225-A-2	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPM7064BUC49-7	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	303 MHz			220 °C (428 °F)	7 mm	Yes	41
EPM240GM100A4N	Altera	Flash PLD	Automotive	Ball	100	BGA	Square	Plastic/Epoxy	6.1 ns		Yes	1.89 V	192	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	80
EP20K100FI196-3	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm		4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B196	3	2.1 mm	15 mm	No		e1				220 °C (428 °F)	15 mm
EP2A70B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.87 ns	67200	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EPF10K20BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EP20K400BC652	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm		502
EPM1270GF256C4	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	212
EPF10K100AFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	14.5 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		369

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.