Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K50EBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPF10K200EBC600-1	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.4 ns	9984	Yes	2.7 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0		20 s	470	220 °C (428 °F)	45 mm		470
EP20K30EFC324-1X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.91 ns	1200	Yes	1.89 V		CMOS	120		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EPM1270M100I5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPM240GF100I4	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	6.1 ns		Yes		192	CMOS				1.8,1.8/3 V	Grid Array	BGA100,10X10,40	Programmable Logic Devices	Yes			1 mm						Bottom	S-PBGA-B100				No								Yes
EPF10K30EFC672-3	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V		CMOS	220		2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			220	220 °C (428 °F)	27 mm		220
EP20K200EBI356-1X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	2.625 V		CMOS	263		2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			263	220 °C (428 °F)	35 mm		271
EP20K200EBC652-1X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V		CMOS	368		1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			368	220 °C (428 °F)	45 mm		376
EPF8820ABI225-4	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.5 V		CMOS	152		5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 148 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm		148
EP20K200CF484I-8N	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				245 °C (473 °F)	23 mm		376
EPF10K50EBC356-2	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	10 ns	2880	Yes	2.7 V		CMOS	220		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 220 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EP2A40B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.55 ns	38400	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EPF10K30ABI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1.3 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP1K50FC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS	249		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	249 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	37.5 MHz	20 s	249	220 °C (428 °F)	23 mm		249
EP1M120F484C7AES	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS			1.8		Grid Array				Mixed	1.71 V	1 mm	85 °C (185 °F)	303 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e0					23 mm		303
EP20K200CF484C9	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2 ns	8320	Yes	1.89 V		CMOS	368		1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0			368	220 °C (428 °F)	23 mm		376
EPF10K20BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K160EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 324 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm		324
EP20K400FI672-2VN	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Macrocell	2.375 V	1 mm		502 I/O			Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1					27 mm		502
EP20K300EBC652-2X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V		CMOS	400		1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm		408
EP20K600EFI672-2X	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	2.25 ns	24320	Yes	1.89 V		CMOS	500		1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 508 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0		20 s	500	220 °C (428 °F)	27 mm		508
EPM2210GF100C4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EPM7128BUC169-7	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	128	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	126.6 MHz			220 °C (428 °F)	11 mm	Yes	100
EPF10K130EBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V		CMOS	424		2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	424 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm		424
EPF10K30EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 220 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							220
EP20K600EFC1020-3	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	0.5 ns	24320	Yes	2.625 V		CMOS	588		2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		588	220 °C (428 °F)	33 mm		588
EPM240F100C5	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	4.7 ns		Yes	2.625 V	192	CMOS	80	PAL-TYPE	2.5		Grid Array, Low Profile	BGA100,10X10,40		Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)		Bottom	S-PBGA-B100		1.7 mm	11 mm		It can also operate at 3.3 V		104.16 MHz		80		11 mm	Yes	80
EP20K1500EFC1020-3X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS			2.5		Grid Array, Heat Sink/Slug				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1	160 MHz				33 mm		808
EPM2210M100I5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EP20K200EFI672	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell		1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EPF10K130EBC600-1X	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V		CMOS	424		2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	424 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm		424
EPM240GM100C5	Altera	Flash PLD		Ball	100	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		192	CMOS				1.8,1.8/3 V	Grid Array, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B100				No								Yes
EP20K200CBC356-7	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EPF10K30EFI484-3X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		220
EP20K400EFC784-1	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EPM7128ABC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	128 Macrocells	e1	125 MHz				27 mm		100
EPF10K250EBC600-2	Altera	Loadable PLD	Commercial	Ball	600	HBGA	Square	Plastic/Epoxy		12160	Yes	2.7 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPM7128AEFC256-5N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	192.3 MHz			245 °C (473 °F)	17 mm		100
EPM7064BFC100-7	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	303 MHz	20 s		235 °C (455 °F)	11 mm	Yes	68
EPM7064AEFI49-10	Altera	EE PLD	Industrial	Ball	49	FBGA	Square	Plastic/Epoxy	10 ns		Yes		64	CMOS				2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EPM9320BC356-15	Altera	EE PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	35 mm	Yes	168
EP2A25F672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns	24320	Yes	1.575 V		CMOS	480		1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	480	220 °C (428 °F)	27 mm		492
EP20K600EBC652-1XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.57 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm		488
EPM1270M100I3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPF10K100EBI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							338
EPM570GF256C4N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	160
EPF10K200SBI356-1	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	9 ns	9984	Yes	2.7 V		CMOS	274		2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
EPM570F256A3	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS				1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.