Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM1270F256A4N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8.1 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	212
EPF10K200SFI672-2N	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		470
EPM1270GM256C4N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPM2210M100C3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPM1270GF100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EP20K200EBI356-2X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			263	220 °C (428 °F)	35 mm		271
EP20K100FI324-2XV	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 252 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm		252
EPF10K130EBI600-3X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		424
EPF6016AFC256-1N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1	172 MHz				17 mm		171
EP20K160EBC356-2	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V		CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0	160 MHz	20 s	263	220 °C (428 °F)	35 mm		271
EP2A15F672C9N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1			480		27 mm		492
EPF10K50SBC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EP20K60EFC144-2	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EP20K600EFC33-1N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.57 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm		588
EP1K30FC484	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Registered	2.375 V	1 mm	70 °C (158 °F)	6 Dedicated Inputs, 171 I/O	6	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		171
EP20K200BI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP20K100EFC196-1	Altera	Loadable PLD	Other	Ball	196	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B196	3			No		e0				220 °C (428 °F)			143
EPM7256BFC100	Altera	EE PLD		Ball	100	LBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 84 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1					11 mm		84
EPM570F256A4	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes		440	CMOS			1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPF10K200SBC600-3N	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470
EPF10K200EFI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	12 ns	9984	Yes	2.7 V		CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470	220 °C (428 °F)	27 mm		470
EP20K160EFC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V		CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	308	220 °C (428 °F)	23 mm		316
EPM2210GF324A5N	Altera	Flash PLD	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	It can also operate at 3.3 V	e1					19 mm	Yes	272
EP20K600EFC672-1X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm		508
EPF10K30EBC484-2	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 220 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							220
EPF10K50BC356-3N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	5.25 V		CMOS		5		Grid Array, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1	66.67 MHz				35 mm		274
EP1M120F484C5	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy		4800	Yes	1.89 V		CMOS	303	1.8	1.5/3.3,1.8 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			303	220 °C (428 °F)	23 mm		303
EPM570M100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm		0 Dedicated Inputs, 76 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	76
EP2A25F1020C7	Altera	Loadable PLD	Commercial	Ball	1020	HBGA	Square	Plastic/Epoxy	1.69 ns		Yes	1.575 V		CMOS		1.5		Grid Array, Heat Sink/Slug				Macrocell	1.425 V	1 mm	70 °C (158 °F)	612 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e0					33 mm		612
EPF10K200SBC356-2	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EPM240GM100I4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							80
EPM1270F256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	212
EPM7128BFI256-4N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes		128	CMOS			1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EPF10K200SFC672-1N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.3 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		470
EPM570ZM144A6N	Altera	Flash PLD	Automotive	Ball	144	BGA	Rectangular	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA144,13X13,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B144				No	It can also operate at 3.3 V	e1						Yes
5M240ZM100A5N	Altera	Flash PLD	Industrial	Ball	100	FBGA	Square	Plastic/Epoxy	17.7 ns		Yes		192	CMOS			1.8,1.2/3.3 V	Grid Array, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes			.5 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B100				No								Yes
EPM7128AEFC169-5	Altera	EE PLD	Commercial	Ball	169	BGA	Square	Plastic/Epoxy	5 ns		Yes		128	CMOS			2.5/3.3,3.3 V	Grid Array	BGA169,13X13	Programmable Logic Devices	Yes			1.5 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169	3			No		e0				220 °C (428 °F)		Yes
EP20K100EBC356-1N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		246
EPF8820BC225-3	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm		148
EPM2210GF324C5	Altera	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e0		20 s		220 °C (428 °F)	19 mm	Yes	272
EPM7128BFC100-4N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e1	243.9 MHz				11 mm	Yes	84
5M240ZM68C4N	Altera	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	184.1 MHz				5 mm	Yes	52
EP20K1000EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.32 ns	38400	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm		508
EPM7512BUC169-10N	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 141 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e1	163.9 MHz				11 mm	Yes	141
EPM570GM100C3	Altera	Flash PLD		Ball	100	FBGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B100				No								Yes
EP20K600CF1020I-7	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy	1.6 ns	24320	Yes	1.89 V		CMOS	580	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 588 I/O	4		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			580	220 °C (428 °F)	33 mm		588
EPF10K200SBI356-1X	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V		CMOS		2.5		Grid Array, Low Profile				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPF10K100EFC256-2XN	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		191

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.