Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K100BC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							252
EPM7064BUC49-5	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	303 MHz			220 °C (428 °F)	7 mm	Yes	41
EP20K1000EBI652-2X	Altera	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns	38400	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm		488
EPM7256AFC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	93.5 MHz			220 °C (428 °F)	17 mm	Yes	164
EPF8820ABC225-3	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	27 mm		152
EPF10K50EBI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 254 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							254
EPM7128AEUC169-5	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	192.3 MHz			220 °C (428 °F)	11 mm	Yes	100
EP20K400EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.07 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	27 mm		488
EPF6016AFC100-1	Altera	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS	81	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	172 MHz		81	220 °C (428 °F)	11 mm		81
EP20K400EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.07 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm		488
EPF10K50SFI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9.5 ns	2880	Yes	2.7 V		CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EPF10K100EBC356-2XN	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPF10K50BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs, 310 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2880 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm		310
EPM7512BUI169-10N	Altera	EE PLD		Ball	169	FBGA	Square	Plastic/Epoxy	10 ns		Yes		512	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes			.8 mm					Tin Silver Copper	Bottom	S-PBGA-B169				No		e1						Yes
EPM570GF256C5	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	160
5M570ZF256I5	Altera	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	100 °C (212 °F)	159 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	118.3 MHz				17 mm	Yes	159
EPF10K100EFC256-3N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1			191		17 mm		191
EPM1270F100I3N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPM7128BFC256-7N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		3.5 mm	17 mm	No		e1	243.9 MHz				17 mm	Yes	100
EP20K100EBC356-1X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	238	220 °C (428 °F)	35 mm		246
EP20K1000EFC33-1N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.84 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm		708
EPM570F256C5	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0		20 s		220 °C (428 °F)	17 mm	Yes	160
EP20K200EFC484-3N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.33 ns	8320	Yes	1.89 V		CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz	30 s	368	260 °C (500 °F)	23 mm		376
EPM7256ABI100-12	Altera	EE PLD	Industrial	Ball	100	BGA	Square	Plastic/Epoxy	12 ns		Yes		256	CMOS			2.5/3.3,3.3 V	Grid Array	BGA100,10X10	Programmable Logic Devices	Yes			1.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100				No		e0				220 °C (428 °F)		Yes
EP20K400EBC652-1X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.57 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm		488
EPM7256ABI256-6	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	200 MHz				27 mm		164
EPF10K50EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 254 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							254
EPM2210M100C4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EP20K100FC324-1XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		3.5 mm	19 mm	No		e1					19 mm		252
EPF10K50SFC672-3X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		254
EP20K400CF672C8ES	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		488
EP20K200EFG672ES	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EP20K200FC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	376	220 °C (428 °F)	23 mm		382
EPM240ZM68I7N	Altera	Flash PLD		Ball	68	BGA	Rectangular	Plastic/Epoxy	12 ns		Yes	1.89 V	192	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm		0 Dedicated Inputs	0		Tin Silver Copper	Bottom	R-PBGA-B68				No	It can also operate at 3.3 V	e1						Yes
EP20K100FI784-3	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP1K30FI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	90 MHz				23 mm		171
EP20K200CFI672-9	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EP1K30FC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	171 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	90 MHz	20 s	171	220 °C (428 °F)	17 mm		171
EP20K100BI484-1	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							252
5M80ZM64C4	Altera	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	184.1 MHz				4.5 mm	Yes	30
EP20K100FC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm		252
5M40ZM64I5	Altera	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V				1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	118.3 MHz				4.5 mm		30
EP20K200CB356C7	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.48 ns	8320	Yes	1.89 V		CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.7 mm	35 mm	No		e0			263	220 °C (428 °F)	35 mm		271
EPF6016BI256-3	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	5.5 V		CMOS	204	5	3.3/5,5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	4.5 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	133 MHz		204	220 °C (428 °F)	27 mm		218
EPF10K200SBC356-1	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
EPF8820ABI225-3	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.5 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	27 mm		152
EPM7128AEFI100-5	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	192.3 MHz			220 °C (428 °F)	11 mm	Yes	84
EPF10K130EBI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 413 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							413

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.