Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K100EFC144-3X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.2 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e1	160 MHz			220 °C (428 °F)	13 mm		93
EP20K200CB356C9	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2 ns	8320	Yes	1.89 V		CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.7 mm	35 mm	No		e0			263	220 °C (428 °F)	35 mm		271
EP20K30EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm		128
EP20K300EFI784	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell				4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K200CBC356-8	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EP20K200EBC652XES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EP20K100EFC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1				220 °C (428 °F)	19 mm		252
EP20K600EBI652-2XN	Altera	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	2.25 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm		488
EP20K60EFC144-1	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EPF10K50SFC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EP20K200EBC652-1XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.58 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm		376
EPM7256ABI100-7	Altera	EE PLD	Industrial	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes		256	CMOS			2.5/3.3,3.3 V	Grid Array	BGA100,10X10	Programmable Logic Devices	Yes			1.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100				No		e0				220 °C (428 °F)		Yes
EP20K400FC672-3X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		502
EPF10K100BBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes							Grid Array				Mixed		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP1K50FC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	249 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		30 s	249	260 °C (500 °F)	23 mm		249
5M160ZM100C5N	Altera	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS		1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	79
EP20K1000CF672I-7	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.4 ns	38400	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 508 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			500	220 °C (428 °F)	27 mm		508
EPM2210GF100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EP20K1000CF1020C-9	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V		CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			700	220 °C (428 °F)	33 mm		708
EP20K1000CB652I-7	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.4 ns	38400	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EP20K100BI196-1	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 149 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B196				No		e1							149
EPF10K50EFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	2880 Logic Elements	e1	140 MHz	40 s	254	260 °C (500 °F)	23 mm		254
EP20K200FI484-2V	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 382 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	376	220 °C (428 °F)	23 mm		382
EP1K30FI256	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		171
EP2A40F1020C8	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.78 ns	38400	Yes	1.575 V		CMOS	723	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	735 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			723	220 °C (428 °F)	33 mm		735
EPM570GM256I3	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EP1K10FI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 130 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	90 MHz				23 mm		130
EPM7128ABI256-6	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	128 Macrocells	e1	166.7 MHz				27 mm		100
EPF10K100ABC600-1N	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e1					45 mm		406
EPM2210GF100C3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							0
EPM7064BUC49-3	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	303 MHz			220 °C (428 °F)	7 mm	Yes	41
EP1K10FI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 130 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		130
EPF10K100EBI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
EP20K1500CBI652-7X	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.4 ns		Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		488 I/O			Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		488
EPM1270F100C5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EP20K400CB652C9N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm		488
EPF10K30AFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	1728	Yes	3.6 V		CMOS	246	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz	20 s	246	220 °C (428 °F)	17 mm		191
EPM1270GM256C3	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	6.2 ns		Yes		980	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EPM7128BBC100-10	Altera	EE PLD		Ball	100	BGA	Square	Plastic/Epoxy	10 ns		Yes		128	CMOS			1.8/3.3,2.5 V	Grid Array	BGA100,10X10	Programmable Logic Devices	Yes			1.5 mm					Tin Lead	Bottom	S-PBGA-B100				No		e0				220 °C (428 °F)		Yes
EPM7256AEFC256-7N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	126.6 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
EPM7064BFI100-7N	Altera	EE PLD		Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes		64	CMOS			1.8/3.3,2.5 V	Grid Array	BGA100,10X10,40	Programmable Logic Devices	Yes			1 mm					Tin Silver Copper	Bottom	S-PBGA-B100				No		e1						Yes
EPF10K70BM560-4	Altera	Loadable PLD	Military	Ball	560	BGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V		125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	3744 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz
EPF10K50VBC356-2N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	3.6 V		CMOS	274	3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm		274
EPM7128AFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,50	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	87 MHz			220 °C (428 °F)	17 mm	Yes	100
EPM7064AEFC49-4	Altera	EE PLD	Commercial	Ball	49	FBGA	Square	Plastic/Epoxy	4.5 ns		Yes		64	CMOS			2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EP2A70F1508C9N	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.87 ns		Yes	1.575 V		CMOS		1.5		Grid Array				Macrocell	1.425 V	1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No		e1					40 mm		1060
EPM570GF100I3N	Altera	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	5.4 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 76 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPF10K200SFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.625 V		CMOS	369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	369	260 °C (500 °F)	23 mm		369

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.