Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K100EFI324-2XN	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1				245 °C (473 °F)	19 mm		246
5M240ZM68A5N	Altera	Flash PLD	Industrial	Ball	68	FBGA	Square	Plastic/Epoxy	17.7 ns		Yes		192	CMOS				1.8,1.2/3.3 V	Grid Array, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes			.5 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B68				No								Yes
EPM7128AEFI256-5	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	192.3 MHz			220 °C (428 °F)	17 mm	Yes	100
EP20K160EFC484-2N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V		CMOS		308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz	30 s	308	260 °C (500 °F)	23 mm		316
EP1M120F484C7	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy		4800	Yes	1.89 V		CMOS		303	1.8	1.5/3.3,1.8 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	303	220 °C (428 °F)	23 mm		303
EPM1270GF256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	212
EPF10K200SFI484-3X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		369
EP20K200CB356I-8	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	1.89 V		CMOS		263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			263	220 °C (428 °F)	35 mm		271
EPF10K20BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K160EFI672	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell		1 mm		4 Dedicated Inputs, 324 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		324
EP20K160EBC356-2XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V		CMOS			1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz				35 mm		271
EP20K200CF484I-7	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy	1.6 ns	8320	Yes	1.89 V		CMOS		368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			368	220 °C (428 °F)	23 mm		376
EP20K300EFC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V		CMOS		400	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	400	220 °C (428 °F)	27 mm		408
5M80ZM64A5N	Altera	Flash PLD	Industrial	Ball	64	FBGA	Square	Plastic/Epoxy	14 ns		Yes		64	CMOS	AEC-Q100			1.8,1.2/3.3 V	Grid Array, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes			.5 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B64				No								Yes
EP20K200EBC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							376
EPF10K50SFI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V		CMOS		254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EP20K200EBC356-3	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.33 ns	8320	Yes	1.89 V		CMOS		263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	263	220 °C (428 °F)	35 mm		271
EPM7128AEFI256-12	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	100
EP20K300EBC652XES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		408
EPM7064AEFC100-4N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Low Profile				Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	222.2 MHz			260 °C (500 °F)	11 mm		68
EPF10K100BC560-5	Altera	Loadable PLD	Commercial	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS			5		Grid Array				Registered	4.75 V		70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EPF10K130EBI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 413 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							413
EPF10K30BC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS		246	5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz	20 s	246	220 °C (428 °F)	35 mm		246
EPM2210F324I4	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS				1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B324	3			No		e0				220 °C (428 °F)		Yes
EP20K60EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm		204
EP20K1500EBC652-1X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V		CMOS		480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPM7256AEFC100-7	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	126.6 MHz	20 s		235 °C (455 °F)	11 mm	Yes	84
EPM570M100I3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 76 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							76
EPF6016BI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	5.5 V		CMOS		204	5	3.3/5,5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	4.5 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		204	220 °C (428 °F)	27 mm		218
EPM240M100I3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							80
EP20K200BC356-3N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V		CMOS			2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		277
EPF6016AFC100-2N	Altera	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy			Yes	3.6 V					3.3		Grid Array, Low Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1	153 MHz				11 mm		81
EPF10K40BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K200CFC484-7X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		376
EP20K100EFC324-1XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		246
EPF10K200SBI600-3X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470
EP20K400CB652C7N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm		488
EPM1270F100I5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPF10K30EFC484-2X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS		220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm		220
EPM570F100C3N	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPM2210GM100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EP1K10FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	576	Yes	2.625 V		CMOS		136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 130 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			136	220 °C (428 °F)	17 mm		130
EPF10K30EBC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 176 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		176
EPF10K50EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EP2A40B724C8N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1		40 s		245 °C (473 °F)	35 mm		536
EP20K200BC784-2	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP20K30EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm		128
EP1K100FC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		333	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	333 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	333	220 °C (428 °F)	23 mm		333

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.