Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K40BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EPF10K130EFC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V		CMOS	413	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	413 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	413	220 °C (428 °F)	27 mm		413
EPF10K50SFC484-2N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm		254
EPF10K130EBC672-3	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 413 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							413
EP20K100EFC144-1X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EPF10K30ABC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V		CMOS		3.3		Grid Array, Low Profile				Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e1	80 MHz				35 mm		246
EPF10K130EFI484-2N	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	85 °C (185 °F)	369 I/O		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1		40 s		260 °C (500 °F)	23 mm		369
EP20K200EFC672-3X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.33 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm		376
EPF10K30AFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	3.6 V		CMOS	246	3.3	2.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz	20 s	246	220 °C (428 °F)	23 mm		246
EPF10K30AFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	11 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		246
EPM7512AEBI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V	512	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	512 Macrocells	e0	163.9 MHz	20 s		220 °C (428 °F)	27 mm	Yes	212
EP20K600EFC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm		508
EP20K200FC484-2V	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	34 MHz		376	220 °C (428 °F)	23 mm		382
EPF10K100EFC256-2N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		191
EPM7512BBC256-5N	Altera	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.7 mm	27 mm	No		e1	163.9 MHz				27 mm	Yes	212
EPF10K50EFI672-1	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	8.5 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EPM1270F256C3	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0		20 s		220 °C (428 °F)	17 mm	Yes	212
EPF10K130EBC356-2	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EP20K400CF672I8N	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 488 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1					27 mm		488
EP20K100FC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm		252
EP20K100BI672-1	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							252
EPM2210F100C3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPF10K100BI560-4	Altera	Loadable PLD	Industrial	Ball	560	BGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V		85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz
EPM570M256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EP20K160EFC484-2XN	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.93 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz	40 s		260 °C (500 °F)	23 mm		316
EPF8820BM225-2	Altera	Loadable PLD	Military	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V	1.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		148
EPM7256AEFC100-10N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e1	95.2 MHz	30 s		260 °C (500 °F)	11 mm	Yes	84
EP20K200EFI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy		8320	Yes			CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell		1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1			368	220 °C (428 °F)			376
EPM570GF100C3	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array	BGA100,10X10,40	Programmable Logic Devices	Yes			1 mm						Bottom	S-PBGA-B100				No								Yes
EPF10K100EBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns	4992	Yes	2.7 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
EPF10K100EBI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							338
EPM2210GF324A3N	Altera	Flash PLD	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	It can also operate at 3.3 V	e1					19 mm	Yes	272
EPM3256AFC256-7N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 161 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1					17 mm	Yes	161
EP20K60EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.56 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm		196
EP20K400EFC672-2XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.83 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz	40 s		245 °C (473 °F)	27 mm		488
EP2A70B724C7N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.17 ns		Yes	1.575 V		CMOS		1.5		Grid Array				Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1					35 mm		536
EP20K600CB652I8	Altera	Loadable PLD	Industrial	Ball	652	BGA	Square	Plastic/Epoxy	1.78 ns	24320	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B652		2 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EP20K30EFC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1	160 MHz				27 mm		128
EP20K600EFC672-1XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e1	160 MHz	30 s	500	245 °C (473 °F)	27 mm		508
EP20K60EFC144-1X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EP20K600CB652I-9	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy		24320	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EPM1270M256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPM570GF256I4N	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 160 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1				245 °C (473 °F)	17 mm	Yes	160
EPF10K10AFC484-1	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V				3.3		Grid Array				Mixed	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		1.86 mm	23 mm	No		e1					23 mm		150
EP20K100EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		246
EPF10K200SBC356-1X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.3 ns	9984	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EPM2210F256I4N	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 204 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1				245 °C (473 °F)	17 mm	Yes	204
EP20K100BI356-3X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		252

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.