Ball Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM1270GF100C3N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EP20K1000CF1020I-7	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy	1.4 ns	38400	Yes	1.89 V		CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 708 I/O	4		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			700	220 °C (428 °F)	33 mm		708
EP20K200CF672I-8	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		376
EPF10K50VFC484-4	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	21.1 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 291 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		291
EPM7064BUI49-5N	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	5 ns		Yes		64	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Silver Copper	Bottom	S-PBGA-B49				No		e1						Yes
EPF10K50BC356-5	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns	2880	Yes	5.25 V		CMOS	274	5	3.3/5,5 V	Grid Array, Heat Sink/Slug, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	57.8 MHz		274	220 °C (428 °F)	35 mm		274
EP20K400EFI672-2	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy		16640	Yes			CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell		1 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3			No		e0			480	220 °C (428 °F)			488
EPM1270GF100I5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							0
EP20K200EBC356-2	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	263	220 °C (428 °F)	35 mm		271
EPF10K100EFC672-3X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EP1M120FI484-5	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 303 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		303
EP20K1000EBC652	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1	160 MHz				45 mm		488
EP20K200BC356-2V	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	0.4 ns	8320	Yes	2.625 V		CMOS	271	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 279 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	34 MHz		271	220 °C (428 °F)	35 mm		279
EPF10K200SBC600-3X	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470
5M80ZM64C4N	Altera	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	184.1 MHz				4.5 mm	Yes	30
EP20K200FC784-2	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K400FC672-3V	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.6 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			496	220 °C (428 °F)	27 mm		502
EPM2210GF100C4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							0
EPF10K100ABC356-3N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm		274
EP20K200CBI652-8	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EP20K60EBI356-1	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		2560	Yes	2.625 V		CMOS	188	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 196 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			188	220 °C (428 °F)	35 mm		196
EP20K100EFI324	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell		1 mm		4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1				220 °C (428 °F)	19 mm		252
EPM9560ABI356-10	Altera	EE PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	11.4 ns		Yes	5.5 V	560	CMOS		5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 216 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	560 Macrocells	e0	144.9 MHz			220 °C (428 °F)	35 mm	Yes	216
EP20K200FC484-3N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	3.6 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		30 s	376	260 °C (500 °F)	23 mm		382
EPM7256AFI100-12	Altera	EE PLD	Industrial	Ball	100	BGA	Square	Plastic/Epoxy	12 ns		Yes		256	CMOS			2.5/3.3,3.3 V	Grid Array	BGA100,10X10,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3			No		e0				220 °C (428 °F)		Yes
EPF10K200SBC356-2X	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
EP20K30EFC144-1	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.91 ns	1200	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EP20K100EFC144-3X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.2 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e1	160 MHz			220 °C (428 °F)	13 mm		93
EP20K200CB356C9	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2 ns	8320	Yes	1.89 V		CMOS	263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.7 mm	35 mm	No		e0			263	220 °C (428 °F)	35 mm		271
EP20K30EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm		128
EP20K300EFI784	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell				4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K200CBC356-8	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EP20K200EBC652XES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EP20K100EFC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1				220 °C (428 °F)	19 mm		252
EP20K600EBI652-2XN	Altera	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	2.25 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm		488
EP20K60EFC144-1	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EPF10K50SFC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EP20K200EBC652-1XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.58 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm		376
EPM7256ABI100-7	Altera	EE PLD	Industrial	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes		256	CMOS			2.5/3.3,3.3 V	Grid Array	BGA100,10X10	Programmable Logic Devices	Yes			1.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100				No		e0				220 °C (428 °F)		Yes
EP20K400FC672-3X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		502
EPF10K100BBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes							Grid Array				Mixed		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP1K50FC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	249 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		30 s	249	260 °C (500 °F)	23 mm		249
5M160ZM100C5N	Altera	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS		1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	79
EP20K1000CF672I-7	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.4 ns	38400	Yes	1.89 V		CMOS	500	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 508 I/O	4		Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			500	220 °C (428 °F)	27 mm		508
EPM2210GF100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EP20K1000CF1020C-9	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V		CMOS	700	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			700	220 °C (428 °F)	33 mm		708
EP20K1000CB652I-7	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.4 ns	38400	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EP20K100BI196-1	Altera	Loadable PLD		Ball	196	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 149 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B196				No		e1							149

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.