Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K30ABI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	1.5 ns		Yes	3.6 V				3.3		Grid Array				Mixed	3 V		85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							246
EPM7384AEBC256-12	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	384 Macrocells	e1	100 MHz			220 °C (428 °F)	27 mm		212
EP20K1500CBC652-8X	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	488 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		488
EP20K400FC672-2V	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	34 MHz		496	220 °C (428 °F)	27 mm		502
EPM7256BFI256-10	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	256	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 164 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	94.3 MHz			220 °C (428 °F)	17 mm	Yes	164
EP20K600EFC33-1XN	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.57 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm		588
EP20K100EBI356-3	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		4160	Yes	2.625 V		CMOS	238	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 246 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			238	220 °C (428 °F)	35 mm		246
EP1K30FI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	171 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	171	220 °C (428 °F)	17 mm		171
EPM7064AEFC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	68
EP20K200CFI672-8	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm		376 I/O			Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EPM570ZM144I7N	Altera	Flash PLD		Ball	144	BGA	Rectangular	Plastic/Epoxy	15.1 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA144,13X13,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm		0 Dedicated Inputs	0		Tin Silver Copper	Bottom	R-PBGA-B144				No	It can also operate at 3.3 V	e1						Yes
EP20K600EFI672-2XN	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	2.25 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 508 I/O	4		Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm		508
EPM570GF100C5N	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	11 mm	Yes	76
EPM570GM100I4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 76 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							76
EP20K400EBC652-1	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.57 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm		488
EPM7128BFI100-7N	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1	243.9 MHz				11 mm	Yes	84
EP20K200FI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPF10K30EFI672-2X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		220
EP2A25F1020C9	Altera	Loadable PLD	Commercial	Ball	1020	HBGA	Square	Plastic/Epoxy	2.23 ns		Yes	1.575 V		CMOS		1.5		Grid Array, Heat Sink/Slug				Macrocell	1.425 V	1 mm	70 °C (158 °F)	612 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e0					33 mm		612
EP20K200CF672C-8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		376
EP20K1000CF672C7N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.49 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1					27 mm		508
EPF10K50SFI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.7 V		CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254	220 °C (428 °F)	23 mm		254
EP20K1500CFC1020-7	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	1.4 ns		Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	808 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm		808
EP1M120F484C7AN	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS		1.8		Grid Array				Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				245 °C (473 °F)	23 mm		303
EPM7384AEFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		384	CMOS			2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0				220 °C (428 °F)		Yes
EPM240M100C5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							80
EPM570ZM256A6N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EP20K1000CB652I-8	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 488 I/O	4		Tin Lead	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e0			480	220 °C (428 °F)	45 mm		488
EPM7128ABI100-7	Altera	EE PLD	Industrial	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V		85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100				No	128 Macrocells	e1	166.7 MHz						84
EPF10K30EFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	176 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	176	220 °C (428 °F)	17 mm		176
EPM7256AEFI100-10	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	95.2 MHz			220 °C (428 °F)	11 mm	Yes	84
EP1K50FC484-1N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	249	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	249 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	90 MHz	30 s	249	260 °C (500 °F)	23 mm		249
EP1M120FI484-7A	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 303 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		303
EP20K60EFC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		204
EP20K400CB652C8	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.78 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	2 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm		488
EPM570GF100A4N	Altera	Flash PLD	Automotive	Ball	100	LBGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPM7512BBI256-10N	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		512	CMOS			1.8/3.3,2.5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes			1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EPM2210M100I5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPF10K50SBI356-1	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	8 ns	2880	Yes	2.7 V		CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EP20K100FC324-2XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		3.5 mm	19 mm	No		e1					19 mm		252
EP20K60EFC144-2XN	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e1	160 MHz	30 s	85	260 °C (500 °F)	13 mm		93
EP20K600EFC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		508
EP20K1500EBC652-2X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns	51840	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPM7064AEFC49-10	Altera	EE PLD	Commercial	Ball	49	FBGA	Square	Plastic/Epoxy	10 ns		Yes		64	CMOS			2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EPF10K130EBC356-3N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EP20K1000CB652C9N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1		40 s		245 °C (473 °F)	45 mm		488
EP20K100EFI324-1	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy		4160	Yes			CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell		1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3			No		e0			238	220 °C (428 °F)			246
EPM3128AFI256-10N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 98 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm	Yes	98

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.