Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K400EBC652-2N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.83 ns	16640	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e1		30 s	480	245 °C (473 °F)	45 mm		488
EP20K30EFC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm		128
EP20K160EFC484-1X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.55 ns	6400	Yes	1.89 V		CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	308	220 °C (428 °F)	23 mm		316
EPM570ZM144A7N	Altera	Flash PLD	Automotive	Ball	144	BGA	Rectangular	Plastic/Epoxy	15.1 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA144,13X13,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B144				No	It can also operate at 3.3 V	e1						Yes
EPF10K30BC356-4N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	5.25 V		CMOS		5		Grid Array, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1	62.89 MHz				35 mm		246
EP20K100FI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EPF10K130VBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.7 ns	6656	Yes	3.6 V		CMOS	470	3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K50EBI356-1	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	8.5 ns	2880	Yes	2.7 V		CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 220 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EPM7256BFI256-5N	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes		256	CMOS			1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EPF10K30EFC672-2	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	9.5 ns	1728	Yes	2.7 V		CMOS	220	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			220	220 °C (428 °F)	27 mm		220
EP20K60EBI356-2	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		2560	Yes	2.625 V		CMOS	188	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 196 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			188	220 °C (428 °F)	35 mm		196
EP20K100EBC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							246
EP20K60EFC144-1N	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.72 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm		93
EP20K400FC672-1XV	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		502
EP20K200BC356-1N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		277
EPF10K130EFC672-1N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.3 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	413 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		413
EP20K300EFI672-2X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V		CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0		20 s	400	220 °C (428 °F)	27 mm		408
EP20K60EFC324-3N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.56 ns	2560	Yes	1.89 V		CMOS	188	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	188	260 °C (500 °F)	19 mm		196
EPM2210F256C3	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0		20 s		220 °C (428 °F)	17 mm	Yes	204
EP20K600CB652C7ES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		488
EPF10K30EFI256-2X	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		176
EPM2210M100C4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPF10K200SBC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EPF10K10AFI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		150
EPF10K100EFC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS	338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	338	220 °C (428 °F)	23 mm		338
EP20K100EFC400-2	Altera	Loadable PLD	Other	Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3			No		e0				220 °C (428 °F)
EP20K600CF672I8N	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm		508
EPF10K10AFC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	576	Yes	3.6 V		CMOS	150	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	17 mm		150
EPM240F100I4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							80
EP20K100EFC144-1XN	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm		93
EP20K100EBI356-1X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		4160	Yes	2.625 V		CMOS	238	2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 246 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			238	220 °C (428 °F)	35 mm		246
EPXA4F672C1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 426 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0				220 °C (428 °F)	27 mm		426
EP20K100EFI784-3	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EPM1270M100C4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPM7512BBC256-5	Altera	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	27 mm	No		e0	163.9 MHz			220 °C (428 °F)	27 mm	Yes	212
EPM7064AEFI49-4	Altera	EE PLD	Industrial	Ball	49	FBGA	Square	Plastic/Epoxy	4.5 ns		Yes		64	CMOS			2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EPM7512AEBC256-6	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1	166.7 MHz				27 mm		212
EP20K600EFI784	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell				4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP1K30FC256	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Registered	2.375 V	1 mm	70 °C (158 °F)	6 Dedicated Inputs, 171 I/O	6	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		171
EP20K100EFI484-3	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell				4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B484	3			No		e0				220 °C (428 °F)			246
EPF10K130EBC356-2N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPM240GM100I3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							80
EPM570GF256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	160
EPM7512BBC256-7N	Altera	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.7 mm	27 mm	No		e1	163.9 MHz				27 mm	Yes	212
EPM7512AEFC256-12	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	71.9 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EP20K1500EBC652-1	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPM570GF256I4	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes		440	CMOS			1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0				220 °C (428 °F)		Yes
EPF10K200SFC672-2	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V		CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470	220 °C (428 °F)	27 mm		470

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.