Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K200EBC484-3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							376
EPM570GF100C4N	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPM7128AEFI100-7	Altera	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS	84	PAL-TYPE	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	129.9 MHz	20 s	84	235 °C (455 °F)	11 mm	Yes	84
EP20K60EFC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm		204
EPM7128BFC100-10N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e1	243.9 MHz				11 mm	Yes	84
EPM7256ABC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	256 Macrocells	e1	125 MHz				27 mm		164
EPM7128ALBC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		128	CMOS				2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256				No		e0				220 °C (428 °F)		Yes
EP20K100EBI356-2	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 246 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			238	220 °C (428 °F)	35 mm		246
EPF10K250EBC600-3	Altera	Loadable PLD	Commercial	Ball	600	HBGA	Square	Plastic/Epoxy		12160	Yes	2.7 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
5M80ZM64C5	Altera	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	118.3 MHz				4.5 mm	Yes	30
EPM7064BUI49-5	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	5 ns		Yes		64	CMOS				1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Lead	Bottom	S-PBGA-B49				No		e0				220 °C (428 °F)		Yes
EP20K400BC652-1N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm		502
EP20K400BC652-1VX	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	100 MHz				45 mm		502
EPF10K130EBC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 369 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							369
EPM2210F256I4	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS				1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0				220 °C (428 °F)		Yes
EPM7064AEFI49-7	Altera	EE PLD	Industrial	Ball	49	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		64	CMOS				2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EPM7256AEFI100-12	Altera	EE PLD	Industrial	Ball	100	TBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.1 mm	11 mm	No		e1	100 MHz				11 mm		84
EP20K400FC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS	496		2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	496	220 °C (428 °F)	27 mm		502
EPM2210GF100I5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EPF10K130VBI600-4	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	24.2 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470
EPF10K200SBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns	9984	Yes	2.625 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0		20 s	470	220 °C (428 °F)	45 mm		470
EP20K600EBC652	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array, Low Profile				Macrocell		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm		488
EP20K60EFC144-2X	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V		CMOS	85		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EP20K400CB652C8ES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		488
EPM7256BFC256-5	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	2.625 V	256	CMOS			2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0	188.7 MHz	20 s		220 °C (428 °F)	17 mm	Yes	164
EPF10K130EBC600-2N	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1.27 mm	70 °C (158 °F)	424 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		424
EPM570ZM256I6N	Altera	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm		0 Dedicated Inputs, 160 I/O	0		Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EP20K60EBI356-2X	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		2560	Yes	2.625 V		CMOS	188		2.5	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 196 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1			188	220 °C (428 °F)	35 mm		196
EPM1270M100C3N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EP20K200EFC672-2X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	368		1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	368	220 °C (428 °F)	27 mm		376
EP20K200CF672I-7	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		376
EPM570GM256C5N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3			No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)		Yes	160
EPF10K130EFC672-2N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	413 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		413
EPF10K130EBI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							369
EP20K1000EBC652-2N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz	40 s		245 °C (473 °F)	45 mm		488
EP20K100EBC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							246
EPF10K130EFI672-3X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	413 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		413
EP20K200EBC356-2N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	263		1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	263	260 °C (500 °F)	35 mm		271
EPM240GF100A4N	Altera	Flash PLD	Automotive	Ball	100	LBGA	Square	Plastic/Epoxy	6.1 ns		Yes	1.89 V	192	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	80
5M160ZM68C4	Altera	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e0	184.1 MHz				5 mm	Yes	52
EP20K200EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	368		1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	368	220 °C (428 °F)	23 mm		376
EP20K600CF672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns	24320	Yes	1.89 V		CMOS	500		1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0			500	220 °C (428 °F)	27 mm		508
EPM570GM100C3N	Altera	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	76
EPM1270GF256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	1.89 V	980	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	212
EPF10K50VBC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	3.6 V		CMOS	274		3.3	3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EPF10K30EFC672-3X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		220
EP2A40B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.05 ns	38400	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A25F672I8N	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1 mm		492 I/O			Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm		492

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.