Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM7256EGM883B-15	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	2.625 V	256	CMOS	38535Q/M;38534H;883B		2.5	3.3/5,5 V	Grid Array	PGA192M,17X17	Programmable Logic Devices	No	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 0 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e0	188.7 MHz			220 °C (428 °F)	27 mm	No	0
EPF10K200SFI672-2X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		470
EPM570GM256I4N	Altera	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	7 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm		0 Dedicated Inputs, 160 I/O	0		Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EP20K1500EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.32 ns	51840	Yes	1.89 V		CMOS		480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPF10K100BFI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EP20K400EFI784-1	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Lead	Bottom	S-PBGA-B784	3			No		e0				220 °C (428 °F)
EPF10K130EBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns	6656	Yes	2.625 V		CMOS		424	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	424 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm		424
EPM570ZM100A7N	Altera	Flash PLD	Automotive	Ball	100	BGA	Square	Plastic/Epoxy	15.1 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	76
5M570ZF256C4	Altera	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	184.1 MHz				17 mm	Yes	159
EPF10K100EFC256-1N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		191
EP2A15B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	16640	Yes	1.575 V		CMOS		480	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			480	220 °C (428 °F)	35 mm		492
EPM2210GF256I5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 204 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	204
EPM240M100A3N	Altera	Flash PLD	Automotive	Ball	100	BGA	Square	Plastic/Epoxy	4.7 ns		Yes	2.625 V	192	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	80
EP20K100FI400-1	Altera	Loadable PLD		Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EPM7512BBC256-7	Altera	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	27 mm	No		e0	163.9 MHz			220 °C (428 °F)	27 mm	Yes	212
EP20K600CB652C9N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm		488
EP20K100EBC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							246
EPF6016AFI100-1	Altera	Loadable PLD		Ball	100	LBGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS		81	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm		4 Dedicated Inputs, 81 I/O	4		Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	172 MHz		81	220 °C (428 °F)	11 mm		81
EP20K1500EFC33-2	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.13 ns	51840	Yes	1.89 V		CMOS		800	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	5A	3.5 mm	33 mm	No		e0		20 s	800	220 °C (428 °F)	33 mm		808
EPM9320ABC356-7	Altera	EE PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	8.2 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Grid Array, Heat Sink/Slug, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 484 Flip Flops; 20 Labs; Configurable I/O operation with 3.3 V or 5 V	e0				220 °C (428 °F)	35 mm	Yes	168
EPM7128AEFC100-10N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e1	98 MHz	30 s		260 °C (500 °F)	11 mm	Yes	84
EP2A15B724C8N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1		40 s		245 °C (473 °F)	35 mm		492
EPF10K200EBI672-2	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							470
EP1K50FI256	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		186
EPM2210GM100C5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							0
EP20K200EBC356-3N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.33 ns		Yes	1.89 V		CMOS			1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EPM570M100I4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 76 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							76
EPM7128BUI49-7N	Altera	EE PLD	Industrial	Ball	49	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		128	CMOS				1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B49				No		e1						Yes
EP20K60EBC356-3X	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.56 ns		Yes	1.89 V		CMOS			1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1	160 MHz			220 °C (428 °F)	35 mm		196
EPF10K130EBI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							369
EP20K100EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS		238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	238	220 °C (428 °F)	19 mm		246
EP20K1500CBI652-7	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.4 ns		Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		488 I/O			Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		488
EP20K300EFC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		408
EPF10K100ABI600-3	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	17 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 406 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		406
EP1K100FI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9 ns	4992	Yes	2.625 V		CMOS		333	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	90 MHz		333	220 °C (428 °F)	17 mm		186
EPM7128BUC49-4N	Altera	EE PLD	Commercial	Ball	49	FBGA	Square	Plastic/Epoxy	4 ns		Yes		128	CMOS				1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B49				No		e1						Yes
EP20K400BC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							502
EP20K600EFC672-2XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.25 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz	40 s		245 °C (473 °F)	27 mm		508
EPM7256AFI256-6	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	156.3 MHz			220 °C (428 °F)	17 mm	Yes	164
EP20K400FC672-1V	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS		496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	100 MHz		496	220 °C (428 °F)	27 mm		502
EPF10K200SFC672-3	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.8 ns	9984	Yes	2.625 V		CMOS		470	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			470	220 °C (428 °F)	27 mm		470
EPF10K50SFC484-3X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		254
EP20K30EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm		128
EP20K1000EBC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.13 ns	38400	Yes	1.89 V		CMOS		480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPF10K30ABI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	13 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Low Profile				Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		246
EPF10K200SFC672-3N	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		470
EPF10K130EBC672-1	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		70 °C (158 °F)	4 Dedicated Inputs, 413 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							413
EPM7128AEFI100-12	Altera	EE PLD	Industrial	Ball	100	TBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.1 mm	11 mm	No		e0	100 MHz			220 °C (428 °F)	11 mm	Yes	84

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.