Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K400CB652C7N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		2 mm	45 mm	No		e1					45 mm		488
EPM1270F100I5N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1							0
EPF10K30EFC484-2X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS		220	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	220 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			220	220 °C (428 °F)	23 mm		220
EPM570F100C3N	Altera	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPM2210GM100I4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EP1K10FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	576	Yes	2.625 V		CMOS		136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 130 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			136	220 °C (428 °F)	17 mm		130
EPF10K30EBC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 176 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		176
EPF10K50EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EP2A40B724C8N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1		40 s		245 °C (473 °F)	35 mm		536
EP20K200BC784-2	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784				No		e1
EP20K30EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm		128
EP1K100FC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		333	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	333 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	333	220 °C (428 °F)	23 mm		333
EP20K200CFC672-8X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EPM7128AEFC100-7N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e1	129.9 MHz	30 s		260 °C (500 °F)	11 mm	Yes	84
EPF10K70BC560-5	Altera	Loadable PLD	Commercial	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS			5		Grid Array				Registered	4.75 V		70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	3744 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EPM1270GF100C4N	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 0 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100				No		e1							0
EPM7256AEFC256-5N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	172.4 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
EP20K200EBC356	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array, Low Profile				Macrocell		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 273 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		273
5M240ZM100C4	Altera	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e0	184.1 MHz				6 mm	Yes	79
EPM2210F100C5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EP1K100FC256	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Registered	2.375 V	1 mm	70 °C (158 °F)	6 Dedicated Inputs, 186 I/O	6	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		186
EPF10K130EBI356-1	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V		CMOS		274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			274	220 °C (428 °F)	35 mm		274
5M80ZM68C4N	Altera	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	184.1 MHz				5 mm	Yes	52
EP20K200BC356	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 279 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		279
EPF10K50SFC484-3	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS		254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	254	220 °C (428 °F)	23 mm		254
EP1K10FC256-3N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns	576	Yes	2.625 V		CMOS		136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	136 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1		30 s	136	260 °C (500 °F)	17 mm		136
EP1M120FC484-5	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		303
EPM1270F256A5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		980	CMOS				1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EP20K400EFC672-2N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.83 ns	16640	Yes	1.89 V		CMOS		480	1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz	30 s	480	245 °C (473 °F)	27 mm		488
EPF10K30BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EPM7256AFI256-12	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	78.1 MHz			220 °C (428 °F)	17 mm	Yes	164
EPF10K50EBI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS		220	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 220 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			220	220 °C (428 °F)	35 mm		220
EPF10K40BC356-4	Altera	Loadable PLD	Commercial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.25 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP1K10FI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	576	Yes	2.625 V		CMOS		136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	136 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	136	220 °C (428 °F)	17 mm		136
EP20K300EBC652-2XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	160 MHz				45 mm		408
5M240ZM68I5N	Altera	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
EPM7064AEFC49-7	Altera	EE PLD	Commercial	Ball	49	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes		64	CMOS				2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49	3			No		e0				220 °C (428 °F)		Yes
EPM570GM256I5	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	8.7 ns		Yes		440	CMOS				1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EPM7128BFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS			2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0	243.9 MHz	20 s		220 °C (428 °F)	17 mm	Yes	100
EP20K160EFC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 324 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm		324
EPM7256EWM883B-15	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	2.625 V	256	CMOS	38535Q/M;38534H;883B		2.5	3.3/5,5 V	Grid Array	QFP208,1.2SQ,20	Programmable Logic Devices	No	Macrocell	2.375 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 0 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e0	188.7 MHz			220 °C (428 °F)	27 mm	No	0
EPF10K100EFC672-1X	Altera	Loadable PLD	Commercial	Ball	672	BGA	Square	Plastic/Epoxy	9 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EPF10K200SFC484-3X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.8 ns		Yes	2.625 V		CMOS			2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		369
EPF10K130EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 369 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							369
EPM7064AEUI49-10	Altera	EE PLD	Industrial	Ball	49	FBGA	Square	Plastic/Epoxy	10 ns		Yes		64	CMOS				2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B49				No		e0				220 °C (428 °F)		Yes
EP20K60EFC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		204
EP20K1500EFC1020-2	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy		51840	Yes	2.625 V		CMOS		808	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		808	220 °C (428 °F)	33 mm		808
5M160ZM100C4N	Altera	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	184.1 MHz				6 mm	Yes	79

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.