Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM7128BFC100-7	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	243.9 MHz	20 s		235 °C (455 °F)	11 mm	Yes	84
EPM7256BUI169-10	Altera	EE PLD		Ball	169	FBGA	Square	Plastic/Epoxy	10 ns		Yes		256	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes			.8 mm					Tin Lead	Bottom	S-PBGA-B169				No		e0				220 °C (428 °F)		Yes
EP20K600EFC1020-3X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	0.5 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Heat Sink/Slug				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1	160 MHz				33 mm		588
EPM7064BFC256	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 68 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		68
EP20K400FC672-2XV	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0				220 °C (428 °F)	27 mm		502
EPF10K70BI560-4	Altera	Loadable PLD	Industrial	Ball	560	BGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V		85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	3744 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz
EP20K1500CFC1020-8X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	808 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm		808
EP1M120F484C5N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS		1.8		Grid Array				Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				245 °C (473 °F)	23 mm		303
EPM240GM100C4ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No		e0							80
EPM2210M100C5ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 0 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							0
EPF10K100EBC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0		20 s	274	220 °C (428 °F)	35 mm		274
EP20K100EBC356-2XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		246
EPM7128BUC169-4N	Altera	EE PLD	Commercial	Ball	169	FBGA	Square	Plastic/Epoxy	4 ns		Yes		128	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes			.8 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169				No		e1						Yes
EPM3128AFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 98 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	98
EPF10K50EBC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP20K1500CF1020I-9	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 808 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1				220 °C (428 °F)	33 mm		808
EP20K100EFI324-2N	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 246 I/O	4		Tin/Silver/Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e1		30 s	238	260 °C (500 °F)	19 mm		246
EP20K200CFC484-8	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		376
EPF10K30BI356-5	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EPM7064AEFC100-10N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	100 MHz	30 s		260 °C (500 °F)	11 mm	Yes	68
EPM7064BUC49-3N	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e1	303 MHz				7 mm	Yes	41
EP2A25F672C8N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns		Yes	1.575 V		CMOS		1.5		Grid Array				Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm		492
EP1K100FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16 ns	4992	Yes	2.625 V		CMOS	333	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			333	220 °C (428 °F)	17 mm		186
EPF10K100EBC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	274	2.5	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Mixed	2.375 V	1.27 mm	70 °C (158 °F)	274 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1			274		35 mm		274
EP2A15B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			480	220 °C (428 °F)	35 mm		492
EPF10K30EFI256-3X	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		176
EPM7032BUI49-3N	Altera	EE PLD		Ball	49	FBGA	Square	Plastic/Epoxy	3.5 ns		Yes		32	CMOS			1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes			.8 mm					Tin Silver Copper	Bottom	S-PBGA-B49				No		e1						Yes
EP20K60EFC324-2XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.41 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		196
EPF10K30ABI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V		CMOS	246	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz		246	220 °C (428 °F)	35 mm		246
EPM7128AEFI256-12	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	100
EP20K300EBC652XES	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		408
EPM7064AEFC100-4N	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V		CMOS		3.3		Grid Array, Low Profile				Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	222.2 MHz			260 °C (500 °F)	11 mm		68
EPF10K100BC560-5	Altera	Loadable PLD	Commercial	Ball	560	BGA	Square	Plastic/Epoxy	27 ns		Yes	5.25 V		CMOS		5		Grid Array				Registered	4.75 V		70 °C (158 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560				No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz
EPF10K130EBI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 413 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							413
EPF10K30BC356-3	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	246	5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	4.75 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	66.67 MHz	20 s	246	220 °C (428 °F)	35 mm		246
EPM2210F324I4	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS			1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B324	3			No		e0				220 °C (428 °F)		Yes
EP20K60EFC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1	160 MHz			220 °C (428 °F)	27 mm		204
EP20K1500EBC652-1X	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V		CMOS	480	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	5A	3.5 mm	45 mm	No		e0	160 MHz	20 s	480	220 °C (428 °F)	45 mm		488
EPM7256AEFC100-7	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	126.6 MHz	20 s		235 °C (455 °F)	11 mm	Yes	84
EPM570M100I3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 76 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							76
EPF6016BI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	5.5 V		CMOS	204	5	3.3/5,5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	4.5 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		204	220 °C (428 °F)	27 mm		218
EPM240M100I3ES	Altera	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V			0 Dedicated Inputs, 80 I/O	0		Tin Lead	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e0							80
EP20K200BC356-3N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V		CMOS		2.5		Grid Array, Low Profile				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 277 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		277
EPF6016AFC100-2N	Altera	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Grid Array, Low Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1	153 MHz				11 mm		81
EPF10K40BI356-4	Altera	Loadable PLD	Industrial	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS		5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	2304 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
EP20K200CFC484-7X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		376
EP20K100EFC324-1XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		246
EPF10K200SBI600-3X	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS		2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	470 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e1					45 mm		470

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.