Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K300EFC672XES	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		408
EPF10K100EFC484-3N	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.7 ns	4992	Yes	2.625 V		CMOS		338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	338 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	338	260 °C (500 °F)	23 mm		338
EP2A15F672I8	Altera	Loadable PLD		Ball	672	BGA	Square	Plastic/Epoxy	1.94 ns	16640	Yes	1.575 V		CMOS		480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm		492 I/O			Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm		492
EPF10K10BM356-5	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	53.76 MHz				35 mm
EPF10K250EBI600-3	Altera	Loadable PLD	Industrial	Ball	600	HBGA	Square	Plastic/Epoxy		12160	Yes	2.7 V		CMOS		470	2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EP20K600EFC1020-2X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy	0.4 ns	24320	Yes	2.625 V		CMOS		588	2.5	1.8,2.5,3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0	160 MHz		588	220 °C (428 °F)	33 mm		588
EP20K160EBI356	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array, Low Profile				Macrocell		1.27 mm		4 Dedicated Inputs, 273 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		273
EPM7256BFI100	Altera	EE PLD		Ball	100	LBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS			2.5		Grid Array, Low Profile				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 84 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No		e1					11 mm		84
EP2A40B724C9N	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.05 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e1		40 s		245 °C (473 °F)	35 mm		536
EP20K400BC652-2V	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS		496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	34 MHz		496	220 °C (428 °F)	45 mm		502
EPM7128ABI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	128 Macrocells	e1	125 MHz				27 mm		100
EPF10K100ABC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS		406	3.3	2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600	3	1.93 mm	45 mm	No		e0		20 s	406	220 °C (428 °F)	45 mm		406
EPF10K100EFI484-2N	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		338	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	338	260 °C (500 °F)	23 mm		338
EPM7256BFI256-10N	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		256	CMOS				1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EP20K200CB356I-9	Altera	Loadable PLD		Ball	356	LBGA	Square	Plastic/Epoxy		8320	Yes	1.89 V		CMOS		263	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 271 I/O	4		Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e0			263	220 °C (428 °F)	35 mm		271
EP20K200CB652I-7	Altera	Loadable PLD		Ball	652	LBGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm		4 Dedicated Inputs, 376 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1				220 °C (428 °F)	45 mm		376
EPF10K100ABC356-1N	Altera	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns	4992	Yes	3.6 V		CMOS		274	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1		30 s	274	260 °C (500 °F)	35 mm		274
EPF6024ABC256-1N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V					3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 218 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Can Also Be Used 24000 Logic Gates	e1	172 MHz				27 mm		218
5M2210ZF324A5N	Altera	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes		1700	CMOS	AEC-Q100			1.8,1.2/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324				No								Yes
EPM7512BFI256-6	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	2.625 V	512	CMOS			2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 212 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	147.1 MHz			220 °C (428 °F)	17 mm	Yes	212
EPF10K100EFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	191	220 °C (428 °F)	17 mm		191
EP20K400FI784-3	Altera	Loadable PLD		Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs	4		Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K100EBC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes						1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							246
EP20K200BI484-2	Altera	Loadable PLD		Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 382 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							382
EPM1270GM256I5	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	10 ns		Yes		980	CMOS				1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EP20K1000CF1020I-8	Altera	Loadable PLD		Ball	1020	HBGA	Square	Plastic/Epoxy		38400	Yes	1.89 V		CMOS		700	1.8	1.8,1.8/3.3 V	Grid Array, Heat Sink/Slug	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 708 I/O	4		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			700	220 °C (428 °F)	33 mm		708
EPF10K10BM356-4	Altera	Loadable PLD	Military	Ball	356	HLBGA	Square	Plastic/Epoxy	23.8 ns		Yes	5.5 V		CMOS			5		Grid Array, Heat Sink/Slug, Low Profile				Registered	4.5 V	1.27 mm	125 °C (257 °F)	4 Dedicated Inputs	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	576 Logic elements Configurable I/O operation with 3.3 V or 5 V	e1	60.6 MHz				35 mm
5M240ZM68I5	Altera	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e0	118.3 MHz				5 mm	Yes	52
EPF10K10ABI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EPM7256AEFI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	126.6 MHz	20 s		220 °C (428 °F)	17 mm	Yes	164
EP2A25F672C9N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.23 ns		Yes	1.575 V		CMOS			1.5		Grid Array				Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1		40 s		245 °C (473 °F)	27 mm		492
EPM240ZM100A7N	Altera	Flash PLD	Automotive	Ball	100	BGA	Square	Plastic/Epoxy	12 ns		Yes	1.89 V	192	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100				No	It can also operate at 3.3 V	e1						Yes	80
EPM570F100I3N	Altera	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 76 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B100		1.7 mm	11 mm	No	It can also operate at 3.3 V	e1					11 mm	Yes	76
EPF10K10AFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		1.86 mm	23 mm	No		e1					23 mm		150
EPF10K30EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V		CMOS		176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm		176
EPF10K130EBI600-1	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V		CMOS		424	2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V	1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm		424
EPF10K100EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							338
EP2A40F672C9	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.05 ns	38400	Yes	1.575 V		CMOS		480	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			480	220 °C (428 °F)	27 mm		492
EP20K200EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V		CMOS		368	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	368	220 °C (428 °F)	23 mm		376
EPM570GF256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	160
EPF6016AFC256-3	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS		171	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	133 MHz	20 s	171	220 °C (428 °F)	17 mm		171
EPF10K200EBI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V		85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							470
EPM9320BC356-20	Altera	EE PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	23 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	35 mm	Yes	168
EPF10K130EFC484-1X	Altera	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V		CMOS		369	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			369	220 °C (428 °F)	23 mm		369
EP20K200CFC672-7	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.6 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EP20K300EFC672-1XN	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.68 ns		Yes	1.89 V		CMOS			1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	160 MHz			245 °C (473 °F)	27 mm		408
EPM7128BFI256-10N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		128	CMOS				1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EP20K100EFI144-2XN	Altera	Loadable PLD		Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS			1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 93 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1					13 mm		93

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.