Ball Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC73144-7BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	18 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	83.3 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XCR3512XL-10FGG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 260 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	97 MHz	30 s		250 °C (482 °F)	23 mm	Yes	260
XC9572XL-7CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e1	125 MHz	30 s	38	260 °C (500 °F)	7 mm	Yes	38
XCR3256XL-12CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	88 MHz	30 s		240 °C (464 °F)	16 mm	Yes	164
XCR3256XL-12CSG280C	Xilinx	EE PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS				3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	88 MHz	30 s		260 °C (500 °F)	16 mm	Yes	164
XC2C32-6CP56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 33 I/O	1	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	6 mm	Yes	33
XC2C384-6FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	384	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0		30 s		225 °C (437 °F)	17 mm	Yes	212
XC2C384-7FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	384	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	112 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XCR3064XL-10CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	7 mm	Yes	40
XC95288XL-10BG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC9536XV-3CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Grid Array, Fine Pitch				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0					7 mm		36
XC2C32A-3CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	3 ns	Yes	1.9 V		CMOS				1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V	.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	500 MHz				6 mm		33
XC2C512-10FG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 270 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	91 MHz	30 s	270	225 °C (437 °F)	23 mm	Yes	270
XC73144-10BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	22 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73144-15WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.5 V	144	CMOS				5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 120 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		45.5 MHz					No	120
XC95288XV-5FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns	Yes	2.62 V						2.5		Grid Array				Macrocell	2.37 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	222 MHz				17 mm		192
XC95288-20BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	288	CMOS				5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC2C384-10FG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 240 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s	240	225 °C (437 °F)	23 mm	Yes	240
XC2C384-6FG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	384	CMOS				1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0		30 s		225 °C (437 °F)	23 mm	Yes	240
XCR3256XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	88 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XC2C64-5CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	6 mm	Yes	45
XCR3256XL-10CSG280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	105 MHz	30 s		260 °C (500 °F)	16 mm	Yes	164
XC9572XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	100 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XC95144XL-7CSG144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS		117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
XC9536-7CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	83.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	34
XC2C64-4CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Fast Zero Power Design Technology	e0		30 s		240 °C (464 °F)	6 mm	Yes	45
XC73144-12BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC95288-15BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	55.6 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95288XL-10CSG280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XC9572XV-7CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	125 MHz	30 s		260 °C (500 °F)	7 mm	Yes	38
XCR3320-8BG256I	Xilinx	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8.5 ns	Yes	3.6 V	320	CMOS				3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 3 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
XC9536XV-3CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Grid Array, Fine Pitch				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1					7 mm		36
XC95288XL-10BG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XCR3384XL-7FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	384	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	135 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95288XV-7CS280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	16 mm	Yes	192
XC95288-20BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS				5		Grid Array, Low Profile				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	50 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95288XL-10CSG280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XCR3032XL-5CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Fine Pitch				Macrocell	2.7 V	.8 mm	85 °C (185 °F)	32 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	200 MHz	30 s		260 °C (500 °F)	7 mm		32
XA95144XL-15CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	BGA	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS				3.3		Grid Array				Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1		30 s		260 °C (500 °F)	12 mm		117
XA2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XC95288XL-6BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Low Profile				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e1	151.5 MHz	30 s		260 °C (500 °F)	35 mm		192
XC9572XL-10CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	100 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XC95288XL-10BGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	100 MHz	30 s	192	250 °C (482 °F)	27 mm	Yes	192
XC9536XV-3CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Grid Array, Fine Pitch				Registered	2.4 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1					7 mm		36
XC9572XL-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	125 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XC9536XV-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC9536XV-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC2C384-7FGG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	112 MHz	30 s	240	250 °C (482 °F)	23 mm	Yes	240

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.