Ball Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7512BBC256-6

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

0 Dedicated Inputs, 212 I/O

0

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e0

147.1 MHz

220 °C (428 °F)

27 mm

Yes

212

EPF10K200SBC356-3N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.8 ns

Yes

2.625 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

274 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

274

EPM570M100C3N

Altera

Flash PLD

Other

Ball

100

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 76 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

76

EPM7256EGM883B-20

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

38535Q/M;38534H;883B

2.5

3.3/5,5 V

Grid Array

PGA192M,17X17

Programmable Logic Devices

No

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 0 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e0

188.7 MHz

220 °C (428 °F)

27 mm

No

0

EP1K100FC484-2N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

333 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

37.5 MHz

30 s

333

260 °C (500 °F)

23 mm

333

EP1K50FI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

2880

Yes

2.625 V

CMOS

249

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 249 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

90 MHz

249

220 °C (428 °F)

23 mm

249

EPF10K50EBC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 254 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

254

EPF6016AFC100-3

Altera

Loadable PLD

Other

Ball

100

LBGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

81

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 81 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e0

133 MHz

20 s

81

235 °C (455 °F)

11 mm

81

EPF10K50BC356-4N

Altera

Loadable PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

0.6 ns

Yes

5.25 V

CMOS

5

Grid Array, Low Profile

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 274 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e1

62.89 MHz

35 mm

274

EPM240F100I3N

Altera

Flash PLD

Ball

100

LBGA

Square

Plastic/Epoxy

4.7 ns

Yes

2.625 V

192

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 80 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

11 mm

Yes

80

EPF6024AFI256-1

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 219 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

172 MHz

219

220 °C (428 °F)

17 mm

219

EPM7512BUC169-5N

Altera

EE PLD

Commercial

Ball

169

LFBGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

Programmable Logic Devices

Yes

Macrocell

2.375 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 141 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

1.55 mm

11 mm

No

e1

163.9 MHz

11 mm

Yes

141

EPM7256AEFI100-7N

Altera

EE PLD

Industrial

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

e1

126.6 MHz

30 s

260 °C (500 °F)

11 mm

Yes

84

EP20K400EBI652-2X

Altera

Loadable PLD

Ball

652

BGA

Square

Plastic/Epoxy

1.83 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

4 Dedicated Inputs, 488 I/O

4

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

20 s

480

220 °C (428 °F)

45 mm

488

EP1K100FI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

186 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

186

220 °C (428 °F)

17 mm

186

EPM3128AFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPM2210GF324I3

Altera

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B324

3

No

e0

220 °C (428 °F)

Yes

EPF6024ABC256-2N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 218 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Can Also Be Used 24000 Logic Gates

e1

153 MHz

27 mm

218

EPM7384AEBI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

384 Macrocells

e1

125 MHz

27 mm

212

EP1M120F484I6N

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

0 Dedicated Inputs, 303 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

303

EP20K300EFC672ES

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

408

EPF10K100ABI356-2

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

3.6 V

CMOS

274

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 274 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

3

1.63 mm

35 mm

No

e0

20 s

274

220 °C (428 °F)

35 mm

274

EPF10K30EFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

220

220 °C (428 °F)

23 mm

220

EPM7512AEBC256-12N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

163.9 MHz

40 s

260 °C (500 °F)

27 mm

212

EP20K400CF672C7ES

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.4 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

488

EP20K200EFI672-2X

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

368

220 °C (428 °F)

27 mm

376

EP20K1500EFC1020-3

Altera

Loadable PLD

Other

Ball

1020

HBGA

Square

Plastic/Epoxy

51840

Yes

2.625 V

CMOS

808

2.5

1.8,2.5,3.3 V

Grid Array, Heat Sink/Slug

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 808 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

160 MHz

808

220 °C (428 °F)

33 mm

808

EPM3512AFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 208 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

208

EP20K100FC196-3

Altera

Loadable PLD

Other

Ball

196

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

2.1 mm

15 mm

No

e1

220 °C (428 °F)

15 mm

EPF10K100BFI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

14.5 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EP20K400EFC672-3X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.07 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

488

EPM7064AEFI256-4

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 68 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

222.2 MHz

220 °C (428 °F)

17 mm

Yes

68

EP20K200BI356-3

Altera

Loadable PLD

Ball

356

LBGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

271

2.5

2.5,2.5/3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 277 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

271

220 °C (428 °F)

35 mm

277

EP20K400EFC672-1XN

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.57 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

30 s

480

245 °C (473 °F)

27 mm

488

EPF10K30EFI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220

220 °C (428 °F)

27 mm

220

EP20K100EFC144-1N

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

1.73 ns

Yes

1.89 V

CMOS

1.8

Grid Array, Low Profile

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

1.7 mm

13 mm

No

e1

160 MHz

13 mm

93

EP20K1500EFC33-1

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.84 ns

51840

Yes

1.89 V

CMOS

800

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 808 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

5A

3.5 mm

33 mm

No

e0

20 s

800

220 °C (428 °F)

33 mm

808

EPF10K50SBI356-3X

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array, Low Profile

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

e1

35 mm

220

EP1K10FC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

136 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

37.5 MHz

30 s

136

260 °C (500 °F)

17 mm

136

EPM7064BUC49-5N

Altera

EE PLD

Commercial

Ball

49

LFBGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile, Fine Pitch

BGA49,7X7,32

Programmable Logic Devices

Yes

Macrocell

2.375 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 41 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1.55 mm

7 mm

No

e1

303 MHz

7 mm

Yes

41

EPM1270GF100C5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EPM2210F100I4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

0

EPF10K30AFI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

17 ns

1728

Yes

3.6 V

CMOS

191

3.3

3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

191

220 °C (428 °F)

17 mm

191

EP20K200FC484-2X

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

376

220 °C (428 °F)

23 mm

382

EPM570F100A3N

Altera

Flash PLD

Automotive

Ball

100

LBGA

Square

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

11 mm

Yes

76

EP20K300EBC652-3X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

3.06 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

220 °C (428 °F)

45 mm

408

EPM2210GF100I3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EP20K60EFC324-2X

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.41 ns

2560

Yes

1.89 V

CMOS

188

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

188

220 °C (428 °F)

19 mm

196

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.